JPS601399B2 - Dummy cathode for electrolytic treatment of metals - Google Patents
Dummy cathode for electrolytic treatment of metalsInfo
- Publication number
- JPS601399B2 JPS601399B2 JP10262177A JP10262177A JPS601399B2 JP S601399 B2 JPS601399 B2 JP S601399B2 JP 10262177 A JP10262177 A JP 10262177A JP 10262177 A JP10262177 A JP 10262177A JP S601399 B2 JPS601399 B2 JP S601399B2
- Authority
- JP
- Japan
- Prior art keywords
- plated
- cathode
- plating
- dummy
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 title description 17
- 239000002184 metal Substances 0.000 title description 17
- 150000002739 metals Chemical class 0.000 title 1
- 239000012777 electrically insulating material Substances 0.000 claims description 3
- 239000003014 ion exchange membrane Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 41
- 229910000831 Steel Inorganic materials 0.000 description 13
- 239000010959 steel Substances 0.000 description 13
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 8
- 239000003011 anion exchange membrane Substances 0.000 description 8
- 229910052725 zinc Inorganic materials 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000221035 Santalaceae Species 0.000 description 1
- 235000008632 Santalum album Nutrition 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
この発明は金属の電解処理、例えば電解処理による金属
の片面被覆に使用するダミー陰極に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dummy cathode used for electrolytic treatment of metal, for example, coating one side of metal by electrolytic treatment.
金属条帯、例えば鋼ストリップに亜鉛等の片面電気メッ
キを行う場合、メッキされない側の陽極を除去した状態
で片面メッキが行なわれる。When a metal strip, for example a steel strip, is single-sided electroplated with zinc or the like, the single-sided plating is carried out with the anode on the non-plated side removed.
しかして、電気メッキ液の電導によってメッキ面に対向
して配置されている陽極からの電流が反対側のメッキし
ない面まで廻り込み、片面メッキ鋼板としては許容出来
ない量のメッキ金属が析出する、特に板のエッヂ部より
中央部に向って板中の約1′4〜1′3部位でのメッキ
量は多く、メッキ後、電解剥離あるいは研磨等の方法に
より裏面に付着したメッキ金属を剥離する必要がある。
この様な両側緑部にオーバーコートを有するメッキ製品
或は非メッキ面まで廻り込みメッキのあるメッキ製品は
例えば自動車用等の使用に対しては好ましくなく、側緑
部への不要なメッキ金属の付着或は非メッキ面への廻り
込みメッキを極力防止することが要求される。このため
に金属等の片面メッキ等においてメッキ電流が非メッキ
面へ廻り込むのを防止すべ〈、被メッキ金属板の側方に
補助陰極を配置して非メッキ面へ廻り込もうとする電流
を捕捉吸収する方法、或は絶縁体を被メッキ板の前面側
方部に被メッキ板と陽極との間に介在配置しメッキ電流
が被メッキ板の側方を通って非メッキ面側に廻り込むの
を遮断する方法等が知られている。However, due to the conduction of the electroplating solution, the current from the anode placed opposite the plated surface circulates to the opposite unplated surface, and an amount of plated metal that is unacceptable for a single-sided plated steel sheet is deposited. Particularly, the amount of plating is large in the 1'4 to 1'3 area of the board towards the center from the edge of the board, and after plating, the plated metal attached to the back side must be removed by electrolytic stripping or polishing. There is a need.
Plated products with an overcoat on the green parts on both sides, or plated products with plating that goes around to the non-plated surface, are not suitable for use in automobiles, for example, and unnecessary plating metal on the green parts of the sides is undesirable. It is required to prevent plating from adhering to or passing around to non-plated surfaces as much as possible. For this reason, in single-sided plating of metal etc., it is necessary to prevent the plating current from going around to the non-plated surface. A method of capturing and absorbing the plating current, or placing an insulator between the plated plate and the anode on the front side of the plated plate so that the plating current passes through the side of the plated plate and goes around to the non-plated side. There are known methods for blocking this.
しかしながら、これ等公知のメッキ電流廻り込み防止手
段においては作業性等に多くの問題点がある。However, these known plating current leak prevention means have many problems in terms of workability and the like.
例えば補助陰極を用いる方法においては陰極面における
メッキ金属の析出が避けられず、デンドラィト状析出物
がメッキ液中に入ってストリップ面に癖をつける等の悪
影響を生じ長期間の使用に耐えず作業性が悪くなる。一
方、絶縁板でメッキ電流を遮断する方法では絶縁体を被
メッキ体に近接させる程、非メッキ面へのメッキ電流の
廻り込みを防止する効果は大きいが被メッキ体の振動、
又は一般にゥオークと呼ばれる被メッキ体の横こりによ
って絶縁体が傷つけられることが多く、従って、メッキ
電流の非メッキ面への廻り込み防止を狙って前記絶縁体
を被メッキ体へ接近させて設けることが出来ず、このた
め或程度被メッキ体から離して設魔せざるを得なかった
。本発明は上記の如き公知の手段における問題点をなく
した作業性のよいメッキ電流の廻り込み防止用ダミー電
極を提供することを目的になされたものであって、以下
、図面を参照しつつ本発明について詳細に述べる。For example, in the method using an auxiliary cathode, precipitation of the plating metal on the cathode surface is unavoidable, and dendrite-like precipitates enter the plating solution and cause adverse effects such as forming curls on the strip surface, making it difficult to withstand long-term use. Sexuality becomes worse. On the other hand, with the method of blocking the plating current with an insulating plate, the closer the insulator is to the plated object, the greater the effect of preventing the plating current from going around to the non-plated surface, but the vibration of the plated object
Alternatively, the insulator is often damaged by the sideways movement of the object to be plated, which is generally called walk. Therefore, the insulator is provided close to the object to be plated in order to prevent the plating current from flowing around to the non-plated surface. For this reason, it was necessary to install the magic at a certain distance from the object to be plated. The present invention has been made for the purpose of providing a dummy electrode for preventing the circulation of plating current, which eliminates the problems of the above-mentioned known means and has good workability. The invention will be described in detail.
1は陰極槽で例えば塩化ビニール、アクリル樹脂等の電
気絶縁性材或は表面がゴムラィニング等の電気絶縁性材
料で完全に被覆された材料で形成される。Reference numeral 1 denotes a cathode tank made of an electrically insulating material such as vinyl chloride or acrylic resin, or a material whose surface is completely covered with an electrically insulating material such as rubber lining.
この陰極槽1には少くとも一面に窓2が設けられ、ここ
に陰イオン交換膜3が展張される。本発明において使用
される陰イオン交換膜は特に限定されるものではなく本
発明の目的の範囲内において任意に選ぶことができる。
前記陰極槽1に設けられる窓2は四周に設けてもよく又
一方のみに設けてもよくその大きさも特に限定されない
が非メッキ面へ廻り込むメッキ電流の捕捉に支障のない
様任意に選ぶことができる。又陰イオン交換膜がメッキ
液中のスラジ等によって物理的に破損されるのを防ぐた
めに耐薬品性、及び機械的強度に優れたテトロン織布の
如きで陰極槽1全体を覆ってもよい。This cathode cell 1 is provided with a window 2 on at least one side, and an anion exchange membrane 3 is spread therein. The anion exchange membrane used in the present invention is not particularly limited and can be arbitrarily selected within the scope of the purpose of the present invention.
The windows 2 provided in the cathode tank 1 may be provided on all four sides, or may be provided on only one side, and the size thereof is not particularly limited, but may be arbitrarily selected so as not to hinder the capture of plating current flowing around to the non-plated surface. I can do it. Further, in order to prevent the anion exchange membrane from being physically damaged by sludge or the like in the plating solution, the entire cathode tank 1 may be covered with a material such as Tetoron woven cloth which has excellent chemical resistance and mechanical strength.
4は陰極槽1内に充填される電導性の充填格である。Reference numeral 4 denotes an electrically conductive filling which is filled in the cathode tank 1 .
この充填俗は一般には電気メッキ格の構成成分と同一の
陰イオンを有する酸や金属塩の水溶液が用いられる。充
填格としてはコスト的にも又電導性の面から硫酸、或は
塩酸等がよい。又この充填俗4は陰イオン交換膜の耐薬
品性等を考慮してpH<10の電導格が推奨される。充
填俗4の濃度は本発明者らの知見によれば例えば、略4
0〜2%の硫酸、35〜2%の塩酸が使用される。This filling method generally uses an aqueous solution of an acid or metal salt having the same anion as the constituent components of the electroplating grade. As the filling material, sulfuric acid, hydrochloric acid, etc. are preferable from the viewpoint of cost and conductivity. Further, it is recommended that this filling material 4 has a conductivity rating of pH<10 in consideration of the chemical resistance of the anion exchange membrane. According to the findings of the present inventors, the density of the filling material 4 is, for example, about 4
0-2% sulfuric acid and 35-2% hydrochloric acid are used.
使用中酸の濃度が低下し、電導性が低くなる様な場合は
陰極槽中に酸を添加し回復させる。5は極板であり、使
用される充填俗4に対し耐食性の良好な例えばステンレ
ス鋼、アルミニウム或はチタン等の耐食性材料が用いら
れる。If the concentration of acid decreases during use and the conductivity becomes low, add acid to the cathode bath to restore it. Reference numeral 5 designates an electrode plate, which is made of a corrosion-resistant material such as stainless steel, aluminum, or titanium, which has good corrosion resistance for the filling material 4 used.
本発明の陰極装置は上記の如く構成されるものであるが
以下更にその使用法について述べる。The cathode device of the present invention is constructed as described above, and its usage will be further described below.
上記した本発明の陰極装置は例えば金属の片面メッキ、
両面メッキにおけるエッヂ部の過剰メッキの防止或はメ
ッキ板のエッヂ部のメッキ金属の電解剥離等に使用され
るものであるが本発明品の用途は上記に限定されるもの
ではなく本発明の目的を逸脱しない範囲において諸檀の
電解処理においてダミー陰極として使用することができ
る。第2図は本発明の陰極装置を鋼板への片面メッキに
使用した場合の陰極装置の配置の一例を平面的に示した
もので被メッキ板である鋼板6が手前方向に移動しメッ
キがなされるとする。被メッキ鋼板6のメッキ面はA面
で非メッキ面はB面である。For example, the cathode device of the present invention described above may be plated on one side of metal,
Although it is used to prevent excessive plating on the edges of double-sided plating or to electrolytically remove plated metal from the edge portions of plated plates, the uses of the product of the present invention are not limited to the above, and the purpose of the present invention is to It can be used as a dummy cathode in the electrolytic treatment of sandalwood as long as it does not deviate from the following. FIG. 2 is a plan view showing an example of the arrangement of the cathode device when the cathode device of the present invention is used for single-sided plating on a steel plate.The steel plate 6, which is the plate to be plated, moves toward the front and the plating is performed. Suppose that The plated surface of the steel plate 6 to be plated is surface A, and the non-plated surface is surface B.
従って陽極7はメッキされるA面に対向して設けられ、
非メッキ面であるB面にはかかる陽極7は配置されない
。8は本発明の陰極装置であってダミー陰極となるもの
で被メッキ鋼板6のエッヂの近くに配置される。Therefore, the anode 7 is provided facing the A side to be plated,
Such an anode 7 is not arranged on the B side, which is the non-plated surface. Reference numeral 8 denotes a cathode device of the present invention, which serves as a dummy cathode and is placed near the edge of the steel plate 6 to be plated.
この様なダミー陰極の配置されたメッキ槽中で片面メッ
キを行うときは陽極と被メッキ板裏面との間の廻り込み
電流はダミー陰極に誘引され非メッキ面B面のエッヂ部
を中心としたメッキ金属の析出を防止することができ、
しかもダミー陰極面においてもイオン交換膜の介在する
ことによりここでもメッキ金属の析出を防止することが
できる。When performing single-sided plating in a plating bath with such a dummy cathode, the current flowing around between the anode and the back surface of the plated plate is induced by the dummy cathode and is centered around the edge of the non-plated surface B. Can prevent precipitation of plated metal,
Moreover, the presence of an ion exchange membrane on the dummy cathode surface also prevents the plating metal from being deposited here.
本発明のダミー陰極装置は上記の如くであるのでダミー
陰極面へのメッキ金属の析出が完全に防止され、ダミー
陰極の長期間の使用が可能となり、作業性が飛躍的に向
上すると共にデンドラィト状析出物もなくメッキ面を癖
つける事もなくなつた。Since the dummy cathode device of the present invention is as described above, the deposition of plating metal on the dummy cathode surface is completely prevented, the dummy cathode can be used for a long period of time, workability is dramatically improved, and the dendrite-like There were no precipitates, and the plated surface did not become irritated.
以下更に本発明のダミー陰極を使用しての亜鉛メッキを
行った実施例について述べる。An example in which zinc plating was performed using the dummy cathode of the present invention will be described below.
実施例 1
縦型のメッキ槽を用いて第2図に示す様なダミー陰極配
置となし「ダミー陰極にコンダクターロールよりの結線
にて通電し「 メッキ量が片面20夕/あの亜鉛付着量
を得る条件で1斑時間の片面亜鉛メッキを行った。Example 1 Using a vertical plating tank, we arranged the dummy cathode as shown in Figure 2 and energized the dummy cathode by connecting it to a conductor roll. Single-sided galvanizing was carried out for one spot time under the following conditions.
この時のダミー陰極槽の窓は一面とし陰イオン交換膜の
有効援液寸法は5.0×1800柵とし、糟中に30%
の硫酸10クを充填し、直径3仇廠、長さ2000肌の
チタンパイプを陰極板として設置した。At this time, the window of the dummy cathode tank was set to one side, and the effective liquid filling size of the anion exchange membrane was 5.0 x 1800.
A titanium pipe with a diameter of 3 mm and a length of 2,000 mm was installed as a cathode plate.
この陰極板とコンダクターロール間の電流は13軸〜1
5弘であった。この間上記陰極板に析出する亜鉛は皆無
でありメッキ鋼板への押し癖の発生もなかつた。一方、
本発明のダミー陰極に変えて公知の補助陰極を配置した
場合は補助陰極へのデンドラィト状亜鉛の析出が著しく
〜約6時間で補助陰極の取り替えが必要となり析出亜鉛
のメッキ裕中への混入によりメッキ鋼板の一部に押し癖
の発生があった。The current between this cathode plate and the conductor roll is 13 to 1
It was Hiromu 5. During this period, no zinc was deposited on the cathode plate, and no tendency to press against the plated steel plate occurred. on the other hand,
When a known auxiliary cathode is placed in place of the dummy cathode of the present invention, dendrite-like zinc is deposited on the auxiliary cathode significantly - the auxiliary cathode must be replaced after about 6 hours, and the precipitated zinc may get mixed into the plating layer. Some parts of the plated steel plate had a tendency to press.
実施例 2
横型メッキ槽を用いて一方側の陽極を除いてエッヂ部に
本発明のダミー陰極を三個づつ配置し、コンダクターロ
ールとこのダミー陰極との間を電気的に連結し、通電し
、メッキ量が片面10夕/〆となるよう約2独特間の片
面ニッケルメッキを行った。Example 2 Using a horizontal plating tank, three dummy cathodes of the present invention were arranged at each edge part except for the anode on one side, and the conductor roll and the dummy cathodes were electrically connected and energized, Nickel plating was performed on one side for approximately 10 minutes per side.
この際のダミー陰極の陰イオン交換膜の有効嬢液寸法は
20仇舷×25仇舷とし充填俗は15%塩酸を充填しス
テンレス鋼板を陰極板とした。In this case, the effective liquid dimensions of the anion exchange membrane of the dummy cathode were 20 by 25 by 15% hydrochloric acid, and a stainless steel plate was used as the cathode plate.
このメッキによってもダミー陰極へのニッケルの析出は
皆無であり「 メッキ板の押し庇の発生もなかった。実
施例 3非メッキ面への電流廻り込み防止対策を行なわ
ないで亜鉛付着量50夕/めの片面亜鉛メッキを行った
。Even with this plating, there was no precipitation of nickel on the dummy cathode, and there was no occurrence of eaves on the plated plate. Galvanized on one side.
このメッキ板の非メッキ面のエッヂ部には30肌中の範
囲に5夕/枕の亜鉛が付着した。この片面メッキ板を陽
極として実施例1と同様のダミー陰極を配置しアルミニ
ウム合金板を陰極として非メッキ面の亜鉛の電解剥離を
行ったがダミー陰極への亜鉛の析出は全くなかった。実
施例 4
堅型メッキ槽を8個直列に配置した連続メッキ装置を用
い各メッキ槽には本発明のダミー陰極を被メッキ鋼板の
端部から100肋の所に夫々1個づつ設置し、このダミ
ー陰極と被メッキ鋼板とを電気的に接続し、錫を陽極と
し被メッキ鋼板の両面にメッキ量が12夕/めとなる様
に錫メッキを行った。On the edge of the non-plated surface of this plated plate, an amount of zinc of 5 days/pillow was adhered to an area within 30 days. This single-sided plated plate was used as an anode, a dummy cathode similar to that in Example 1 was arranged, and zinc was electrolytically stripped from the non-plated surface using the aluminum alloy plate as a cathode, but no zinc was deposited on the dummy cathode. Example 4 Using a continuous plating device with eight rigid plating tanks arranged in series, one dummy cathode of the present invention was installed in each plating tank at a distance of 100 rows from the end of the steel plate to be plated. The dummy cathode and the steel plate to be plated were electrically connected, and tin was plated on both sides of the plated steel plate using tin as an anode so that the amount of plating was 12 mm.
この時のダミー陰極の陰イオン交換膜の有効嬢液寸法は
5比吻×150仇駁で、充填俗としては30%硫酸を充
填し、外径3仇岬のステンレススチールパイプを陰極と
した。このメッキ装置を用いて10畑時間錫メッキを行
ってもダミー陰極へのメッキ金属の蚤着は認められず、
しかもメッキ鋼板には端部樹枝状メッキ金属の析出も、
又過剰メッキも全く生じなかった。At this time, the effective liquid size of the anion exchange membrane of the dummy cathode was 5 mm x 150 mm, the filling was generally 30% sulfuric acid, and a stainless steel pipe with an outer diameter of 3 mm was used as the cathode. Even after carrying out tin plating for 10 hours using this plating equipment, no plating metal was observed to adhere to the dummy cathode.
Moreover, the plated steel plate also has dendritic plated metal deposits on the edge.
Also, no excessive plating occurred.
第1図は本発明の陰極装置の斜視図、第2図はダミー陰
極の使用態様図である。
1:陰極槽、2:窓、3:陰イオン交換膜、4:充填格
、5:極板、6:鋼板、7:陽極、8:陰極装置。
髪′図
多2図FIG. 1 is a perspective view of the cathode device of the present invention, and FIG. 2 is a diagram showing how a dummy cathode is used. 1: cathode tank, 2: window, 3: anion exchange membrane, 4: packing, 5: electrode plate, 6: steel plate, 7: anode, 8: cathode device. Hair 2 illustrations
Claims (1)
る電気絶縁材で形成された電極槽に電導性浴を充填する
と共に、この浴中に極板を浸漬配置したことを特徴とす
る金属の電解処理用ダミー陰極。1. An electrode bath made of an electrically insulating material having a window on at least one side of which an ion exchange membrane is extended is filled with an electrically conductive bath, and an electrode plate is placed immersed in the bath. Dummy cathode for electrolytic treatment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10262177A JPS601399B2 (en) | 1977-08-29 | 1977-08-29 | Dummy cathode for electrolytic treatment of metals |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10262177A JPS601399B2 (en) | 1977-08-29 | 1977-08-29 | Dummy cathode for electrolytic treatment of metals |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5437035A JPS5437035A (en) | 1979-03-19 |
JPS601399B2 true JPS601399B2 (en) | 1985-01-14 |
Family
ID=14332307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10262177A Expired JPS601399B2 (en) | 1977-08-29 | 1977-08-29 | Dummy cathode for electrolytic treatment of metals |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS601399B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4977046B2 (en) * | 2008-01-21 | 2012-07-18 | Jx日鉱日石金属株式会社 | Edge overcoat prevention device and electroplating material manufacturing method using the same |
-
1977
- 1977-08-29 JP JP10262177A patent/JPS601399B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5437035A (en) | 1979-03-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS61119699A (en) | System and method for producing foil of metal or metal alloy | |
DE1800049A1 (en) | Nickel or copper foil with an electrolytically applied nickel-containing adhesive layer, especially for thermoset supports for printed circuits | |
ES8202597A1 (en) | Apparatus for electroplating. | |
JPS601399B2 (en) | Dummy cathode for electrolytic treatment of metals | |
DE1521875A1 (en) | Process for protecting titanium against etching | |
DE1277642B (en) | Process for the protection of metallic surfaces against metal deposition in chemical metallization baths | |
US3954571A (en) | Wire and strip line electroplating | |
US3691049A (en) | Wire and strip line electroplating | |
JPS6333971Y2 (en) | ||
JPS6358237B2 (en) | ||
JPH05106085A (en) | Method for preventing elution of fe ion into electroplating solution | |
JPS5928598A (en) | Pb alloy insoluble anode for electroplating | |
Abd El Rehim et al. | Role of halides in the electroplating of tin from the alkaline-stannate bath | |
JP2719046B2 (en) | Method and apparatus for electroplating one or both sides of a steel product | |
US3247083A (en) | Method of chromium electrodeposition | |
US3376209A (en) | Anode formed of lead base and duriron | |
Krishnan et al. | Characteristics of a non-cyanide alkaline zinc plating bath | |
JPS5837192A (en) | Post-treatment for non-plated surface of steel plate electroplated with zinc on one side | |
CN210085606U (en) | Metal part surface galvanizing device | |
US3649478A (en) | Plating method utilizing silver-coated anode leads | |
JP3370896B2 (en) | Method and apparatus for supplying Zn ions to a Zn-Ni alloy electroplating bath | |
JPH0321636B2 (en) | ||
JPH0126771Y2 (en) | ||
Abd El Rehim et al. | Electrodeposition of Cd-Ni alloys from ammoniacal baths | |
JP2551092B2 (en) | Method and apparatus for preventing over-plating of end portions of metal strip in electric plating line |