JPS60115463A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS60115463A JPS60115463A JP58222899A JP22289983A JPS60115463A JP S60115463 A JPS60115463 A JP S60115463A JP 58222899 A JP58222899 A JP 58222899A JP 22289983 A JP22289983 A JP 22289983A JP S60115463 A JPS60115463 A JP S60115463A
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- wiring
- heat generating
- generating body
- wired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 abstract description 14
- 238000007639 printing Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 10
- 230000010287 polarization Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007651 thermal printing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は感熱式印字装置に用いて発色印字を行々うサー
マルヘッド、さらに詳しくいえばセラミック基板に配線
電極を形成し、配線′１電極に発熱体を形成し、その上
面に保護膜を覆って構成されるサーマルヘッドに関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal head used in a thermal printing device to perform color printing, more specifically, a wiring electrode is formed on a ceramic substrate, a heating element is formed on the wiring '1 electrode, The present invention relates to a thermal head whose upper surface is covered with a protective film.
まず、従来のサーマルヘッドの構造を第１図に示す。第
１図（ａｌはサーマルヘッドの平面図、第１図（ｂｌは
そのＡ−Ａ’断面図である。First, the structure of a conventional thermal head is shown in FIG. FIG. 1 (al is a plan view of the thermal head, and FIG. 1 (bl is a sectional view taken along the line AA').
セラミック基板１０表面金面にガラス層２を形成し、こ
のガラス層上に順次、発熱体３、配線電極４、保護膜５
を被着形成して構成する。こ９例は従来の一例であるが
、量産が容易な膜構成であることからほとんどのサーマ
ルヘッドは基本的にこの構成と異々るところはない。A glass layer 2 is formed on the gold surface of the ceramic substrate 10, and a heating element 3, a wiring electrode 4, and a protective film 5 are sequentially formed on this glass layer.
It is constructed by depositing and forming. Although these nine examples are conventional examples, most thermal heads basically have no difference from this configuration because the film configuration is easy to mass produce.
従来のサーマルヘッドは膜の形成を平面的に行うことか
ら基板面積の大部分を配線基板４が占める。そのため、
高印字品質化のため発熱体の数を増加させる場合は配線
電極数も増加するためセラミック基板が大形化し、量産
性が悪化するという欠点があシ、したがって小形で高印
字品質の製品を実現することはできなかった。In the conventional thermal head, since the film is formed in a two-dimensional manner, the wiring board 4 occupies most of the board area. Therefore,
When increasing the number of heating elements to achieve high print quality, the number of wiring electrodes also increases, which increases the size of the ceramic substrate, which has the disadvantage of deteriorating mass production. Therefore, small products with high print quality are realized. I couldn't do it.
本発明の目的は高印字品質化が容易で小形のサーマルヘ
ッドを提供することにある。An object of the present invention is to provide a compact thermal head that can easily achieve high printing quality.
前記目的を達成するために本発明によるサーマルヘッド
は配線電極が形成されたセラミックシートを多層積層し
、その多層セラミックシートを切断して配線電極を露出
させた端面を形成し、その端面上にガラス層を形成し、
その上に発熱体を搭載した後に、配線電極と発熱体間に
配線を施し、端面全面を保護膜で覆ってｉ、成しである
。In order to achieve the above object, the thermal head according to the present invention is constructed by laminating multiple layers of ceramic sheets on which wiring electrodes are formed, cutting the multilayer ceramic sheet to form an end surface exposing the wiring electrodes, and depositing glass on the end surface. form a layer,
After mounting the heating element thereon, wiring is provided between the wiring electrode and the heating element, and the entire end surface is covered with a protective film.
以下、゛図面を参照して本発明をさらに詳しく説明する
。第２図〜第８図は本発明によるサーマルヘッドを製造
する各過程を示す図で、第２図は配線成極が形成された
セラミックシートの平面図である。Hereinafter, the present invention will be explained in more detail with reference to the drawings. 2 to 8 are diagrams showing each process of manufacturing a thermal head according to the present invention, and FIG. 2 is a plan view of a ceramic sheet on which wiring polarization is formed.
まず、このように、セラミック原料を粉砕、混合してつ
くられたセラミック生シート６上に、配線電極７ｆ厚膜
印刷技術を用いて複数印刷する。First, a plurality of wiring electrodes 7f are printed using thick film printing technology on the raw ceramic sheet 6 made by pulverizing and mixing ceramic raw materials in this manner.
次にこの第２図のセラミック生シー）６’）第３図に示
すように所定の枚数積層し、無地の生シート８で上下を
挾み圧着する。Next, as shown in FIG. 2, a predetermined number of raw ceramic sheets are laminated as shown in FIG.
次いで、第２図の破線で示す位倉からこの積１−セラミ
ック基板を切断して第４図に示すように側面（端面）に
配線電極７が露出した個々のセラミック基板ブロック９
に分割する。そして、これを高温で焼成して第５図のよ
うなセラミック基板９を得る。Next, this product 1-ceramic substrate is cut from the position indicated by the broken line in FIG. 2 to form individual ceramic substrate blocks 9 with wiring electrodes 7 exposed on the side surfaces (end faces) as shown in FIG.
Divide into. Then, this is fired at a high temperature to obtain a ceramic substrate 9 as shown in FIG.
セラミック基板の一方の配線成極７側に厚膜印刷技術で
第６図に示すガラス層ｌＯを配線電極に一部被さるよう
に形成する。A glass layer 10 shown in FIG. 6 is formed by thick film printing technology on one wiring electrode 7 side of the ceramic substrate so as to partially cover the wiring electrode.
第５図（ａ）、第６［１１（ａ）は上記各状態での平面
図、第５図（ｂ）、第６図（ｂ）はＢ−Ｂ’断面および
Ｃ−〇′断面をそれぞれ示す。Figures 5(a) and 6[11(a) are plan views in each of the above states, and Figures 5(b) and 6(b) are BB' and C-〇' cross sections, respectively. show.
次にガラスト１０の上に発熱体１１を形成し、ついで接
続電極１２を発熱体の一部と配線成極に被さるように被
着形成する。Next, a heating element 11 is formed on the glass plate 10, and then a connecting electrode 12 is formed so as to cover a part of the heating element and the wiring polarization.
その状態が第７図（ａ）の平面図と第７図（ｂｌのＤ−
Ｄ断面図である。The state is shown in the plan view of Fig. 7(a) and the D-
It is a D sectional view.
最後に、第８図に示すように保護膜１３を全面に形成す
る。Finally, as shown in FIG. 8, a protective film 13 is formed over the entire surface.
発熱体１１、接続電極１２および保護膜１３は薄膜形成
技術で被着形成される。The heating element 11, the connection electrode 12, and the protective film 13 are deposited using a thin film formation technique.
以上により配線電極１２がセラミック基板９の内部に形
成された構造となる。As a result of the above, a structure is obtained in which the wiring electrode 12 is formed inside the ceramic substrate 9.
本発明によるサーマルヘッドはこのように配線電極がセ
ラミック基板内部に形成され、配線電極のための基板面
積を不用とするので外形寸法が大幅に小形してチップ化
を実現でき、セラミックシートの積層数を増加させるこ
とで容易に高品質のサーマルヘッドを得、感熱印字装置
を小形にする効果がある。In the thermal head according to the present invention, the wiring electrodes are formed inside the ceramic substrate in this way, and the board area for the wiring electrodes is not required, so the external dimensions are significantly smaller and it can be made into a chip, and the number of laminated ceramic sheets is By increasing the number, it is possible to easily obtain a high-quality thermal head and to make the thermal printing device more compact.
第１図（ａｌは従来のサーマルヘッドの例を示す平面図
、第１図（ｂ）はＡ−Ａ’断面図である。
第２図は本発明にかかるセラミック生シー）を極印−り
例を示す平面図、第３図はセラミック生シートの積層、
圧着例の斜視図、第４図は切断状態を示すセラミック基
板ブロックの斜視図、第５図（ａｌはセラミック基板ブ
ロックを示す斜視図、第５図（ｂ）はＢ二Ｂ’断面図で
ある。第６図（ａ）は第５図にガラス層を形成したセラ
ミック基板ブロックの平面図、第６図（ｂ）はＣ−０′
断面図である。第７図（’ａｌは第６図に発熱体と接続
型ｌ・・・セラミック基板
２．１０・・・ガラス層
３．１１・・・発熱体
４ 、７ 、１２・・・配線成極
５．１３・・・保−膜
８・・・セラミック無地シート
９・・・セラミック基板ブロック
特許出願人 日本電気株式会社
代理人 弁理士 井 ） ロ 壽
才１図
才２図
一止＝二＝耐ツ
才５図
（８）
７６図Fig. 1 (Al is a plan view showing an example of a conventional thermal head, Fig. 1 (b) is a sectional view taken along line A-A'. Fig. 2 is an example of a ceramic green sheet according to the present invention). 3 is a plan view showing the lamination of raw ceramic sheets,
A perspective view of an example of crimping, FIG. 4 is a perspective view of a ceramic substrate block showing a cut state, and FIG. 6(a) is a plan view of the ceramic substrate block on which the glass layer is formed as shown in FIG. 5, and FIG.
FIG. Figure 7 ('al is connected to the heating element in Figure 6 l...Ceramic substrate 2.10...Glass layer 3.11...Heating element 4, 7, 12...Wiring polarization 5 .13...Retaining film 8...Ceramic plain sheet 9...Ceramic substrate block Patent applicant NEC Corporation agent Patent attorney I) B Jusai 1 figure 2 figure 1 stop = 2 = resistance 5th figure (8) 76th figure
Claims (1)
その多層セラミックシートを切断して配線電極を露出さ
せた端面を形成し、その端面上にガラス層を形成し、そ
の上に発熱体を搭載した後に、配線電極と発熱体間に配
線を施し、端面全面を保護膜で覆ったことを特徴とする
サーマルヘッド。Multilayer ceramic sheets with wiring electrodes formed are laminated,
The multilayer ceramic sheet is cut to form an end face with exposed wiring electrodes, a glass layer is formed on the end face, a heating element is mounted on it, and wiring is provided between the wiring electrode and the heating element. A thermal head characterized by having the entire end face covered with a protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58222899A JPS60115463A (en) | 1983-11-25 | 1983-11-25 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58222899A JPS60115463A (en) | 1983-11-25 | 1983-11-25 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60115463A true JPS60115463A (en) | 1985-06-21 |
Family
ID=16789608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58222899A Pending JPS60115463A (en) | 1983-11-25 | 1983-11-25 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60115463A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189870A (en) * | 1984-10-11 | 1986-05-08 | Yokogawa Hokushin Electric Corp | Manufacture of thermal head |
-
1983
- 1983-11-25 JP JP58222899A patent/JPS60115463A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189870A (en) * | 1984-10-11 | 1986-05-08 | Yokogawa Hokushin Electric Corp | Manufacture of thermal head |
| JPH0582303B2 (en) * | 1984-10-11 | 1993-11-18 | Yokogawa Electric Corp |
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