JPS6461746A - Heat-resisting photosensitive polymer composition - Google Patents
Heat-resisting photosensitive polymer compositionInfo
- Publication number
- JPS6461746A JPS6461746A JP21787987A JP21787987A JPS6461746A JP S6461746 A JPS6461746 A JP S6461746A JP 21787987 A JP21787987 A JP 21787987A JP 21787987 A JP21787987 A JP 21787987A JP S6461746 A JPS6461746 A JP S6461746A
- Authority
- JP
- Japan
- Prior art keywords
- group
- org
- polymer
- titled composition
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 title abstract 4
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 150000004984 aromatic diamines Chemical class 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000006482 condensation reaction Methods 0.000 abstract 1
- 230000018044 dehydration Effects 0.000 abstract 1
- 238000006297 dehydration reaction Methods 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
- -1 tetracarboxylic acid diester Chemical class 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
PURPOSE:To form a thick film pattern having high sensitivity and high definition by incorporating a specified polymer in the titled composition. CONSTITUTION:The titled composition is composed of 100pts.wt. a polymer having a repeating unit shown by the formula as a main component, and 0.1-30 pts.wt. of a photopolymerization initiator or a photocrosslinking agent or a sensitizer. In the formula, R<1> is >=4C a four valent org. group, R<2> is a divalent org. group contg. an aromatic ring, P<1>-P<3> are each a photosensitive group, X is an org. group or -O- group, etc., (n) is 1 or 2. Said polymer is synthesized by a dehydration and polymerization-condensation reaction of a tetracarboxylic acid diester having an ester residual group as a photosensitive group and an aromatic diamine compd. having the photosensitive group. And, the titled composition may contain a michler's ketone, etc., as an additive, and if necessary, an auxiliary sensitizer may be added.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21787987A JPS6461746A (en) | 1987-09-02 | 1987-09-02 | Heat-resisting photosensitive polymer composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21787987A JPS6461746A (en) | 1987-09-02 | 1987-09-02 | Heat-resisting photosensitive polymer composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6461746A true JPS6461746A (en) | 1989-03-08 |
Family
ID=16711199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21787987A Pending JPS6461746A (en) | 1987-09-02 | 1987-09-02 | Heat-resisting photosensitive polymer composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6461746A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0651512A (en) * | 1992-07-30 | 1994-02-25 | Sumitomo Bakelite Co Ltd | Photosensitive resin composition |
WO2009051187A1 (en) * | 2007-10-19 | 2009-04-23 | Nissan Chemical Industries, Ltd. | Polyester resin solution for production of thermally cured film |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5545748A (en) * | 1978-09-29 | 1980-03-31 | Hitachi Ltd | Photosensitive polymer and its production |
JPS5638038A (en) * | 1979-08-01 | 1981-04-13 | Toray Ind Inc | Photosensitive polyimide precursor |
JPS5776017A (en) * | 1980-09-03 | 1982-05-12 | Du Pont | Polymeric heat resistance photopolymerizing composition |
JPS60134236A (en) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | Formation of fine pattern |
JPS60178446A (en) * | 1984-02-27 | 1985-09-12 | Ube Ind Ltd | Photosensitive material soluble in organic solvent |
JPS60198537A (en) * | 1984-01-24 | 1985-10-08 | ゼネラル・エレクトリツク・カンパニイ | Photopatternable dielectric composition and methods of manufacturing and using the same |
JPS60228537A (en) * | 1984-03-29 | 1985-11-13 | シーメンス、アクチエンゲゼルシヤフト | Manufacture of radiation reactive precursor |
JPS61254605A (en) * | 1985-05-07 | 1986-11-12 | Asahi Chem Ind Co Ltd | Photosensitive composition |
-
1987
- 1987-09-02 JP JP21787987A patent/JPS6461746A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5545748A (en) * | 1978-09-29 | 1980-03-31 | Hitachi Ltd | Photosensitive polymer and its production |
JPS5638038A (en) * | 1979-08-01 | 1981-04-13 | Toray Ind Inc | Photosensitive polyimide precursor |
JPS5776017A (en) * | 1980-09-03 | 1982-05-12 | Du Pont | Polymeric heat resistance photopolymerizing composition |
JPS60134236A (en) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | Formation of fine pattern |
JPS60198537A (en) * | 1984-01-24 | 1985-10-08 | ゼネラル・エレクトリツク・カンパニイ | Photopatternable dielectric composition and methods of manufacturing and using the same |
JPS60178446A (en) * | 1984-02-27 | 1985-09-12 | Ube Ind Ltd | Photosensitive material soluble in organic solvent |
JPS60228537A (en) * | 1984-03-29 | 1985-11-13 | シーメンス、アクチエンゲゼルシヤフト | Manufacture of radiation reactive precursor |
JPS61254605A (en) * | 1985-05-07 | 1986-11-12 | Asahi Chem Ind Co Ltd | Photosensitive composition |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0651512A (en) * | 1992-07-30 | 1994-02-25 | Sumitomo Bakelite Co Ltd | Photosensitive resin composition |
WO2009051187A1 (en) * | 2007-10-19 | 2009-04-23 | Nissan Chemical Industries, Ltd. | Polyester resin solution for production of thermally cured film |
JP5459483B2 (en) * | 2007-10-19 | 2014-04-02 | 日産化学工業株式会社 | Polyester resin solution for thermosetting film formation |
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