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JPS6459972A - Optical semiconductor device - Google Patents

Optical semiconductor device

Info

Publication number
JPS6459972A
JPS6459972A JP62218223A JP21822387A JPS6459972A JP S6459972 A JPS6459972 A JP S6459972A JP 62218223 A JP62218223 A JP 62218223A JP 21822387 A JP21822387 A JP 21822387A JP S6459972 A JPS6459972 A JP S6459972A
Authority
JP
Japan
Prior art keywords
outer drawing
electrodes
light emitting
emitting device
metal fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62218223A
Other languages
Japanese (ja)
Inventor
Shozo Noguchi
Osamu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62218223A priority Critical patent/JPS6459972A/en
Publication of JPS6459972A publication Critical patent/JPS6459972A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE:To eliminate connection with a metal fine wire and obtain a low cost optical semiconductor device with excellent reliability and quality by a method wherein one of the electrodes of a photodetector is directly connected to an outer drawing-out lead electrically. CONSTITUTION:Outer drawing-out leads 3 and 4 made of iron, iron-nickel or Kovar are inserted through piecing holes provided in a metal stem base 1 and sealed with glass 5. A light emitting device 6 is attached to the side surface of a stage 2 with a heat sink 7 made of diamond, silicon or beryllia between. One of the electrodes of the light emitting device 6 is connected to the outer drawing-out lead 3 which has a flat plane at its tip electrically with a metal fine wire 8 made of gold or aluminum. The other electrode of the light emitting device 6 is connected electrically to an outer drawing-out lead 9 attached to the metal stem base 1 by welding or the like. Therefore, the number of connections between the electrodes of a photodetector 11 and the outer drawing- out leads with the metal fine wires can be reduced.
JP62218223A 1987-08-31 1987-08-31 Optical semiconductor device Pending JPS6459972A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62218223A JPS6459972A (en) 1987-08-31 1987-08-31 Optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62218223A JPS6459972A (en) 1987-08-31 1987-08-31 Optical semiconductor device

Publications (1)

Publication Number Publication Date
JPS6459972A true JPS6459972A (en) 1989-03-07

Family

ID=16716542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62218223A Pending JPS6459972A (en) 1987-08-31 1987-08-31 Optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS6459972A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10255462A1 (en) * 2002-11-25 2004-06-17 Infineon Technologies Ag Electric device, e.g. for opto-electronic field, such as laser and photodetector, with appropriate housing, a support with at least one conductive track, on which is secured electric component coupled to conductive track

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5250672B2 (en) * 1973-02-10 1977-12-26
JPS53133384A (en) * 1977-04-27 1978-11-21 Omron Tateisi Electronics Co Manufacture of optical coupling device
JPS5440907A (en) * 1977-09-07 1979-03-31 Nippon Soken Inc 2-cycle engine
JPS587887A (en) * 1981-07-06 1983-01-17 Fujitsu Ltd Optical semiconductor device
JPS5832515A (en) * 1981-08-20 1983-02-25 Sumitomo Electric Ind Ltd Continuous extruding device for metal

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5250672B2 (en) * 1973-02-10 1977-12-26
JPS53133384A (en) * 1977-04-27 1978-11-21 Omron Tateisi Electronics Co Manufacture of optical coupling device
JPS5440907A (en) * 1977-09-07 1979-03-31 Nippon Soken Inc 2-cycle engine
JPS587887A (en) * 1981-07-06 1983-01-17 Fujitsu Ltd Optical semiconductor device
JPS5832515A (en) * 1981-08-20 1983-02-25 Sumitomo Electric Ind Ltd Continuous extruding device for metal

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10255462A1 (en) * 2002-11-25 2004-06-17 Infineon Technologies Ag Electric device, e.g. for opto-electronic field, such as laser and photodetector, with appropriate housing, a support with at least one conductive track, on which is secured electric component coupled to conductive track
US6781057B2 (en) 2002-11-25 2004-08-24 Infineon Technologies Ag Electrical arrangement and method for producing an electrical arrangement
DE10255462B4 (en) * 2002-11-25 2005-07-07 Infineon Technologies Ag Electrical arrangement and method for producing an electrical arrangement

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