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JPS6436642A - One-pack thermosetting epoxy resin composition - Google Patents

One-pack thermosetting epoxy resin composition

Info

Publication number
JPS6436642A
JPS6436642A JP19215387A JP19215387A JPS6436642A JP S6436642 A JPS6436642 A JP S6436642A JP 19215387 A JP19215387 A JP 19215387A JP 19215387 A JP19215387 A JP 19215387A JP S6436642 A JPS6436642 A JP S6436642A
Authority
JP
Japan
Prior art keywords
epoxy resin
lead
resin composition
thermosetting epoxy
pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19215387A
Other languages
Japanese (ja)
Other versions
JPH0567661B2 (en
Inventor
Kunimitsu Matsuzaki
Toshio Matsuo
Ryuichi Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Priority to JP19215387A priority Critical patent/JPS6436642A/en
Publication of JPS6436642A publication Critical patent/JPS6436642A/en
Publication of JPH0567661B2 publication Critical patent/JPH0567661B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain the titled composition of large specific gravity, outstanding in storage stability and coating characteristics, suitable for balance correction, by incorporating an epoxy resin with a curing agent, lead, lead compound and anti-settling agent. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of an epoxy resin with a total of 500-1,000 (pref. 600-900)pts.wt. of (B) a curing agent (e.g. dicyandiamide, acid hydrazide) and (C) lead with an average particle size of 20mum and a lead compound with an average particle size of 0.5-2.0mum (e.g. red lead oxide) and (D) 25-100 (pref. 40-55)pts.wt. of an anti-settling agent (e.g. mica, silica).
JP19215387A 1987-07-31 1987-07-31 One-pack thermosetting epoxy resin composition Granted JPS6436642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19215387A JPS6436642A (en) 1987-07-31 1987-07-31 One-pack thermosetting epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19215387A JPS6436642A (en) 1987-07-31 1987-07-31 One-pack thermosetting epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS6436642A true JPS6436642A (en) 1989-02-07
JPH0567661B2 JPH0567661B2 (en) 1993-09-27

Family

ID=16286579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19215387A Granted JPS6436642A (en) 1987-07-31 1987-07-31 One-pack thermosetting epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS6436642A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07330869A (en) * 1994-06-03 1995-12-19 Nippon Hidorajin Kogyo Kk Heat-resistant epoxy resin composition having excellent normal-temperature stability and curing agent for epoxy resin
JP2003055536A (en) * 2001-08-22 2003-02-26 Somar Corp Lead-free cold-curing epoxy resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07330869A (en) * 1994-06-03 1995-12-19 Nippon Hidorajin Kogyo Kk Heat-resistant epoxy resin composition having excellent normal-temperature stability and curing agent for epoxy resin
JP2003055536A (en) * 2001-08-22 2003-02-26 Somar Corp Lead-free cold-curing epoxy resin composition

Also Published As

Publication number Publication date
JPH0567661B2 (en) 1993-09-27

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