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JPS6430242A - Pre-alignment of semiconductor wafer - Google Patents

Pre-alignment of semiconductor wafer

Info

Publication number
JPS6430242A
JPS6430242A JP62186967A JP18696787A JPS6430242A JP S6430242 A JPS6430242 A JP S6430242A JP 62186967 A JP62186967 A JP 62186967A JP 18696787 A JP18696787 A JP 18696787A JP S6430242 A JPS6430242 A JP S6430242A
Authority
JP
Japan
Prior art keywords
wafer
alignment
mark
semiconductor wafer
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62186967A
Other languages
Japanese (ja)
Inventor
Norio Moriyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62186967A priority Critical patent/JPS6430242A/en
Publication of JPS6430242A publication Critical patent/JPS6430242A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To place a plurality of semiconductor wafers accurately at their prescribed positions for exposure to light and to reduce difference in errors among exposing devices by a method wherein calibration of mark detecting sections is accomplished on the ground of reference marks on an exposing stage and the data about detected marks is used for the prealignment of the semiconductor wafers. CONSTITUTION:A wafer arm 21 is positioned as prescribed on a exposing stage 28. The position of a reference mark 29 is detected by a mark detecting section 27, and then a semiconductor wafer 25 is coarsely aligned on a pre-alignment stage. The semiconductor wafer 25 is vacuum-sucked to a wafer chuck 24 of the wafer arm 21. The position is optically determined of a pre-alignment mark 33, which is accomplished by using a microscope 27-1, a mirror 27-2, and a detector 27-3. A wafer check driving section 23 then trims the position of the wafer chuck 24. Through these steps, the pre-alignment mark 33 is detected, that is, the semiconductor wafer 25 is pre-aligned.
JP62186967A 1987-07-27 1987-07-27 Pre-alignment of semiconductor wafer Pending JPS6430242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62186967A JPS6430242A (en) 1987-07-27 1987-07-27 Pre-alignment of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62186967A JPS6430242A (en) 1987-07-27 1987-07-27 Pre-alignment of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS6430242A true JPS6430242A (en) 1989-02-01

Family

ID=16197861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62186967A Pending JPS6430242A (en) 1987-07-27 1987-07-27 Pre-alignment of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS6430242A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0747933A1 (en) * 1995-06-07 1996-12-11 Varian Associates, Inc. Optical position calibration system
WO2000043157A1 (en) * 1999-01-25 2000-07-27 Intergen, Inc. Laser alignment system for processing substrates
US6175418B1 (en) 1999-01-25 2001-01-16 Intergen, Inc. Multiple alignment mechanism in close proximity to a shared processing device
WO2003050514A3 (en) * 2001-12-12 2004-01-29 Therma Wave Inc Position-dependent optical metrology calibration
US6897963B1 (en) * 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0747933A1 (en) * 1995-06-07 1996-12-11 Varian Associates, Inc. Optical position calibration system
US5742393A (en) * 1995-06-07 1998-04-21 Varian Associates, Inc. Optical position calibration system
US6897963B1 (en) * 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
WO2000043157A1 (en) * 1999-01-25 2000-07-27 Intergen, Inc. Laser alignment system for processing substrates
US6175418B1 (en) 1999-01-25 2001-01-16 Intergen, Inc. Multiple alignment mechanism in close proximity to a shared processing device
WO2003050514A3 (en) * 2001-12-12 2004-01-29 Therma Wave Inc Position-dependent optical metrology calibration
US7095496B2 (en) 2001-12-12 2006-08-22 Tokyo Electron Limited Method and apparatus for position-dependent optical metrology calibration

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