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JPS6429418A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS6429418A
JPS6429418A JP18499287A JP18499287A JPS6429418A JP S6429418 A JPS6429418 A JP S6429418A JP 18499287 A JP18499287 A JP 18499287A JP 18499287 A JP18499287 A JP 18499287A JP S6429418 A JPS6429418 A JP S6429418A
Authority
JP
Japan
Prior art keywords
epoxy resin
curing agent
filler
cure accelerator
molten silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18499287A
Other languages
Japanese (ja)
Inventor
Hirohisa Hino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP18499287A priority Critical patent/JPS6429418A/en
Publication of JPS6429418A publication Critical patent/JPS6429418A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To obtain the title compsn. which is a one-pack product with a long pot life, has adequate leveling and thixotropic properties, has a long gel time and provides cured products having good physical properties, by mixing an epoxy resin with molten silica having a specified particle diameter as a filler, a specified curing agent and a cure accelerator by dispersion. CONSTITUTION:An one-pack epoxy resin compsn. contg. a hydrazinotriazine curing agent and an imidazole cure accelerator is mixed with molten silica having an average particle diameter of 5-20mu as a filler by dispersion. The addition of molten silica in a state of a fine powder as a filler makes it possible to provide adequate thixotropic and leveling properties. The use of the curing agent and the cure accelerator in properly adjusted amts. makes it possible to obtain an epoxy resin compsn. which gels, for example, at a temp. of 150 deg.C within 50min, has a long pot life and provides cured products having good physical properties.
JP18499287A 1987-07-24 1987-07-24 Epoxy resin composition Pending JPS6429418A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18499287A JPS6429418A (en) 1987-07-24 1987-07-24 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18499287A JPS6429418A (en) 1987-07-24 1987-07-24 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS6429418A true JPS6429418A (en) 1989-01-31

Family

ID=16162895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18499287A Pending JPS6429418A (en) 1987-07-24 1987-07-24 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS6429418A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149727A (en) * 2007-12-19 2009-07-09 Nippon Steel Chem Co Ltd Film-like adhesive, semiconductor package using it, and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149727A (en) * 2007-12-19 2009-07-09 Nippon Steel Chem Co Ltd Film-like adhesive, semiconductor package using it, and its manufacturing method

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