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JPS6420645A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6420645A
JPS6420645A JP62177722A JP17772287A JPS6420645A JP S6420645 A JPS6420645 A JP S6420645A JP 62177722 A JP62177722 A JP 62177722A JP 17772287 A JP17772287 A JP 17772287A JP S6420645 A JPS6420645 A JP S6420645A
Authority
JP
Japan
Prior art keywords
substrate
recess
prevent
heat sink
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62177722A
Other languages
Japanese (ja)
Inventor
Yasuaki Fukumochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62177722A priority Critical patent/JPS6420645A/en
Publication of JPS6420645A publication Critical patent/JPS6420645A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a stress from generating due to the difference of expansion coefficients between an insulating substrate and a heat sink and to prevent the substrate from cracking or exfoliating by bonding the substrate inserted to the recess of the heat sink with a viscous material filled in the recess. CONSTITUTION:An insulating substrate 5 is inserted into a recess 4a formed on a heat sink plate 4, viscous material (e.g., grease) 6 is filled between the plate 4 and the substrate 5, and both are bonded. Thus, it can prevent a stress from generating due to the difference between their expansion coefficients.
JP62177722A 1987-07-15 1987-07-15 Semiconductor device Pending JPS6420645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62177722A JPS6420645A (en) 1987-07-15 1987-07-15 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62177722A JPS6420645A (en) 1987-07-15 1987-07-15 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6420645A true JPS6420645A (en) 1989-01-24

Family

ID=16035968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62177722A Pending JPS6420645A (en) 1987-07-15 1987-07-15 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6420645A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289191A (en) * 2002-03-28 2003-10-10 Denso Corp Electronic control device
JP2009272487A (en) * 2008-05-08 2009-11-19 Toyota Motor Corp Electronic component
JP2016096263A (en) * 2014-11-14 2016-05-26 三菱電機株式会社 Power semiconductor device, method of manufacturing the same, and insulating substrate
JP2018157201A (en) * 2017-03-16 2018-10-04 三菱マテリアル株式会社 Resistance device and manufacturing method of resistance device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289191A (en) * 2002-03-28 2003-10-10 Denso Corp Electronic control device
US7031165B2 (en) 2002-03-28 2006-04-18 Denso Corporation Electronic control unit
JP2009272487A (en) * 2008-05-08 2009-11-19 Toyota Motor Corp Electronic component
US8446727B2 (en) 2008-05-08 2013-05-21 Toyota Jidosha Kabushiki Kaisha Electronic component
JP2016096263A (en) * 2014-11-14 2016-05-26 三菱電機株式会社 Power semiconductor device, method of manufacturing the same, and insulating substrate
JP2018157201A (en) * 2017-03-16 2018-10-04 三菱マテリアル株式会社 Resistance device and manufacturing method of resistance device

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