JPS6412524A - Vertical type diffusion cvd device - Google Patents
Vertical type diffusion cvd deviceInfo
- Publication number
- JPS6412524A JPS6412524A JP16955787A JP16955787A JPS6412524A JP S6412524 A JPS6412524 A JP S6412524A JP 16955787 A JP16955787 A JP 16955787A JP 16955787 A JP16955787 A JP 16955787A JP S6412524 A JPS6412524 A JP S6412524A
- Authority
- JP
- Japan
- Prior art keywords
- boat
- reaction tube
- tube
- wafer
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To realize a high-quality film formation in a high through-put and to contrive a reduction in power consumption by a method wherein a semiconductor water is introduced and sealed in the lower part of a reaction tube, then is transferred in the upper part of the reaction tube and again is taken out via the process reverse to the above process. CONSTITUTION:A boat 4 placed on a boat supporting member 5 is made to ascend by the synchronous ascending operation of airtight flanges 6 and 8 of vertically moving mechanisms 7 and 9 and is introduced in a lower part 3b of a reaction tube 3, and the airtight flange 6 is abutted on a reaction tube sealing flange 11 to seal the reaction tube 3. A semiconductor wafer on the boat 4 is heated at low temperature in the lower part 3b. Then, after the gas in the tube 3 is substituted, the flange 8 only is elevated the boat 4 is transferred into an upper part 3a of the tube 3, is heated at high temperature and the wafer on the boat 4 is treated. After that, the wafer is cooled to a temperature which has no effect on the wafer in the air as well via the operating process reverse to the above operating process and the boat 4 is taken out outside of the tube 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16955787A JPS6412524A (en) | 1987-07-06 | 1987-07-06 | Vertical type diffusion cvd device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16955787A JPS6412524A (en) | 1987-07-06 | 1987-07-06 | Vertical type diffusion cvd device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6412524A true JPS6412524A (en) | 1989-01-17 |
Family
ID=15888670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16955787A Pending JPS6412524A (en) | 1987-07-06 | 1987-07-06 | Vertical type diffusion cvd device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6412524A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5252807A (en) * | 1990-07-02 | 1993-10-12 | George Chizinsky | Heated plate rapid thermal processor |
| US6002109A (en) * | 1995-07-10 | 1999-12-14 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
| US6133550A (en) * | 1996-03-22 | 2000-10-17 | Sandia Corporation | Method and apparatus for thermal processing of semiconductor substrates |
| US6198074B1 (en) | 1996-09-06 | 2001-03-06 | Mattson Technology, Inc. | System and method for rapid thermal processing with transitional heater |
-
1987
- 1987-07-06 JP JP16955787A patent/JPS6412524A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5252807A (en) * | 1990-07-02 | 1993-10-12 | George Chizinsky | Heated plate rapid thermal processor |
| US6002109A (en) * | 1995-07-10 | 1999-12-14 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
| US6403925B1 (en) | 1995-07-10 | 2002-06-11 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
| US6133550A (en) * | 1996-03-22 | 2000-10-17 | Sandia Corporation | Method and apparatus for thermal processing of semiconductor substrates |
| US6355909B1 (en) | 1996-03-22 | 2002-03-12 | Sandia Corporation | Method and apparatus for thermal processing of semiconductor substrates |
| US6198074B1 (en) | 1996-09-06 | 2001-03-06 | Mattson Technology, Inc. | System and method for rapid thermal processing with transitional heater |
| US6331697B2 (en) | 1996-09-06 | 2001-12-18 | Mattson Technology Inc. | System and method for rapid thermal processing |
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