Nothing Special   »   [go: up one dir, main page]

JPS6411339A - Stress analysis of semiconductor device - Google Patents

Stress analysis of semiconductor device

Info

Publication number
JPS6411339A
JPS6411339A JP16690687A JP16690687A JPS6411339A JP S6411339 A JPS6411339 A JP S6411339A JP 16690687 A JP16690687 A JP 16690687A JP 16690687 A JP16690687 A JP 16690687A JP S6411339 A JPS6411339 A JP S6411339A
Authority
JP
Japan
Prior art keywords
internal stress
data
processes
semiconductor device
initial stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16690687A
Other languages
Japanese (ja)
Inventor
Naoto Mogi
Genichi Hatagoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP16690687A priority Critical patent/JPS6411339A/en
Publication of JPS6411339A publication Critical patent/JPS6411339A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To calculate internal stress which remains in the final manufacturing process of a semiconductor device by a stress analysis method which is added in order of the process by expressing respective manufacturing processes of the semiconductor device in terms of flows of three kinds of element process and by calculating internal stress which in newly set up by the concerned element processes on the basis of data prepared with respect to respective element processes. CONSTITUTION:Various manufacturing processes are divided into three kinds of element processes; the process where the latest materials are added to the mainframe of a structure, the process which changes the property of a part of the structure, the process which remove or divide a part of the structure. In the calculation, the data of structures and conditions corresponding to an initial stage as well as the concerned element process are inputted from a data file 11 and also the internal stress data in the initial stage are inputted from the data file 12 and further, a calculation part 13 calculates internal stress which is newly set up according to the prescribed calculation means. Moreover, the addition part 14 adds internal stress set up newly to that of the initial stage and enters the resultant addition as the internal stress data which is obtained in the case of completion of the concerned element process in the 12. The internal stress data in the final structure is obtained by repeating this operation for each element process.
JP16690687A 1987-07-06 1987-07-06 Stress analysis of semiconductor device Pending JPS6411339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16690687A JPS6411339A (en) 1987-07-06 1987-07-06 Stress analysis of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16690687A JPS6411339A (en) 1987-07-06 1987-07-06 Stress analysis of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6411339A true JPS6411339A (en) 1989-01-13

Family

ID=15839830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16690687A Pending JPS6411339A (en) 1987-07-06 1987-07-06 Stress analysis of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6411339A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8185578B2 (en) 1999-09-14 2012-05-22 International Business Machines Corporation Client server system and method for executing an application utilizing distributed objects
JP6981521B1 (en) * 2020-12-08 2021-12-15 Ｊｆｅスチール株式会社 Residual stress calculation method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8185578B2 (en) 1999-09-14 2012-05-22 International Business Machines Corporation Client server system and method for executing an application utilizing distributed objects
JP6981521B1 (en) * 2020-12-08 2021-12-15 Ｊｆｅスチール株式会社 Residual stress calculation method
JP2022090698A (en) * 2020-12-08 2022-06-20 Ｊｆｅスチール株式会社 Residual stress calculation method

Similar Documents

Publication Publication Date Title
Ng et al. An initial value method for eigenvalue problems using compound matrices
DE3581937D1 (en) METHOD FOR PRODUCING MODULES CONTAINING PACKED INTEGRATED CIRCUITS.
ATA331479A (en) METHOD FOR PRODUCING LIQUID, STORAGE-STABLE METHYLENE BIS (PHENYLISOCYANATE)
Mecke et al. The development of the dislocation structures during the fatigue process of FCC single crystals
JPS6411339A (en) Stress analysis of semiconductor device
Santarelli Numerical analysis of the regularized long-wave equation: anelastic collision of solitary waves
DE3485152D1 (en) METHOD FOR PRODUCING POLYOLS BY FERTILIZING SUGARS IN INDUSTRIAL SCOPE.
DE3782365D1 (en) METHOD FOR THE MUTAGENESIS BY AN OLIGONUCLEOTIDE-GUIDED REPAIR OF A STRAND BREAK.
EP0383164A3 (en) High-strength ceramic composite, method of making same and its use
DE3574745D1 (en) METHOD AND DEVICE FOR PRODUCING SINGLE CRYSTALS FROM III-V SEMICONDUCTOR CONNECTIONS.
DE3776860D1 (en) METHOD FOR PRODUCING THE SMALLEST, AMORPHOUS METAL PHOSPHATE PARTICLES.
DE3482868D1 (en) METHOD FOR PRODUCING MOLDED PARTS BY THE COLDBOX METHOD AND MOLDING TOOL.
DE3485151D1 (en) METHOD FOR PRODUCING POLYOLS BY FERTILIZING SUGARS IN INDUSTRIAL SCOPE.
JPS52127007A (en) Voice recognition method
SOEDERLIND DASP 3: A program for the numerical integration of partitioned stiff ordinary differential equations and differential algebraic systems
Das Point-wise availability of an electronic system with reduced efficiency class of components
AT360502B (en) METHOD FOR PRODUCING 1,4-DICYANOBUTEN BY DIMERIZING ACRYLNITRILE
JPS5324255A (en) Waveform shaping circuit
Orensanz et al. Post-catastrophic benthic recovery: Process and management implications.
PT66508B (en) SUBSTITUTED PYRIMIDIN-BIS - / (THIONO) (THIOL) -PHOSPHOR- (PHOSPHONO) -ESRESTERS / METHOD FOR THE PRODUCTION THEREOF AND THEIR USE AS INSECTICIDES AND ACARICIDES
Englert et al. A planning expert system for part setup and workholding.
DE3482384D1 (en) NEW METHOD FOR PRODUCING CONNECTIONS FROM THE 4-OXODAMASCON RANGE AND NEW FRAGRANCES FROM THIS CLASS.
Maruyasu et al. A study on fore evaluation in earth design by simulation model
JPS55166740A (en) Addition system
JPS5687111A (en) Control method for oscillating board