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JPS5376748A - Forming method of insulation fulm - Google Patents

Forming method of insulation fulm

Info

Publication number
JPS5376748A
JPS5376748A JP15190676A JP15190676A JPS5376748A JP S5376748 A JPS5376748 A JP S5376748A JP 15190676 A JP15190676 A JP 15190676A JP 15190676 A JP15190676 A JP 15190676A JP S5376748 A JPS5376748 A JP S5376748A
Authority
JP
Japan
Prior art keywords
fulm
insulation
forming method
liqudi
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15190676A
Other languages
Japanese (ja)
Other versions
JPS557698B2 (en
Inventor
Takashi Nao
Ryosuke Namazu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15190676A priority Critical patent/JPS5376748A/en
Publication of JPS5376748A publication Critical patent/JPS5376748A/en
Publication of JPS557698B2 publication Critical patent/JPS557698B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To evenly distribute liqudi form insulation material by blowing air in coating said material on substrate surface.
COPYRIGHT: (C)1978,JPO&Japio
JP15190676A 1976-12-20 1976-12-20 Forming method of insulation fulm Granted JPS5376748A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15190676A JPS5376748A (en) 1976-12-20 1976-12-20 Forming method of insulation fulm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15190676A JPS5376748A (en) 1976-12-20 1976-12-20 Forming method of insulation fulm

Publications (2)

Publication Number Publication Date
JPS5376748A true JPS5376748A (en) 1978-07-07
JPS557698B2 JPS557698B2 (en) 1980-02-27

Family

ID=15528768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15190676A Granted JPS5376748A (en) 1976-12-20 1976-12-20 Forming method of insulation fulm

Country Status (1)

Country Link
JP (1) JPS5376748A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821833A (en) * 1981-07-31 1983-02-08 Nec Corp Apparatus for manufacturing semiconductor device
US4487871A (en) * 1982-08-05 1984-12-11 Chisso Corporation Polyolefin resin composition
JPS6089925A (en) * 1983-09-06 1985-05-20 エナ−ジ−・コンバ−シヨン・デバイセス・インコ−ポレ−テツド Method of forming large surface area integrated circuit
US5116250A (en) * 1987-09-18 1992-05-26 Tokyo Ohka Kogyo Co., Ltd. Method and apparatus for applying a coating material to a substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3239182B1 (en) 2014-12-25 2020-02-12 Kuraray Co., Ltd. Modified liquid diene rubber, and resin composition containing said modified liquid diene rubber

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS503783A (en) * 1973-05-16 1975-01-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS503783A (en) * 1973-05-16 1975-01-16

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821833A (en) * 1981-07-31 1983-02-08 Nec Corp Apparatus for manufacturing semiconductor device
US4487871A (en) * 1982-08-05 1984-12-11 Chisso Corporation Polyolefin resin composition
JPS6089925A (en) * 1983-09-06 1985-05-20 エナ−ジ−・コンバ−シヨン・デバイセス・インコ−ポレ−テツド Method of forming large surface area integrated circuit
JPH0510817B2 (en) * 1983-09-06 1993-02-10 Enaajii Konbaajon Debaisesu Inc
US5116250A (en) * 1987-09-18 1992-05-26 Tokyo Ohka Kogyo Co., Ltd. Method and apparatus for applying a coating material to a substrate

Also Published As

Publication number Publication date
JPS557698B2 (en) 1980-02-27

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