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JPS53148979A - Heat transfer connector - Google Patents

Heat transfer connector

Info

Publication number
JPS53148979A
JPS53148979A JP3980878A JP3980878A JPS53148979A JP S53148979 A JPS53148979 A JP S53148979A JP 3980878 A JP3980878 A JP 3980878A JP 3980878 A JP3980878 A JP 3980878A JP S53148979 A JPS53148979 A JP S53148979A
Authority
JP
Japan
Prior art keywords
heat
heat transfer
sink
sufficient
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3980878A
Other languages
English (en)
Other versions
JPS5633862B2 (ja
Inventor
Shii Chiyuu Richiyaado
Eichi Iiton Jieemusu
Ii Miigaa Rarufu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS53148979A publication Critical patent/JPS53148979A/ja
Publication of JPS5633862B2 publication Critical patent/JPS5633862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/051—Heat exchange having expansion and contraction relieving or absorbing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12201—Width or thickness variation or marginal cuts repeating longitudinally
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP3980878A 1977-05-31 1978-04-06 Heat transfer connector Granted JPS53148979A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/801,893 US4156458A (en) 1977-05-31 1977-05-31 Flexible thermal connector for enhancing conduction cooling

Publications (2)

Publication Number Publication Date
JPS53148979A true JPS53148979A (en) 1978-12-26
JPS5633862B2 JPS5633862B2 (ja) 1981-08-06

Family

ID=25182292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3980878A Granted JPS53148979A (en) 1977-05-31 1978-04-06 Heat transfer connector

Country Status (5)

Country Link
US (1) US4156458A (ja)
JP (1) JPS53148979A (ja)
DE (1) DE2823296A1 (ja)
FR (1) FR2393425A1 (ja)
GB (1) GB1598174A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58200560A (ja) * 1982-05-18 1983-11-22 Mitsubishi Electric Corp 半導体装置

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4312012A (en) * 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4385310A (en) * 1978-03-22 1983-05-24 General Electric Company Structured copper strain buffer
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4235283A (en) * 1979-12-17 1980-11-25 International Business Machines Corporation Multi-stud thermal conduction module
US4263965A (en) * 1980-01-21 1981-04-28 International Business Machines Corporation Leaved thermal cooling module
DE3031912A1 (de) * 1980-08-23 1982-04-01 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung zur potentialunabhaengigen waermeabfuehrung
US4415025A (en) * 1981-08-10 1983-11-15 International Business Machines Corporation Thermal conduction element for semiconductor devices
DE3212592C2 (de) * 1982-04-03 1984-01-12 Philips Kommunikations Industrie AG, 8500 Nürnberg Kühleinrichtung für Geräte der Nachrichtentechnik
US4450505A (en) * 1982-06-09 1984-05-22 Sperry Corporation Apparatus for cooling integrated circuit chips
US4485429A (en) * 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US4468717A (en) * 1982-06-09 1984-08-28 Sperry Corporation Apparatus for cooling integrated circuit chips
US4448240A (en) * 1982-12-20 1984-05-15 International Business Machines Corporation Telescoping thermal conduction element for cooling semiconductor devices
US4551787A (en) * 1983-02-07 1985-11-05 Sperry Corporation Apparatus for use in cooling integrated circuit chips
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
CA1227886A (en) * 1984-01-26 1987-10-06 Haruhiko Yamamoto Liquid-cooling module system for electronic circuit components
JPS60260289A (ja) * 1984-06-07 1985-12-23 Matsushita Electric Ind Co Ltd 電話回線表示装置及びそれを有する電話機
US4730666A (en) * 1986-04-30 1988-03-15 International Business Machines Corporation Flexible finned heat exchanger
US4964458A (en) * 1986-04-30 1990-10-23 International Business Machines Corporation Flexible finned heat exchanger
US4759403A (en) * 1986-04-30 1988-07-26 International Business Machines Corp. Hydraulic manifold for water cooling of multi-chip electric modules
DE3722119A1 (de) * 1987-07-03 1989-01-12 Siemens Ag Schaltungsmodul mit einem plattenfoermigen schaltungstraeger aus glas oder keramik
JPS6451856A (en) * 1987-08-24 1989-02-28 Tamura Electric Works Ltd Telephone exchange system
DE3738897A1 (de) * 1987-11-17 1989-05-24 Standard Elektrik Lorenz Ag Waermeleitendes verbindungselement fuer elektrische bauelemente
US5005638A (en) * 1988-10-31 1991-04-09 International Business Machines Corporation Thermal conduction module with barrel shaped piston for improved heat transfer
CA2002213C (en) * 1988-11-10 1999-03-30 Iwona Turlik High performance integrated circuit chip package and method of making same
FR2639764B1 (fr) * 1988-11-25 1994-06-10 Nec Corp Structure pour refroidir des composants generateurs de chaleur
US4993482A (en) * 1990-01-09 1991-02-19 Microelectronics And Computer Technology Corporation Coiled spring heat transfer element
US5201866A (en) * 1992-02-03 1993-04-13 International Business Machines Corporation Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
US5159531A (en) * 1992-02-28 1992-10-27 International Business Machines Corporation Multiple radial finger contact cooling device
GB9218233D0 (en) * 1992-08-27 1992-10-14 Dsk Technology International L Cooling of electronics equipment
US5270902A (en) * 1992-12-16 1993-12-14 International Business Machines Corporation Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip
DE4312057A1 (de) * 1993-04-13 1993-10-14 Siegmund Maettig Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung
US5557501A (en) * 1994-11-18 1996-09-17 Tessera, Inc. Compliant thermal connectors and assemblies incorporating the same
DE19640650A1 (de) * 1996-10-02 1998-04-09 Ego Elektro Geraetebau Gmbh Wärmeerzeugende Baugruppe mit wärmeleitender Verbindungsschicht zwischen Wärmequelle und Wärmesenke
US6411513B1 (en) * 1999-12-10 2002-06-25 Jacques Normand Bedard Compliant thermal interface devices and method of making the devices
JP3280954B2 (ja) * 2000-06-02 2002-05-13 株式会社東芝 回路モジュール及び回路モジュールを搭載した電子機器
US20020134513A1 (en) * 2001-03-22 2002-09-26 David Palagashvili Novel thermal transfer apparatus
US7532475B2 (en) * 2006-03-30 2009-05-12 International Business Machines Corporation Semiconductor chip assembly with flexible metal cantilevers
EP2012574A1 (en) * 2006-04-24 2009-01-07 Sumitomo Electric Industries, Ltd. Heat transfer member, protruding structural member, electronic device, and electric product
JP4903067B2 (ja) * 2007-02-20 2012-03-21 パナソニック株式会社 固体撮像素子の放熱構造
US8289712B2 (en) 2010-06-21 2012-10-16 International Business Machines Corporation Flux-free detachable thermal interface between an integrated circuit device and a heat sink
US9271427B2 (en) * 2012-11-28 2016-02-23 Hamilton Sundstrand Corporation Flexible thermal transfer strips
WO2015026704A1 (en) * 2013-08-21 2015-02-26 Graftech International Holdings Inc. Mechanically isolated thermal link
US11177192B2 (en) * 2018-09-27 2021-11-16 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device including heat dissipation structure and fabricating method of the same
CN113257759A (zh) * 2020-02-10 2021-08-13 华为技术有限公司 散热器、单板、电子设备及制造方法
US20220015262A1 (en) 2020-07-09 2022-01-13 Intel Corporation Technologies for dynamic cooling in a multi-chip package with programmable impingement valves
US12069834B2 (en) * 2021-09-07 2024-08-20 Inventec (Pudong) Technology Corporation Heat dissipation system and electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1057241B (de) * 1955-12-12 1959-05-14 Siemens Ag Gleichrichteranordnung mit Halbleiterelement
DE1539271A1 (de) * 1966-10-13 1969-12-04 Messerschmitt Boelkow Blohm Einrichtung zur elastischen und waermeleitenden Verbindung der kalten Enden von Thermoelementen eines Thermogenerators mit einem Radiator
US3545535A (en) * 1968-10-10 1970-12-08 Harold A Hinkens Stud mounted diode
US3851173A (en) * 1973-06-25 1974-11-26 Texas Instruments Inc Thermal energy receiver

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58200560A (ja) * 1982-05-18 1983-11-22 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
DE2823296A1 (de) 1978-12-14
GB1598174A (en) 1981-09-16
FR2393425A1 (fr) 1978-12-29
FR2393425B1 (ja) 1980-03-14
US4156458A (en) 1979-05-29
JPS5633862B2 (ja) 1981-08-06

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