JPS5312541A - Ebullition cooling device - Google Patents
Ebullition cooling deviceInfo
- Publication number
- JPS5312541A JPS5312541A JP8697876A JP8697876A JPS5312541A JP S5312541 A JPS5312541 A JP S5312541A JP 8697876 A JP8697876 A JP 8697876A JP 8697876 A JP8697876 A JP 8697876A JP S5312541 A JPS5312541 A JP S5312541A
- Authority
- JP
- Japan
- Prior art keywords
- cooling device
- ebullition
- ebullition cooling
- cooling
- zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Measuring And Other Instruments (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To make compact an ebullition cooling device by increasing the heat processing capacity of the liquid refrigerant by cooling not only the condensation zone but the liquid phase zone.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8697876A JPS5312541A (en) | 1976-07-20 | 1976-07-20 | Ebullition cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8697876A JPS5312541A (en) | 1976-07-20 | 1976-07-20 | Ebullition cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5312541A true JPS5312541A (en) | 1978-02-04 |
Family
ID=13901952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8697876A Pending JPS5312541A (en) | 1976-07-20 | 1976-07-20 | Ebullition cooling device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5312541A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60163966A (en) * | 1984-02-06 | 1985-08-26 | Shin Etsu Chem Co Ltd | Heat-resistant organopolysiloxane composition |
JPS6285448A (en) * | 1985-10-09 | 1987-04-18 | Fujitsu Ltd | Cooling structure for semiconductor device |
US6019167A (en) * | 1997-12-19 | 2000-02-01 | Nortel Networks Corporation | Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments |
US6148905A (en) * | 1999-04-30 | 2000-11-21 | Motorola, Inc. | Two-phase thermosyphon including air feed through slots |
JP2018194211A (en) * | 2017-05-16 | 2018-12-06 | 富士通株式会社 | Cooling device, electronic device, and cooling system |
-
1976
- 1976-07-20 JP JP8697876A patent/JPS5312541A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60163966A (en) * | 1984-02-06 | 1985-08-26 | Shin Etsu Chem Co Ltd | Heat-resistant organopolysiloxane composition |
JPS6325023B2 (en) * | 1984-02-06 | 1988-05-24 | Shinetsu Chem Ind Co | |
JPS6285448A (en) * | 1985-10-09 | 1987-04-18 | Fujitsu Ltd | Cooling structure for semiconductor device |
JPH0365901B2 (en) * | 1985-10-09 | 1991-10-15 | ||
US6019167A (en) * | 1997-12-19 | 2000-02-01 | Nortel Networks Corporation | Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments |
US6148905A (en) * | 1999-04-30 | 2000-11-21 | Motorola, Inc. | Two-phase thermosyphon including air feed through slots |
JP2018194211A (en) * | 2017-05-16 | 2018-12-06 | 富士通株式会社 | Cooling device, electronic device, and cooling system |
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