JPS53108872U - - Google Patents
Info
- Publication number
- JPS53108872U JPS53108872U JP1384377U JP1384377U JPS53108872U JP S53108872 U JPS53108872 U JP S53108872U JP 1384377 U JP1384377 U JP 1384377U JP 1384377 U JP1384377 U JP 1384377U JP S53108872 U JPS53108872 U JP S53108872U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1384377U JPS53108872U (en) | 1977-02-07 | 1977-02-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1384377U JPS53108872U (en) | 1977-02-07 | 1977-02-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53108872U true JPS53108872U (en) | 1978-08-31 |
Family
ID=28832671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1384377U Pending JPS53108872U (en) | 1977-02-07 | 1977-02-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53108872U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017175612A1 (en) * | 2016-04-04 | 2017-10-12 | 三菱電機株式会社 | Power module, power semiconductor device, and power module manufacturing method |
-
1977
- 1977-02-07 JP JP1384377U patent/JPS53108872U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017175612A1 (en) * | 2016-04-04 | 2017-10-12 | 三菱電機株式会社 | Power module, power semiconductor device, and power module manufacturing method |
JPWO2017175612A1 (en) * | 2016-04-04 | 2018-07-26 | 三菱電機株式会社 | Power module, power semiconductor device, and power module manufacturing method |
US10461010B2 (en) | 2016-04-04 | 2019-10-29 | Mitsubishi Electric Corporation | Power module, power semiconductor device and power module manufacturing method |