JPS5229851A - Epoxy resin composition for press molding and its preparation - Google Patents
Epoxy resin composition for press molding and its preparationInfo
- Publication number
- JPS5229851A JPS5229851A JP10594575A JP10594575A JPS5229851A JP S5229851 A JPS5229851 A JP S5229851A JP 10594575 A JP10594575 A JP 10594575A JP 10594575 A JP10594575 A JP 10594575A JP S5229851 A JPS5229851 A JP S5229851A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- preparation
- resin composition
- press molding
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title abstract 2
- 229920000647 polyepoxide Polymers 0.000 title abstract 2
- 238000000465 moulding Methods 0.000 title 1
- 238000002360 preparation method Methods 0.000 title 1
- 150000008065 acid anhydrides Chemical class 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: The titled composition useful for sealing light emitting elements, having good transparency, shelf life, heat resistance and comprising an epoxy resin, an acid anhydride as curing agent, and a curing catalyst.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10594575A JPS5229851A (en) | 1975-09-03 | 1975-09-03 | Epoxy resin composition for press molding and its preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10594575A JPS5229851A (en) | 1975-09-03 | 1975-09-03 | Epoxy resin composition for press molding and its preparation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5229851A true JPS5229851A (en) | 1977-03-07 |
| JPS5413280B2 JPS5413280B2 (en) | 1979-05-29 |
Family
ID=14420972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10594575A Granted JPS5229851A (en) | 1975-09-03 | 1975-09-03 | Epoxy resin composition for press molding and its preparation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5229851A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60154954A (en) * | 1984-01-23 | 1985-08-14 | 象印ベビ−株式会社 | Baby car |
| JPS6437769U (en) * | 1987-08-29 | 1989-03-07 | ||
| JPH0669259A (en) * | 1993-06-14 | 1994-03-11 | Nitto Denko Corp | Resin tablet for sealing semiconductor |
-
1975
- 1975-09-03 JP JP10594575A patent/JPS5229851A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60154954A (en) * | 1984-01-23 | 1985-08-14 | 象印ベビ−株式会社 | Baby car |
| JPH055704B2 (en) * | 1984-01-23 | 1993-01-22 | Zojirushi Baby Co Ltd | |
| JPS6437769U (en) * | 1987-08-29 | 1989-03-07 | ||
| JPH0669259A (en) * | 1993-06-14 | 1994-03-11 | Nitto Denko Corp | Resin tablet for sealing semiconductor |
| JP2576018B2 (en) * | 1993-06-14 | 1997-01-29 | 日東電工株式会社 | Resin tablet for semiconductor encapsulation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5413280B2 (en) | 1979-05-29 |
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