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JPS5227205A - Print wiring equipmen and its manufacturing method - Google Patents

Print wiring equipmen and its manufacturing method

Info

Publication number
JPS5227205A
JPS5227205A JP10278175A JP10278175A JPS5227205A JP S5227205 A JPS5227205 A JP S5227205A JP 10278175 A JP10278175 A JP 10278175A JP 10278175 A JP10278175 A JP 10278175A JP S5227205 A JPS5227205 A JP S5227205A
Authority
JP
Japan
Prior art keywords
equipmen
manufacturing
print wiring
print
conducting material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10278175A
Other languages
Japanese (ja)
Inventor
Takeshi Imai
Hitoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP10278175A priority Critical patent/JPS5227205A/en
Publication of JPS5227205A publication Critical patent/JPS5227205A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Receivers (AREA)

Abstract

PURPOSE:To obtain economical print wiring equipment which can print electric circuits on an insulation board with paste conducting material and form insulation film all over except at junction sections.
JP10278175A 1975-08-25 1975-08-25 Print wiring equipmen and its manufacturing method Pending JPS5227205A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10278175A JPS5227205A (en) 1975-08-25 1975-08-25 Print wiring equipmen and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10278175A JPS5227205A (en) 1975-08-25 1975-08-25 Print wiring equipmen and its manufacturing method

Publications (1)

Publication Number Publication Date
JPS5227205A true JPS5227205A (en) 1977-03-01

Family

ID=14336675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10278175A Pending JPS5227205A (en) 1975-08-25 1975-08-25 Print wiring equipmen and its manufacturing method

Country Status (1)

Country Link
JP (1) JPS5227205A (en)

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