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JPS5222078A - Insulating board for plating - Google Patents

Insulating board for plating

Info

Publication number
JPS5222078A
JPS5222078A JP9873675A JP9873675A JPS5222078A JP S5222078 A JPS5222078 A JP S5222078A JP 9873675 A JP9873675 A JP 9873675A JP 9873675 A JP9873675 A JP 9873675A JP S5222078 A JPS5222078 A JP S5222078A
Authority
JP
Japan
Prior art keywords
insulating board
plating
releasable
physically
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9873675A
Other languages
Japanese (ja)
Other versions
JPS5411354B2 (en
Inventor
Hirotoshi Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP9873675A priority Critical patent/JPS5222078A/en
Publication of JPS5222078A publication Critical patent/JPS5222078A/en
Publication of JPS5411354B2 publication Critical patent/JPS5411354B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: An insulating board for plating coated with metallic foil releasable physically, suitable for manufacturing printed circuit boards by the additive process.
COPYRIGHT: (C)1977,JPO&Japio
JP9873675A 1975-08-13 1975-08-13 Insulating board for plating Granted JPS5222078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9873675A JPS5222078A (en) 1975-08-13 1975-08-13 Insulating board for plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9873675A JPS5222078A (en) 1975-08-13 1975-08-13 Insulating board for plating

Publications (2)

Publication Number Publication Date
JPS5222078A true JPS5222078A (en) 1977-02-19
JPS5411354B2 JPS5411354B2 (en) 1979-05-14

Family

ID=14227782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9873675A Granted JPS5222078A (en) 1975-08-13 1975-08-13 Insulating board for plating

Country Status (1)

Country Link
JP (1) JPS5222078A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173155A (en) * 1981-04-18 1982-10-25 Toshiba Chem Prod Manufacture of laminated board for chemical plating

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946430A (en) * 1982-09-10 1984-03-15 Daikin Ind Ltd Structure of emergency switch cover for indoor unit of air conditioner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173155A (en) * 1981-04-18 1982-10-25 Toshiba Chem Prod Manufacture of laminated board for chemical plating

Also Published As

Publication number Publication date
JPS5411354B2 (en) 1979-05-14

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