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JPS5152277A - Handotaisochi - Google Patents

Handotaisochi

Info

Publication number
JPS5152277A
JPS5152277A JP10878774A JP10878774A JPS5152277A JP S5152277 A JPS5152277 A JP S5152277A JP 10878774 A JP10878774 A JP 10878774A JP 10878774 A JP10878774 A JP 10878774A JP S5152277 A JPS5152277 A JP S5152277A
Authority
JP
Japan
Prior art keywords
handota
isochi
handota isochi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10878774A
Other languages
English (en)
Other versions
JPS5341066B2 (ja
Inventor
Mitsusachi Matsuzaki
Takeshi Sasaki
Kensuke Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10878774A priority Critical patent/JPS5152277A/ja
Publication of JPS5152277A publication Critical patent/JPS5152277A/ja
Publication of JPS5341066B2 publication Critical patent/JPS5341066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP10878774A 1974-09-24 1974-09-24 Handotaisochi Granted JPS5152277A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10878774A JPS5152277A (ja) 1974-09-24 1974-09-24 Handotaisochi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10878774A JPS5152277A (ja) 1974-09-24 1974-09-24 Handotaisochi

Publications (2)

Publication Number Publication Date
JPS5152277A true JPS5152277A (ja) 1976-05-08
JPS5341066B2 JPS5341066B2 (ja) 1978-10-31

Family

ID=14493458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10878774A Granted JPS5152277A (ja) 1974-09-24 1974-09-24 Handotaisochi

Country Status (1)

Country Link
JP (1) JPS5152277A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06146704A (ja) * 1992-11-06 1994-05-27 Nippon Doaachietsuku Seizo Kk ドアクローザ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370207A (en) * 1964-02-24 1968-02-20 Gen Electric Multilayer contact system for semiconductor devices including gold and copper layers
US3633076A (en) * 1966-03-19 1972-01-04 Siemens Ag Three layer metallic contact strip at a semiconductor structural component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370207A (en) * 1964-02-24 1968-02-20 Gen Electric Multilayer contact system for semiconductor devices including gold and copper layers
US3633076A (en) * 1966-03-19 1972-01-04 Siemens Ag Three layer metallic contact strip at a semiconductor structural component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06146704A (ja) * 1992-11-06 1994-05-27 Nippon Doaachietsuku Seizo Kk ドアクローザ

Also Published As

Publication number Publication date
JPS5341066B2 (ja) 1978-10-31

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