JPS5978592A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JPS5978592A JPS5978592A JP18739582A JP18739582A JPS5978592A JP S5978592 A JPS5978592 A JP S5978592A JP 18739582 A JP18739582 A JP 18739582A JP 18739582 A JP18739582 A JP 18739582A JP S5978592 A JPS5978592 A JP S5978592A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- less
- flexible printed
- printed board
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はフレキシブルプリント板の改良に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in flexible printed boards.
可撓性の絶縁基板に回路導体をプリントしもしくは貼り
合わせてなるフレキシブルプリント板を屈曲性の見地か
ら大別すると次のとおりである。Flexible printed boards, which are made by printing or pasting circuit conductors on a flexible insulating board, can be broadly classified as follows from the viewpoint of flexibility.
（１）組立時に曲げた一１ｈ固定して使用するもの（２
）加工、調整時や使用時にくり返し何回も屈曲されるも
の
（３）駆動系統（例えばプリンターのヘッド部分等）に
使用され、１万回〜１００万回以上の屈曲がくり返され
るもの。(1) One that is bent during assembly and used by fixing it for 1 hour (2
) Items that are repeatedly bent many times during processing, adjustment, or use. (3) Items that are used in drive systems (for example, printer heads, etc.) and are bent 10,000 to 1,000,000 times or more.
上記に於て、（１）及び（２）の場合はガラス布基材に
エポキシ樹脂を含浸したもの、ポリエチレンテレフタレ
ート又はポリイミド等の可撓性の絶縁フィルムもしくは
シートに電解鋼箔からなる回路を貼シ着けた物が多く使
用されており、又（３）の場合はポリエチレンテレフタ
レート又はポリイミド等の可撓性ゾシスチツクフイルム
に圧延銅箔（焼鈍材）を貼シ合わせた物を使用している
が、１万〜１００万回の屈曲では回路にひび割れ等が発
生することがあシなお一層の改良が望まれていた。In the above cases, in the case of (1) and (2), a circuit made of electrolytic steel foil is attached to a flexible insulating film or sheet made of glass cloth substrate impregnated with epoxy resin, polyethylene terephthalate, polyimide, etc. In the case of (3), a flexible zodiac film made of polyethylene terephthalate or polyimide is laminated with rolled copper foil (annealed material). However, when the circuit is bent 10,000 to 1,000,000 times, cracks occur in the circuit, and further improvements have been desired.
本発明者等の種々検討の結果、回路導体を構成する金属
箔は、電解箔よシも、圧延・焼鈍箔が有望と思われ、こ
れに使用される金属は、耐屈曲性の良い銅合金で例えば
Ｃｕ−Ｓｎ合金ではＳｎ ２％以下を含み、Ｃｕ−Ｃ
ｄ合金ではｃａ ２％以下を含み。As a result of various studies conducted by the inventors, it seems that as well as electrolytic foil, rolled/annealed foil is a promising metal foil for circuit conductors, and the metal used for this is a copper alloy with good bending resistance. For example, Cu-Sn alloy contains 2% or less of Sn, and Cu-C
The d alloy contains ca 2% or less.
Ｃｕ−０ｒ合金ではＯｒ ２％以下を含み、Ｃｕ−Ａ
ｇ合金ではＡｇ Ｓ俤以下を含°み、その他Ｃ！ｕ−
Ｏｒ−Ｚｒ 合金ではＯｒ Ｃ１，６％以下、Ｚｒ
、 ０．２チ以下を含む。Cu-0r alloy contains 2% or less of Or, and Cu-A
G-alloys include Ag S 俤 and below, and others C! u-
In Or-Zr alloy, Or C1.6% or less, Zr
, including 0.2 inch or less.
なお、このような合金について更に詳述すれば、前記合
金中鍋Ｃｕ 以外の成分の成分比は回路用の金属板製造
上及び導電率の点から定められたもので、板（圧延回路
剤）を製造する上からは添加元素がこれ以上多くなると
変形抵抗の増加により圧延が困難になシ、導電率は添加
元素によシ大幅に異なるも、それぞれの合金では、なる
べく優れた導電率を保持するようにしたもので、前記配
合の合金では下表の通シである。In addition, to explain in more detail about such an alloy, the component ratio of the components other than Cu in the alloy pot is determined from the viewpoint of manufacturing metal plates for circuits and electrical conductivity. From the point of view of manufacturing, if the number of added elements increases, the deformation resistance increases, making rolling difficult.Although the electrical conductivity varies greatly depending on the added elements, each alloy maintains as good electrical conductivity as possible. The alloys with the above composition are as shown in the table below.
又、本発明に用いられる導体箔と従来の回路用導体箔（
軟鋼剤）の平面曲げ疲労試験の結果を表示すれば下表の
通りで本発明で用いられる合金板は従来の軟鋼剤よシ格
段に優れ、従って屈曲に対して耐え得るフレキシブルプ
リント板を提供することを示している。Furthermore, the conductor foil used in the present invention and the conventional conductor foil for circuits (
The results of the plane bending fatigue test of the mild steel agent) are shown in the table below, and the alloy plate used in the present invention is far superior to the conventional mild steel agent, and therefore provides a flexible printed board that can withstand bending. It is shown that.
データ［１０７回平面白げくシ返し数で破壊しない限界
の応力を疲労限で示す。Data [Fatigue limit is the limit stress that does not result in failure after 107 flat-plane turning cycles.
これによれば本発明の実施例はいづれも〈シ返し曲げに
強くなっていることが理解される。According to this, it is understood that all of the embodiments of the present invention are resistant to reverse bending.
又、本発明で用いる合金とＴ、ｐ、ｃ （タフピッチ銅
）の応力Ｓ Ｋｇ ／ Ｎｍ ２と平面曲げ疲労特性曲
線、示せば添付図の通シで、Ｔ、 Ｐ、 ｃは小さい応
ノｊで破壊するが、本発明で用いる合金はいづれも相当
大きな応力レベルである。In addition, the stress S Kg / Nm 2 and plane bending fatigue characteristic curve of the alloy used in the present invention and T, p, c (tough pitch copper), as shown in the attached drawing, T, P, c are small stress However, the alloys used in the present invention all have fairly high stress levels.
従って本発明によるフレキシブルプリント板の回路は、
このような合金で導体が構成されているので１万回〜１
００万回以上の屈曲をなされる駆動系統でも長期に亘９
安全に使用することカニ可肯目である。Therefore, the circuit of the flexible printed board according to the present invention is
Since the conductor is made of such an alloy, it can be used for 10,000 to 1
Even drive systems that are bent over 1,000,000 times will last for a long time9.
It is safe to use.
図はタフピッチ銅及び本発明で用いる合金の平面曲は疲
労特性曲線を示す。
代理人 弁理士 竹 内 守The figure shows the plane curve fatigue characteristic curves of tough pitch copper and the alloy used in the present invention. Agent Patent Attorney Mamoru Takeuchi
Claims (2)
金からなる圧延焼鈍剤からなる回路導体が貼着されてい
ることを特徴とするフレキシブルプリント板(1) A flexible printed board characterized in that a circuit conductor made of a rolling annealing agent made of a copper alloy with excellent bending resistance is attached to a flexible base film.
Ｓｎ ２％以下）、Ｃｕ−Ｃｄ合金（但しｃｄ ２％
以下、Ｃｕ−０ｒ合金（但しＯｒ ２％以下）、Ｏｕ−
Ａｇ合金（但しＡｇ ５％以下）又はＯｕ、−０ｒ−
Ｚｒ （但しＯｒｏ、６％以下、Ｚｒ９２％以下）か
ら選択されていることを特徴とする特許請求の範囲第１
項記載のフレキシブルプリント板(2) Copper alloy with excellent bending resistance, 0u-8u alloy (however, Sn 2% or less), Cu-Cd alloy (however CD 2%)
Below, Cu-0r alloy (however, Or 2% or less), Ou-
Ag alloy (however, Ag 5% or less) or Ou, -0r-
Claim 1, characterized in that Zr (however, Oro, 6% or less, Zr 92% or less)
Flexible printed board described in section
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18739582A JPS5978592A (en) | 1982-10-27 | 1982-10-27 | Flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18739582A JPS5978592A (en) | 1982-10-27 | 1982-10-27 | Flexible printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5978592A true JPS5978592A (en) | 1984-05-07 |
| JPH0254675B2 JPH0254675B2 (en) | 1990-11-22 |
Family
ID=16205273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18739582A Granted JPS5978592A (en) | 1982-10-27 | 1982-10-27 | Flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5978592A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63310931A (en) * | 1987-06-10 | 1988-12-19 | Furukawa Electric Co Ltd:The | Copper alloy for flexible print |
| JPS6456841A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
| JPS6456842A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5027715A (en) * | 1973-07-13 | 1975-03-22 | ||
| JPS5216422A (en) * | 1975-07-29 | 1977-02-07 | Sumitomo Electric Ind Ltd | High strength copper alloy for electric conductor |
| JPS5389662A (en) * | 1977-01-19 | 1978-08-07 | Sumitomo Electric Ind Ltd | Material for lead frame of semiconductor device |
| JPS54110466A (en) * | 1978-02-17 | 1979-08-29 | Kanegafuchi Chemical Ind | Flexible printed circuit board with improved bend proofing strength |
| JPS5526649A (en) * | 1978-08-16 | 1980-02-26 | Tamagawa Kikai Kinzoku Kk | Lead material for semiconductor |
| JPS55145159A (en) * | 1979-04-12 | 1980-11-12 | Furukawa Kinzoku Kogyo Kk | Manufacture of copper foil with superior flexibility for printed wiring plate |
| JPS5620136A (en) * | 1979-07-30 | 1981-02-25 | Toshiba Corp | Copper alloy member |
| JPS56167357A (en) * | 1980-05-27 | 1981-12-23 | Sharp Corp | Tape carrier substrate for semiconductor device |
| JPS5735267A (en) * | 1980-08-11 | 1982-02-25 | Hitachi Ltd | Refrigerating plant |
| JPS57154310A (en) * | 1981-03-18 | 1982-09-24 | Furukawa Electric Co Ltd:The | Manufacture of small-gauge conductive copper-wire having high strength and excellent flexibility |
-
1982
- 1982-10-27 JP JP18739582A patent/JPS5978592A/en active Granted
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5027715A (en) * | 1973-07-13 | 1975-03-22 | ||
| JPS5216422A (en) * | 1975-07-29 | 1977-02-07 | Sumitomo Electric Ind Ltd | High strength copper alloy for electric conductor |
| JPS5389662A (en) * | 1977-01-19 | 1978-08-07 | Sumitomo Electric Ind Ltd | Material for lead frame of semiconductor device |
| JPS54110466A (en) * | 1978-02-17 | 1979-08-29 | Kanegafuchi Chemical Ind | Flexible printed circuit board with improved bend proofing strength |
| JPS5526649A (en) * | 1978-08-16 | 1980-02-26 | Tamagawa Kikai Kinzoku Kk | Lead material for semiconductor |
| JPS55145159A (en) * | 1979-04-12 | 1980-11-12 | Furukawa Kinzoku Kogyo Kk | Manufacture of copper foil with superior flexibility for printed wiring plate |
| JPS5620136A (en) * | 1979-07-30 | 1981-02-25 | Toshiba Corp | Copper alloy member |
| JPS56167357A (en) * | 1980-05-27 | 1981-12-23 | Sharp Corp | Tape carrier substrate for semiconductor device |
| JPS5735267A (en) * | 1980-08-11 | 1982-02-25 | Hitachi Ltd | Refrigerating plant |
| JPS57154310A (en) * | 1981-03-18 | 1982-09-24 | Furukawa Electric Co Ltd:The | Manufacture of small-gauge conductive copper-wire having high strength and excellent flexibility |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63310931A (en) * | 1987-06-10 | 1988-12-19 | Furukawa Electric Co Ltd:The | Copper alloy for flexible print |
| JPS6456841A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
| JPS6456842A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0254675B2 (en) | 1990-11-22 |
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