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JPS5954237A - Holder for substrate - Google Patents

Holder for substrate

Info

Publication number
JPS5954237A
JPS5954237A JP16384482A JP16384482A JPS5954237A JP S5954237 A JPS5954237 A JP S5954237A JP 16384482 A JP16384482 A JP 16384482A JP 16384482 A JP16384482 A JP 16384482A JP S5954237 A JPS5954237 A JP S5954237A
Authority
JP
Japan
Prior art keywords
substrate
rolling
board
holding member
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16384482A
Other languages
Japanese (ja)
Inventor
Minoru Tanaka
稔 田中
Hitoshi Kubota
仁志 窪田
Susumu Aiuchi
進 相内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16384482A priority Critical patent/JPS5954237A/en
Publication of JPS5954237A publication Critical patent/JPS5954237A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To obtain the substrate holder of high reliability by arranging a sphere among a pair of conical recessed surfaces, a V-shaped groove and a parallel flat surface on a fixing base, supporting a substrate holding member and providing a rolling member being in contact horizontally with the holding member and a horizontal push means. CONSTITUTION:The substrate holding member 1 is supported at three points ABC through the sphere 10 on the fixing base 3. The conical concave surfaces 7 are used at the point A, V-shaped groove surfaces 8 at the point B and the parallel flat surfaces 9 at the point C. Three rolling bearings 11 to the substrate 4 are fitted brought into contact with outer circumferences at the holding positions of the substrate 4 in the substrate holding member 1, and the substrate 4 is pushed against the three bearings 11 by an energizing means 13. According to the constitution, the substrate 4 can be expanded thermally with excellent reproducibility without generating rotary displacement when the substrate is treated, and heat hardly flows out to the holding member 1 from the substrate in addition to the thermal expansion, thus accurately holding the substrate to a fixed reference, then also controlling the temperature of the substrate easily.

Description

【発明の詳細な説明】 本発明や1、基板に蒸着、ヌバッ2等の加工を施−tた
めに該基板を位置ぎめして支持−する基板ホルダに門す
イ)ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention (1) relates to a substrate holder for positioning and supporting a substrate in order to perform processes such as vapor deposition and nubuck treatment on the substrate.

マスクを用い゛C蒸着、スパッタを行う用台、基板およ
びマスクを位向合わせし′C■空中に保持し、基板を2
 [10t:〜400℃に加熱する。この際熱膨張に」
、るf)′1置ずれを生じることを避は難℃・ので、従
来一般に、位置ずれ\J法を予測して予め補正を加え′
C位餡ぎめしてオdく。このため、基板及びマスクを再
現性よく熱ル;脹せしめる必波がある。第1図は基板の
基準点を(X″”l−(t’、きめ・すると共に、該基
板の熱膨張を拘束L 〕、cいように支持するごとく構
成された従来形基板ホルダを示す。
Using a mask, align the table, substrate, and mask for evaporation and sputtering, and hold the substrate in the air.
[10t: Heating to ~400°C. At this time, thermal expansion
, f)'1 It is difficult to avoid the occurrence of misalignment, so conventionally, the misalignment is generally predicted using the J method and corrected in advance.
I'm so excited to be in the C position. For this reason, there is a need to heat the substrate and the mask with good reproducibility. FIG. 1 shows a conventional substrate holder configured to support the substrate at a reference point (X""l-(t'), and to restrain the thermal expansion of the substrate L). .

1け、基板4を直接的に保持J乙部イ゛(で、取イー」
ネジ2によって固定ベース6に固着されでいる。
1. Hold the board 4 directly.
It is fixed to a fixed base 6 with screws 2.

上記の基板保持部利1には、3個のr〜′11バ、きめ
ストッパ5が固定されていて、基板4は板バネ6により
上記の位置きめストッパ5シ乙押しつけられて水一平面
内における(X′l的ぎめが為さ〕1.イ)。これに」
、す、基板4は位置ぎめストッパ5の内f111の面を
水平方向の基準面どしてこれに当接しつつ板バネ6を撓
まぜて熱膨張、収縮し得る構造でk)る。基板4の」−
下方向の位置ぎめは基板保す部第11の土面に当接する
ことに」、って為される。
Three r~'11 bars and a texture stopper 5 are fixed to the substrate holding part 1, and the substrate 4 is pressed against the alignment stopper 5 by a leaf spring 6 in a horizontal plane. In (X'l purpose is made] 1.a). to this"
The substrate 4 has a structure in which it can thermally expand and contract by bending the plate spring 6 while abutting the inner surface f111 of the positioning stopper 5 as a horizontal reference surface. Board 4'-
The downward positioning is such that the substrate retaining part 11 comes into contact with the soil surface.

以上のように構成さAしたiイー米杉の基板ホルダにお
いては次のよ5 ’lx、技術的不具合が有る。
The iE Yonesugi substrate holder constructed as described above has the following technical defects.

(f)  基板4が熱膨張、収縮する際、基板保持部月
1及びストッパ5に対して滑らねげなら1.Cいが、真
空中における摩擦係数は大≦it中の場合に比して数倍
人きく、このため円側ブ、c渭りが妨げられて基板4が
回転方向に変f\γ−Jる。
(f) If the substrate 4 does not slide against the substrate holding part 1 and the stopper 5 when it thermally expands and contracts, 1. However, the coefficient of friction in a vacuum is several times higher than in the case where it is large≦it, which prevents the circular side bends and c from moving and causes the substrate 4 to change in the rotational direction f\γ-J. Ru.

2p、2図は回転方向の変位の状態を拡大t7て描いた
説明ト<1−(: ;ti、す、破線4′は基板保持部
+41に穿った穴を著わし、実線4は回転方向に変位し
た基板な表わしている。基板40回転方向の変位により
、同定基準5は2ケ所での沙、基鈑4と接触し、基板4
をj)丁しく固定基準5に保持することができない。
2p, Figure 2 is an explanatory diagram depicting the state of displacement in the rotational direction with an enlarged t7. Due to the displacement in the direction of rotation of the substrate 40, the identification reference 5 comes into contact with the base plate 4 at two places, and the substrate 4
j) cannot be held exactly at the fixed reference 5.

(ロ)基板4は基板保持部月1に面接触し−C上下方向
の位1バぎめが為さJドCいイ)。このため基板4から
ノiu 4p保持B(財イ1への伝導熱1・1が太きい
。このため基板4の加熱に伴っC基板保持部(利1がJ
Af島し、内iff、 f’lヨのづ、11+)い斤〜
升臂1)員る1−(−子測小能な変(ILを生じろ。ま
l、−1基板/I +;L ;J、に板保持部4”41
に吸熱されイ)ので潟Jft’、 flill Fll
が困却ρC声)る。
(B) The board 4 is brought into surface contact with the board holder 1, and the vertical position is adjusted by one position (J do C a). For this reason, the conduction heat 1.1 from the substrate 4 to the substrate 4p holding part B (material 1) is large. Therefore, as the substrate 4 is heated,
Af island, inner if, f'l yo nozu, 11+) Iko~
1) Includes 1-(-child measurement function change (IL).Ma,-1 board/I +;L;
Since the heat is absorbed by A), the lagoon Jft', flill Fll
(voice of embarrassment).

不発り11(J、土ガ1(の相持(7jりみ−(為さJ
l、井イNが回転変[位を伴わずにF’3− !、lf
、 f’l:、J、(、Qi、J(%’i; 1114
1.、ソn)十、基板から基板イlI冒寺部旧−\の轡
!日・ii; llf ”)小フ、「い基板7j−ルグ
を提供−することを[1的)・す4)。
Misfire 11 (J, Toga 1 (mutual combination) (7j Rimi-(Tamesa J
l, IiN rotates without rotation [F'3-! ,lf
, f'l:,J,(,Qi,J(%'i; 1114
1. , son) 10, from the board to the board II the temple part old-\'s 轡! Japan II; llf'') Small F, ``Providing a suitable substrate 7j-rug.'' 4).

上記の目的な達成するため、本発明の基板ホルダは、基
板各f’+4持する部f4と肖該ノル板7J−ルダの固
定ベースどに、ぞれぞi+対向する1対の内命ト状凹面
と、対向する1対のF′?IJt面と、対向−する1対
の平行ブエフラット面とを形成し、十N1.’: Fl
対の面をそ」しそれボールをブit〜′C当接ぜしめる
どどもに、上記の基板を保持する部材の上面に複数個の
ころがり部材を設し〕、このころがり部イ1を介して基
板を載置し得る」、5に構成し、がつ、土N「:の基板
を14−ff持−ノる部側に、基板に対して水平方向に
当接−Jる位置ぎめ川の複数個のころがり部イ”4をイ
dnえるとどもに、このころがり部側に向し〕て714
; 、+rvを水平方向に押圧ずろ伺勢手段を設け、上
記のイー1勢手段はころがり部材を介して基板に当接し
て旧勢力を伝達する」こうに構成しl、こことを%徴と
する。
In order to achieve the above object, the substrate holder of the present invention has a pair of internal pins facing each other on the part f4 holding each board f'+4 and the fixed base of the plate 7J-ruder. shaped concave surface and a pair of opposing F'? An IJt surface and a pair of opposing parallel Buet flat surfaces are formed, and 10N1. ': Fl
A plurality of rolling members are installed on the upper surface of the member that holds the board, and the rollers are inserted through the rolling parts A1 to The board is placed on the side where the board can be placed horizontally, and the board is placed horizontally against the board. 714, facing the rolling part side.
, +rv in the horizontal direction, and the above-mentioned E1 force means contacts the board via the rolling member to transmit the old force. do.

次に、本発明の一実施例を第3図乃至第7図について説
明する。
Next, an embodiment of the present invention will be described with reference to FIGS. 3 to 7.

803図は平面図、第4図は第3図のA部例近を矢印a
方向に見た111面図、第5図は同じ(13部イマ]近
を矢印り方向に見た側面図、第6図は同じ< C’部刊
近を矢印C方向に見た側面図、第7図は第6図における
J)EF断面図である。
Figure 803 is a plan view, and Figure 4 is an example of part A in Figure 3, indicated by arrow a.
111 side view when viewed in the direction, Figure 5 is the same. FIG. 7 is a sectional view of J) EF in FIG. 6.

第3図に示すA 、 Ij 、、C+」、そ1+、ぞれ
基板保持手段1を固定ベースに対して支承する手段であ
る。
A, Ij, C+'' shown in FIG. 3 are means for supporting the substrate holding means 1 relative to the fixed base.

支承手段Aは側面図(第4図)に示すごとく基板保持部
イ牛1ど固定ベース6とにそれぞれ対向する1対の円錐
状の凹面7を形成し、ボール1゜を介して両凹面を当接
ぜしめてk)る。これにより、:!1−1手段Aけ基板
保持部イ゛]1のJK Nの一部をフi承」ろと共に−
・対の円錐゛11コ凹而7を回ル?状にf’dだ(」る
As shown in the side view (FIG. 4), the supporting means A has a pair of conical concave surfaces 7 facing each other on the substrate holder 1 and the fixed base 6, and connects both concave surfaces through a ball 1°. The contact must be made k). This results in :! 1-1 Means A and board holding part 1] Hold a part of JKN of 1 and attach it.
・Turn the pair of cones, 11 and 7? It's like f'd(''ru).

支承手段lハま?(t 5図に示−〕ごJく、基板保持
部月1と固定ベース3どにぞれぞれ対向Jる1対のV溝
面8を形成し、ボール1oをブi′L ’(両I′溝面
を当接辻しめC2)る。このv rpt面8の中心線8
σ(よ第6図に示すJ、うIfC支承手段Aの中)(、
・を通るようにnψ定する。これに」、り支承手段l?
け、基板保持手段10m: 、FA4の一部を支承ドア
、がっ、基板保持部月1の11部刊近が支承手段イに対
l〜て接近、離間する方向に移動−確ることをπF容す
る。たたし、前記r溝面の中心糾矛)σを支承手段Aの
中心を通る方向にしであるため、基板保持部月1が基板
保持手段Aの回りに回動することを拘束している。
Support means? (As shown in Figure 5) A pair of V-groove surfaces 8 facing each other are formed on the substrate holding part 1 and the fixed base 3, respectively, and the ball 1o is aligned with the groove surface 8. Both I' groove surfaces are brought into contact C2).The center line 8 of this vrpt surface 8
σ (J shown in Figure 6, ifC in the supporting means A) (,
・Nψ is determined so that it passes through. In this case, the supporting means l?
10m of board holding means: Move a part of FA4 to the support door, and move the board holding part towards and away from the support means A. πF accommodates. However, since the center point (σ) of the r-groove surface is in the direction passing through the center of the support means A, the substrate holding portion 1 is restrained from rotating around the substrate holding means A. .

支承手段C゛は第6図に示す如く、基板保持部月1と同
定ベース3とにそれぞれ対向する一対の平行なフラット
面9を形成し2、ボール1oを介して両面を当接ぜしめ
である。これにより支承手段6゛は基板イ1)□、打部
11の水51′方向の移動を拘束することなくぞの川h
1の一部を支承−Jる。
As shown in FIG. 6, the supporting means C' forms a pair of parallel flat surfaces 9 facing the substrate holding part 1 and the identification base 3, respectively, and the two surfaces are brought into contact with each other via balls 1o. be. As a result, the supporting means 6' can be moved freely in the direction of the water 51' without restricting the movement of the base plate 1) □ and the striking part 11 in the direction of the water 51'.
Supports part of 1-J.

上記の:X板保持部月1に、基板4に対して水ス1′方
向に?11接する(th置きめ用の複数個のころがり部
イ4を設ける。本実施例においCは上記複数個のころが
り部旧として3個のころがり軸受]1を用い、第6図に
示すごど(基板4の保持位置の外周に接ずろ」、うに取
りつける。第7図には6個のころがり軸受11の内の1
個が3J7.ゎJシ′(いる。本図に示す」、うに該こ
7〕がり押1受11の内輪をノル4反仙1イ寺部部材に
対し′C的1定(−1その外輪が基板4の外周に接17
て互いに水平方向に当接し借るように411ケ成する。
Above: On the X plate holding part 1, in the direction of water 1' with respect to the board 4? 11 (a plurality of rolling parts A4 are provided for th placement. In this embodiment, C is three rolling bearings as the above-mentioned plurality of rolling parts) 1 is used, and as shown in FIG. One of the six rolling bearings 11 is attached to the outer periphery of the holding position of the board 4.
The number is 3J7.ゎJsi' (as shown in this figure), the inner ring of the press 1 holder 11 is connected to the knob 4 and the temple member 1, and the outer ring is connected to the base plate 4. Tangent to the outer circumference of 17
411 are formed so that they abut and borrow each other in the horizontal direction.

基板イ1を打部材1の、ヒ面に複数個のころがり部旧を
介して基板4を載置して該基板4の上下方向の位γ1き
めをする。本実施例においては十ん1複数個のころがり
部イーイとして3個のボール12を介装しである。
A substrate 4 is placed on the surface of the striking member 1 via a plurality of rolling portions, and the vertical position of the substrate 4 is determined by γ1. In this embodiment, three balls 12 are interposed as a plurality of rolling parts.

そして、上%Qの基板4を3個のころがり軸受11に向
け゛C押圧するようにイ;]勢手段13を設kJ−る。
Then, the force means 13 is installed so as to press the substrate 4 at the top %Q toward the three rolling bearings 11.

本実施例にオdける(=J勢手段1ろのtjq成を第7
図に一つし・′C次に4ホベン)。22け1、井板保4
’r部月IVX固定しまたブラクットひ、このブラクッ
l−け、枢支1111+234汎β、リレバー15を回
1ft+1白?’iヨシンー支承し?−いて)。
Adding to this example (= tjq configuration of J group means 1
Figure 1. 'C then 4 hoben). 22 Ke1, Tamotsu Iita 4
'R part moon IVX fixed again, this black l-ke, pivot 1111 + 234 pan β, turn lever 15 1ft + 1 white? 'I support you? -).

−l−、Ftl−:のブラクット22ど[/パー15)
・の間にバネ14をJ+’縮ブi装L ’CI/バー1
5をJ妙時泪方lii口τ、イ;」勲4ろ。上記のレバ
ー150ト1喘?<1(に2本θ)ビン1A′f1介し
でロット゛17の−づ1iiAを連結l2、こθ) n
 、、、ド17の仙台fA! b7−こ7)がり軸受1
8の内輪ち1lj(リレ)しjろ。
-l-, Ftl-: Brakut 22 [/par 15)
・Insert spring 14 between
5 is J Taeji Yukata lii mouth τ, i;'' Isao 4ro. 150 levers above and 1 pant? <1 (to 2 θ) Connect the -1iiA of lot 17 through the bin 1A'f1 l2, this θ) n
,,,Sendai fA of 17! b7-ko7) Hole bearing 1
The inner circle of 8 is 1lj (rele).

こワ、ニ」、す、1ツバ−15ツノq 時*1方+f 
(1S カ+;1. jlット′17及びころかり軸受
1Bをブ1(−C〕、(板イに伝えもね、該基板4を図
の右方&?−(=J妃目 ニー7)がり軸受11ニ向け
゛CC水力方向て押圧3イ)。
Afraid, Ni'', Su, 1 Tsuba - 15 Horns q Time * 1 direction + f
(1S power; 1. Set the board '17 and the roller bearing 1B to the board 1 (-C). 7) Press toward the bearing 11 in the CC hydraulic direction (3).

以−にのように構/iv、 l、た基板ボッ1り°に、
lす、′1へ(r!ニア、の大気中で基板4を支持−J
l)−ム氾3図1tT−示−1ごとく基板4軒i、イリ
勢手g+3に、につ’C3個のにろかり佃1受71に4
1117Eされ、基板保持部イA1に交1して位置きめ
さAしる。そし′こり1(仮保持部イイ1(よ支承手段
AVrcよっCその中心点0を固定ベースに対して位f
%’tぎめされると共に、支承手段l?によりその中心
線8σの方向を同定ベースに対して〕、11.制される
Construct the board as described above,
Support the substrate 4 in the atmosphere of (r! Near) -J
l) - Mu flood 3 Figure 1 tT - As shown in 1, 4 boards i, Iri Seite g + 3, Nitsu'C 3 Nirokari Tsukuda 1 Uke 71 and 4
1117E, and crosses the substrate holder A1 to a position A1. Position the center point 0 of the temporary holding part 1 (the support means AVrc) with respect to the fixed base.
%'tIncludes supporting means l? The direction of the center line 8σ with respect to the identification base], 11. be controlled.

第7図に示Jごノ・<、基板7Iに正対ヒしめたマスク
19を位]x′ぎめして1−11定ベース3に取りつけ
、そのF方VC,設けた蒸着源2[]と共に真空雰囲気
とし、基板ヒータ21によっ又基板4にご加熱−する。
As shown in FIG. 7, the mask 19 placed directly facing the substrate 7I is attached to the 1-11 constant base 3 at the 1-11 angle, and the evaporation source 2 is placed on the F side VC. At the same time, a vacuum atmosphere is created, and the substrate 4 is heated again by the substrate heater 21.

ノ、(板4&よ基板保持部月1に対してごろがり部側を
介し′CC点接触上くは+yi!接触していイ)だけで
あるから、基板4から基板保持部旧1への伝導熱(iが
僅小である。伝導によって吸熱される熱ルが僅小である
から基板4の温度制御が容易である。
Since there is only contact between the board 4 and the board holder 1 through the rolling part side at the 'CC point, contact is made between the board 4 and the board holder 1. Therefore, the conduction from the board 4 to the board holder 1 is The heat (i) is very small. Since the amount of heat absorbed by conduction is very small, it is easy to control the temperature of the substrate 4.

また、基板保持部月1への伝導熱量が僅小でk)るから
該基板保持部月10昇温還が微小でk。
In addition, since the amount of heat conducted to the substrate holder 1 is very small, the temperature increase and return of the substrate holder 10 is very small.

る。この微小なJ71温により基板保持部月1は支承手
段Aの中心点Oを基準にして、支承手段Bの中心線8a
の方向を保ったまま拘束され1゛に熱膨張する。この熱
膨張による基板保持部月1の変位は微小である上に規則
的で朽現性があるので、予め精密に補正することが容易
である。
Ru. Due to this minute J71 temperature, the substrate holder 1 moves from the center line 8a of the support means B to the center point O of the support means A as a reference.
It is restrained while maintaining the direction of , and thermally expands by 1゛. The displacement of the substrate holding portion 1 due to this thermal expansion is minute, regular, and decayable, so it is easy to accurately correct it in advance.

某枦、4け、加熱によって熱ルー111% ]ろが、と
7)かり川I″」を介しL支承されLい7.)のでPr
’t211PをDljげる/?擦力は蕪視1−?1する
1′一度#V−小さい。従っ′C1基板4は6個のころ
がりIIIIIl受11との当接を舶持1、つつ伺勢手
段130伺勢力に抗し、′C力〜膨up−)る。
7) A certain hole, 4 pieces, heated to 111% heat roux]. ) so Pr
'Dlj get t211P/? Is the friction force 1-? 1 to 1' once #V - small. Therefore, the 'C1 board 4 resists the biasing force of the biasing means 130 while making contact with the six rolling III receivers 11, and expands.

この際、付勢・f段13のイ;」勢力け、一定であるが
ら熱膨張の再慴、性が11<、その土、慣1勢f段13
け、こ7)かり軸受18を介し“C(’J勢力を伝達−
4イ)ので基板4に回転方向の変イI′1を生じプxい
。このため−Jl(板4の熱1彫胆に、1、る久6xを
子y)精密1・月tili 、ilt 4ることか容易
でま)る。
At this time, the force is constant, but the thermal expansion is re-evaluated, the property is 11<, and the force is constant.
7) Transmit the "C('J" force) through the bearing 18.
4a) Therefore, a change I'1 in the direction of rotation is generated in the substrate 4. For this reason - Jl (on board 4, heat 1, 1, ruku 6x, y) precision 1, month tili, ilt 4, it is easy to do).

以−に詳jボした」、うに、木発す1」を適用」イ)と
、基板に回転変位を生ぜしめることが無く、■2がも基
板から基板保持部利への熱流出が少フx、 L・という
優れた実用的効果を生じ、基板の熱膨張1rで−よる変
(+’lのtfJ現性が良し・ので容易に茜悄度でこ」
l、を補正することができる。
Applying ``1'' described in detail above, ``a)'' does not cause any rotational displacement to the board, and ``2'' also reduces heat leakage from the board to the board holding part. It produces excellent practical effects such as
l, can be corrected.

4 図面のfiti 、Q’、ブL説明氾1図は従来形
の基板ホルダのか1祝図、第2図はその作動に関する不
具合の説、四回である。
4 Explanation of Fiti, Q', and BL of the drawings Figure 1 is a congratulatory diagram of the conventional substrate holder, and Figure 2 is a description of the malfunctions related to its operation, four times.

第3図は木登5明の基板ホルダの一実施例の31′面図
である。第4図は土r++2’14 M’j例のΔ部を
矢印a方向に見た1111面図、第5図は同じくB部を
矢印り方向に見た側面図、第6図は同じく6部を欠目I
C方向に見た側面図でk)る。第7図は記1図における
JJAlF断面図である。
FIG. 3 is a 31' side view of one embodiment of the substrate holder manufactured by Kinoto Kazuaki. Figure 4 is a 1111 side view of the Δ part of the soil r++2'14 M'j example when viewed in the direction of the arrow a, Figure 5 is a side view of the B part similarly viewed in the direction of the arrow, and Figure 6 is the same view of the 6th part. Notch I
k) Side view seen in direction C. FIG. 7 is a sectional view of JJAlF in FIG. 1.

1[]  ・・ ・川  ボ − ル 11  ・・・・・・ころがり軸受 12・・・・・・・・7I(−ル 16  ・・−・ ・・・ イ」 勢 手ト実14・・
・・・・・バネ 15 ・・−・・・・・レバー 16・・−・・・・・ビン 17・・−・・・・ロッド 1B・・−・・・・ころかり軸受 22・・・・・・・・・プラク1.ト 23・・・・・・・レバーの枢支軸 晰1 口 ■3図 も7区 /3
1 [] ... River ball 11 ... Rolling bearing 12 ... 7I (-ru 16 ... ... I")
... Spring 15 ... Lever 16 ... Bin 17 ... Rod 1B ... Rolling bearing 22 ...・・・・・・Plaque 1. 23... Lever pivot axis 1 Mouth ■ 3 Figure also 7 sections / 3

Claims (1)

【特許請求の範囲】[Claims] 基板を位置きめして搭載する基板ホルダにおいて、上記
の基板を保持する部材ど当該基板ボルダの固定ベースと
に、それぞり、対向する1対の円錐状凹面と、対向する
1対のV溝面と、対向する1対の平行なフラット面どを
形成し、上記3対の対向面をそれぞれボールを介して当
接ぜしめるとどもに、上記の基板を保持する部材の土面
に′D、数個のころがり部材を設け、このころかり部材
を介して基板を載置し得るよ5に構成し、かつ、上記の
基板を保持する部材に、基板に対して水平方向に当接す
る位置、きめ用の複数個のころがり都月を備えるととも
に、このころがり部材に向けて基板を水平方向に押圧す
る伺勢手段を設け、」−記のイ」勢手段はころかり部材
を介して基板に当接する」、5に構成したことを特徴と
する基板ホルダ。
In a substrate holder for positioning and mounting a substrate, the member for holding the substrate has a pair of opposing conical concave surfaces and a pair of opposing V-grooves on the fixed base of the substrate boulder, respectively. A surface and a pair of parallel flat surfaces facing each other are formed, and the three pairs of opposing surfaces are brought into contact with each other through balls, and when the ground surface of the member holding the substrate is , a position where several rolling members are provided and the substrate can be placed through the rolling members, and the member holding the substrate is in contact with the substrate in a horizontal direction; In addition to providing a plurality of rolling rollers for rolling, a biasing means for horizontally pressing the board toward the rolling member is provided, and the force means in "A" in the description is applied to the board via the rolling member. 5. A substrate holder characterized in that the substrate holder is configured as follows.
JP16384482A 1982-09-22 1982-09-22 Holder for substrate Pending JPS5954237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16384482A JPS5954237A (en) 1982-09-22 1982-09-22 Holder for substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16384482A JPS5954237A (en) 1982-09-22 1982-09-22 Holder for substrate

Publications (1)

Publication Number Publication Date
JPS5954237A true JPS5954237A (en) 1984-03-29

Family

ID=15781821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16384482A Pending JPS5954237A (en) 1982-09-22 1982-09-22 Holder for substrate

Country Status (1)

Country Link
JP (1) JPS5954237A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01303787A (en) * 1988-05-31 1989-12-07 Juki Corp Thick film circuit controlling system
JP2008004575A (en) * 2006-06-20 2008-01-10 Tokyo Ohka Kogyo Co Ltd Supporting pin
KR20210022725A (en) * 2018-06-25 2021-03-03 어플라이드 머티어리얼스, 인코포레이티드 Carrier for the substrate and method for transporting the substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01303787A (en) * 1988-05-31 1989-12-07 Juki Corp Thick film circuit controlling system
JP2008004575A (en) * 2006-06-20 2008-01-10 Tokyo Ohka Kogyo Co Ltd Supporting pin
KR20210022725A (en) * 2018-06-25 2021-03-03 어플라이드 머티어리얼스, 인코포레이티드 Carrier for the substrate and method for transporting the substrate
JP2021529433A (en) * 2018-06-25 2021-10-28 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Substrate carrier and method for transporting the substrate

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