JPS5952647U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS5952647U JPS5952647U JP14860682U JP14860682U JPS5952647U JP S5952647 U JPS5952647 U JP S5952647U JP 14860682 U JP14860682 U JP 14860682U JP 14860682 U JP14860682 U JP 14860682U JP S5952647 U JPS5952647 U JP S5952647U
- Authority
- JP
- Japan
- Prior art keywords
- conductor land
- integrated circuit
- hybrid integrated
- transformer
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の混成集積回路の部分平面図、第２図は本
考案の一実施例の部分平面歯、第３図ａ。
ｂ、 ｃはそれぞれ本考案に係るトランスを搭載した
絶縁基板の平面図、断面図、底面図である。
１・・・膜回路基板、２． ８． ９・・・導体ランド
、３・・・トランスコア、４・・・トランスリード、５
，１１゜１２・・・半田、６・・・接着樹脂、７・・・
絶縁基板、１０・・・側面メタライズ。FIG. 1 is a partial plan view of a conventional hybrid integrated circuit, FIG. 2 is a partial plan view of an embodiment of the present invention, and FIG. 3a is a partial plan view of a conventional hybrid integrated circuit. b and c are a plan view, a sectional view, and a bottom view, respectively, of an insulating substrate on which a transformer according to the present invention is mounted. 1... Membrane circuit board, 2. 8. 9... Conductor land, 3... Transformer core, 4... Transformer lead, 5
, 11゜12...Solder, 6...Adhesive resin, 7...
Insulating substrate, 10... side metallization.
Claims (1)
ドと裏面側に前記表面導体ランドとスルーホールまたは
側面メタライズにより導通されている裏面導体ランドと
を有する絶縁基板と、前記絶縁基板に固定され、かつ、
リード端子が前記表面導体ランドに接続されたトランス
と、表面に回路パターンが形成され、この回路パターン
に前記トランスを取付けた絶縁基板の裏面導体ランドが
接続された膜回路基板とを含むことを特徴とする混成集
積回路。an insulating substrate having a front conductor land for connecting a transformer lead on the front side and a back conductor land connected to the front conductor land by a through hole or side metallization on the back side, fixed to the insulating substrate, and ,
A transformer having lead terminals connected to the front surface conductor land, and a membrane circuit board having a circuit pattern formed on the front surface and a back surface conductor land of an insulating substrate to which the transformer is attached is connected to the circuit pattern. Hybrid integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14860682U JPS5952647U (en) | 1982-09-30 | 1982-09-30 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14860682U JPS5952647U (en) | 1982-09-30 | 1982-09-30 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5952647U true JPS5952647U (en) | 1984-04-06 |
Family
ID=30330118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14860682U Pending JPS5952647U (en) | 1982-09-30 | 1982-09-30 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5952647U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH069104U (en) * | 1992-06-30 | 1994-02-04 | 昭和電線電纜株式会社 | Transformer material |
-
1982
- 1982-09-30 JP JP14860682U patent/JPS5952647U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH069104U (en) * | 1992-06-30 | 1994-02-04 | 昭和電線電纜株式会社 | Transformer material |
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