JPS59228729A - Method and device for measuring semiconductor - Google Patents

Abstract

PURPOSE:To improve the processing capacity by automatically selecting the minimum necessary measuring items in a plurality of semiconductor product lots driving measurement when measuring electric properties of the products to reduce the items, thereby shortening the measuring time. CONSTITUTION:A test program 12 and a data analyzer 14 are connected to a tester 11 of a semiconductor measuring system, and electric properties of an IC 13 to be measured are measured in the order of the program 12 by the tester 11. Various measuring conditions set by the IC13 and the program 12 are connected to the test head matrix 24 of the tester 11. The program input is stored by an input unit 30 through an input/output unit I/O 29, and a CPU21 in a test memory 25. A measuring unit 22, a measuring power source 23 and the matrix 24 are controlled by the CPU21 in accordance with the stored content of the memory 25, thereby setting the inputting conditions of the IC13. The measuring items are automatically selected to shorten the measuring time, thereby improving the processing capacity.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor measuring method and a measuring device for measuring a plurality of items of electrical characteristics of a plurality of semiconductor devices (chips and packaged products).

[Technical background of the invention]

Conventionally, this type of electrical characteristic measurement has generally been carried out as shown in FIG. That is, the tester 2 automatically measures the electrical characteristics of the IC under test 1 in the order of the test program 3. Here, the test program 3 includes the conditions necessary to measure the electrical characteristics of the ICI under test, such as the voltage and current applied to the input terminal and output terminal of the IC under test, the bias measurement time, and the time for judgment. The conditions for measuring the so-called characteristics, such as the standard values of It is automatically measured.

In addition, various devices such as a prober in the case of a step and a handler in the case of a cage are used to transport the workpiece C1 to be measured and to connect it to the measurement section of the tester 2.

[Problems with background technology]

In such a measurement system, when a product is measured on a rebellious basis, its measurement ability is determined by the test program for each product.

By the way, as shown in Fig. 2, conventional measurement systems test the measured products (
Generally, each lot is treated as a manufacturing unit. ) All rotons are measured.

However, some of the electrical property items may vary depending on the measurement results.
There will be items with no defects and items with defect rates that pose no problem in terms of quality assurance. To improve processing performance, it is desirable to exclude these items from the test program. However, the number of measurement points with low or no defect rate varies depending on the product lot, and it is impossible to create test programs for the same product type and use them according to the level of the product lot. Rarely.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and its purpose is to reduce the number of measurement items by automatically selecting the minimum required measurement items for the product lot being measured. It is an object of the present invention to provide a semiconductor measuring method and a measuring device that can shorten the processing time, improve throughput, and lower the price of the product.

[Summary of the invention]

The present invention provides the following features when measuring the electrical characteristics of semiconductor products:
All predetermined measurement items for the required number of samples to determine the quality control of product lots in advance! As a result, if there are any non-problematic items on the product lot, delete those items and re-edit the minimum necessary measurement items, and then measure the remaining samples for the re-edited measurement items. It is something.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. In FIG. 3, the tester 11 measures the electrical characteristics 7 of the ICl 3 to be measured in the program order of the test program 12.

Figure 4 shows the specific configuration of the tester 11! It shows. This tester 11 includes a control unit (CPU) 22,
The measurement section 22, the measurement power supply section 23, the test rad matrix section 24, the test program memory section 25, the system memory section 26, the tester main node and channel section 27, the proper (handler) I10 section 28, and the input/output device 110 section 29. It is configured. The test rad matrix section 24 is
It connects the ICI 3 to be measured and various measurement conditions set in the test program 12. The program input of the test program 12 is stored in the test program memory section 25 by the input/output device 30 via the input/output device processing section 29 . The measurement start signal is sent from the start switch of the tester main channel section 27 or the prober (or handler) to the prober (or handler) 110 section 2.
8. This allows control 1 (
In the CPU) 2, the test program memory section 25
According to the stored contents, the measurement section 22, the measurement power supply section 23, the test RAD matrix section 24, etc. are controlled, and the input (supply) conditions to the ICI 3 to be measured for measurement are set. The output data of the ICl 3 to be measured is measured by the measurement unit 22 and compared with the quality determination standard value for each measurement item set in the test program 12. The quality determination results and measurement data are displayed on a display section (not shown).

The measurement data and pass/fail results for each item of the ICI 3 to be measured obtained by the tester 1 are sent to the data analyzer 14. This data analyzer 14il-
As shown in Figure 5, the control unit (CPU
) 31, a system memory section 32, a test data memory section 33, and a data analysis/data processing section 34. The system memory section 32 stores data for operating the data analyzer 14'll, and the test data memory section 33 stores the data for operating the data analyzer 14'll.
The measurement data for each item and the quality/failure determination results output from 1 are stored. The data analyzer 14 is provided with a sample number setting unit in the front channel (not shown) for setting the number of samples necessary for measuring in the tester 11 to determine the quality assurance level of a product lot. The data analysis/data processing unit 34 generates measurement data and pass/fail judgment results obtained by measuring all the measurement items set in the test grogram 12 in the tester 11 for the sample set in the sample number setting unit. Z analysis is performed to select electrical measurement items Z that are unnecessary for the product lot (the criteria for determining whether or not they are unnecessary is set by the system hardware or externally). This data analysis data 1 part 34
The analysis results are displayed on a display section of the front panel (not shown). A test skip command is now sent from the control unit 31 to the desk 11 via the data analyzer 1 unit 35f to control the unnecessary measurement items to be removed from the measurement peaks set in the test program 12. ing.

That is, in the semiconductor measuring device of the present invention, first,
In the sample number setting section of the data analyzer 14, the sixth
As shown in Figure (a), the number of samples (ICs to be measured) required to determine the quality assurance level of product lot 41.
41a. As a result, in the tester 11,
Defective items added to test program 12 (1 to 1)
The sample 41FL is measured for all three items, and the quality is determined for each measurement item. The data analyzer 14 then determines the measurement data and pass/fail judgment results for the sample 41a output from the tester 11. As input, the quality distribution for each measurement item is calculated. As a result, as for the items that do not cause problems in terms of quality control for the product lot 4), the items are deleted as shown in FIG. 6(b), and the measurement tops are re-edited. In other words, for minor defective items such as a small amount of leakage current, there are no defective items in sample 41h (items 11 to 13.1).
5.16.18.19.21.22.24-29) will be deleted.

In addition, fatal parts such as circuit not working [11 (1 to 10)]
will be excluded from deletion.

Thereafter, a test skip command is sent from the data analyzer 14 to control the deletion items to be removed from among the specified items (1 to 30) set in the test program 12. As a result, in the tester 11, the base body 41b of the product lot 41 is measured using the program of the re-edited measurement items (1 to 10.14.17.20.23).

Therefore, the processing capacity of this device is greatly improved.

For example, at the general-purpose C2M08IC level, the product lot unit is about 5000 pieces, and the number of samples required to determine the quality control of the lot is about 300 to 500 pieces. As a result, the remaining mother body is 4500 to 470
With zero products, the number of measurement items can be reduced, and therefore the measurement time for the entire product lot can be shortened.

In addition, the quality level difference between product lots can be automatically determined on the normal measurement line, and the number of measurement items can be automatically reduced.
There is no need to create and replace 2.

After completing the measurement for that product lot, simply press the memory clear switch on the front pile of the data analyzer 14, and the analysis results for that product lot and the test skip command to the tester 11 will be cleared and set to the initial state. .

〔Effect of the invention〕

As described above, according to the present invention, when measuring the electrical characteristics of a plurality of semiconductor products, it is possible to reduce the number of measurement items by automatically measuring the most necessary measurement items for the product lot being measured. As a result, the measurement time can be shortened to 7 degrees, processing capacity is improved, and the price of the product can therefore be reduced.

[Brief explanation of drawings]

Figure A1 is a block diagram showing the conventional semiconductor measurement system. Figure 2 is a diagram showing measurement results by the above system.
Figure 4 is a block diagram showing a semiconductor measurement system according to an embodiment of the present invention, Figure 4 is a block diagram showing the configuration of a tester used in the system shown in Figure 3, and Figure 5 is a block diagram showing the configuration of a data analyzer. FIG. 6 is a diagram showing the distribution of defective products based on lot sampling. 11...Tester, 12...Test program, 13
...IC114 to be measured...Data analyzer, 4
1°"°Product lot, 41m...sample. Applicant's agent Patent attorney Takehiko Suzue 41b Figure 6 (a) (b)

Claims (2)

[Claims] (1) In a semiconductor measurement method for measuring the electrical characteristics of a plurality of semiconductor devices, for the number of samples necessary to ascertain the quality assurance accuracy of a product lot of the semiconductor devices,
Predetermined measurement items are determined, and unnecessary measurement items are detected from the measurement results for quality control of the product lot, and the unnecessary measurement items are deleted and the remaining measurement items of the product lot are determined as follows. Performing maternal measurements t%
Semiconductor measurement method based on characteristics. (2) A tester for measuring the electrical characteristics of a plurality of semiconductor devices, a sample number setting means for setting the number of samples to a number necessary to grasp the quality assurance level of a product lot of the semiconductor devices, and the sample number setting means Data obtained by measuring the specified measurement items on the set sample! A data analyzer that performs analysis to detect measurement items that are unnecessary for quality control of the product lot, and controls the tester to remove the unnecessary items from among the measurement items to be measured. A method for measuring semiconductors.