JPS59198792A - Method of producing thick film fine pattern circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photoelectroless forming method and/or an electroplating method using electroless coating.

Conventionally, when manufacturing fine pattern circuits by the photoelectroforming method or the photoelectroless forming method, a conductive material such as a metal plate or an insulating material treated to make it conductive is used as a base, and then Using various photosensitive pattern forming materials, a pattern opposite to that in the case of etching is formed, and then a plated metal film of a predetermined thickness is deposited in the recesses of the formed pattern by electroplating or electroless plating, Thereafter, the previously formed reverse pattern is removed to form a circuit pattern. When the circuit pattern formed in this way is required as a fine film pattern of, for example, about 10 lines and a thickness of about logm, a photosensitive dry film is used as the pattern forming material.

However, the photosensitive dry film has a resolution only for a line width that is approximately equal to the thickness of the photosensitive dry film, and when a Menki metal film is deposited by plating, the thickness of the Menki metal film may be deposited to exceed the thickness of the dry film. Since the plated metal film also grows in the direction that narrows the pattern width of the dry film, short circuits may occur due to the thickening of the plated metal film, so the pattern width must be narrower than the thickness of the photosensitive dry film, that is, the thickness of the conductor. It has not been possible to manufacture thick-film fine pattern circuits as described above.

The present invention has been made in view of the following points, and is necessary when, for example, the spacing between conductors is as fine as 10JLQI, and the conductor thickness is approximately 50 mm or more. The main object of the present invention is to provide a novel method capable of manufacturing a thick film fine pattern circuit in which the conductor thickness is significantly thicker than the spacing between the conductors.

The method for manufacturing a thick film fine pattern circuit of the present invention includes: (1) laminating a photosensitive resin film on a base material; (2) pattern-exposing the photosensitive resin film; (3) laminating the photosensitive resin film again on the pattern-exposed photosensitive resin film; (4) this process. A step of exposing the unexposed photosensitive resin film in a pattern such that at least a portion of the same position as in step (2) above is overlappingly exposed, and (5) if desired, forming a fine pattern as required. Depending on the conductor thickness of the circuit, the above (
a step of repeating steps 3) and (4); (6) a step of developing the photosensitive resin coating layer formed to a predetermined thickness and pattern exposed; and (7) a step formed on the base material by the above steps. (8) Optionally, depositing a plated metal film in the recesses of the stained photosensitive resin pattern by electroless plating and/or electroplating to form a fine pattern circuit; (9) If the base material is not insulating.

The method is characterized by comprising the steps of peeling off the formed fine pattern circuit from the base material and transferring the pattern circuit onto an insulating substrate.

The base material used in the method for manufacturing a thick film fine pattern circuit of the present invention may be a plate made of a conductive material such as stainless steel or copper, or a film or plate made of an insulating material such as polyester, which may be formed by metal vapor deposition or the like. Films or plates made of various insulating materials conventionally used as circuit boards such as polyimide, glass, paper-phenol resin laminates, glass-epoxy resin laminates, etc. Examples include those treated with a surface activator for plating (for example, H3-1018 manufactured by Hitachi Chemical Co., Ltd.).

The photosensitive resin coating to be laminated on this base material is as follows:
It is appropriate to use a photosensitive dry film having the required resolution from the viewpoint of simplicity of the manufacturing process. As the photosensitive dry film L1, any commercially available material of positive type or negative type may be used, and when a resolution of about 10 scales is required, for example, TPI' manufactured by Asahi Kasei Corporation.
i, T 120Ei manufactured by DuPont is suitable. In addition, if the loosening force is only about 20 scales or more, for example, T1010 (25 scales thick), T1020 (50 scales thick), and Tl230 (75μ thick) are required for 1fDuPont materials. You can use it selectively depending on the situation. Further, the photosensitive resin coating to be laminated on the base material is not limited to a photosensitive dry film, and a liquid photosensitive resin can also be used. When using a liquid photosensitive resin, it is possible to freely control the thickness of the photosensitive resin film laminated on the base material. It is suitable for manufacturing fine pattern circuits of films.

- To laminate a photosensitive resin film on base material 1-,
When using a dry film, a laminator or the like can be used, and when using a liquid photosensitive resin, a coating means such as a spinner can be used.

Next, ultraviolet light and distant light are applied to the photosensitive resin film laminated on the heath material through a predetermined exposure mask that leaves the photosensitive resin film in the areas where the circuit of the fine pattern circuit is not formed. Light exposure is performed using ultraviolet light, X-rays, electron beams, etc. Of course, the method of exposing the photosensitive resin film is not limited to the mask exposure described in -, but may also be laser scanning exposure.

Next, a photosensitive resin film is again laminated on the imagewise exposed photosensitive resin film in the same manner as described above, and the laminated photosensitive resin film is exposed to light through the same mask pattern used previously. Light exposure is carried out while carefully adjusting the reference position of the exposure mask using, for example, an aligner so that the same portion of the plastic resin coating is exposed. In this example, the case where the same part of the laminated photosensitive resin coatings is exposed will be explained, but the purpose of the present invention is not achieved only when the completely same part is exposed. The exposure may be carried out so that at least a part of the previously exposed portion is overlapped and exposed in the laminated photosensitive resin coating thereon.

Such lamination of photosensitive resin coatings and light exposure through an exposure mask are repeated until a photosensitive resin coating of a thickness corresponding to the required conductor thickness of the fine pattern circuit is laminated. .

After that, a developer suitable for the photosensitive resin film used,
For example, 1,1.1-) Lichloroethane, 1% charcoal sorter aqueous solution, etc. are used to dissolve and remove the photosensitive resin coating in the exposed or unexposed areas, and the photosensitivity is adjusted according to the desired fine pattern circuit. A resin pattern is formed on the base material. The photosensitive resin pattern obtained by the second step of this development has almost the same resolution as the thickness of the single layer of the photosensitive resin coating used, since each layer of the photosensitive resin coating is exposed to light. be.

After that, it is first formed by a % electrolytic coating method using an electroless Ni plating solution, an electroless copper coating solution, a copper coating solution, etc., and/or an electrolytic coating method using a copper sulfate coating solution, a Watts nickel coating solution, etc. A thin metal film is deposited in the recessed portion of the photosensitive resin notch until it becomes almost as thick as the photosensitive resin notch, thereby forming a thick film fine pattern circuit. In this case, the electroplating method is generally applied if the paste material is conductive, and the electroless plating method is applied if the paste material is electrically insulating and has been surface activated for electroless plating. After forming a plating film of a certain thickness by the coating method, it is appropriate to perform coating by the electric coating method until the desired conductor thickness is obtained.

Note that since the photosensitive resin film is sensitive to alkalis, it is desirable that the electrodeposition bath be neutral or resistant.

The photosensitive resin pattern is then removed from the paste material, for example by spraying or immersing it in an aqueous alkaline solution, although this step may be carried out last. Alternatively, the photosensitive resin pattern may be left as is.

If the paste material is not electrically insulating, the fine pattern circuit formed in this way is finally peeled off from the base material, the pattern circuit is transferred to an insulating substrate, and a thick film fine pattern circuit is formed. is formed. To peel off the patterned circuit from the base material, an etching method or an electroforming peeling method can be applied. Furthermore, as the substrate on which the pattern circuit is installed, various insulating substrates conventionally used as circuit boards, ranging from paper phenol resin laminates to glass-epoxy resin laminates, can be used.

When transferring the pattern circuit to the substrate, various conventionally known adhesives such as a thermosetting phenol-modified nitrile rubber adhesive can be used.

According to the method for manufacturing a thick film fine pattern circuit of the present invention, it is possible to manufacture a thick film fine pattern circuit in which the conductor thickness is considerably thicker than the spacing between the conductors, which was almost impossible with conventional technology. It is.

Hereinafter, the present invention will be explained in more detail according to Examples.

Example 1 A photosensitive dry film T 1208 (thickness: 15 scales) manufactured by DuPont was laminated on a stainless steel plate with a thickness of 0.2m+o using a laminator, and then this dry film was exposed with a mask to form a latent image of 15 scale pitches. I got it. Then, on this dry film, the above T 1
While aligning the reference position of the 206 film with an aligner, the lamination and exposure using the same mask as above were repeated three times, resulting in a latent image of 15 squares with a thickness of about 60 scales. A dry film layer was formed. Thereafter, shower development was performed with 1,1,1-trichloroethane to obtain a dry film pattern having a thickness of about 60 μm with a pitch of 15 tiles on a stainless steel plate. Then, within this dry film pattern, M% of 2 A/dm2
6o by copper plating (Lucina 81, Okuno Pharmaceutical Co., Ltd.)
The coating on the tiles was deposited. Next, the dry film layer was peeled off by spraying using a 5% sodium hydroxide solution, and copper plating was applied to the stainless steel with a pitch of 15 μs to a thickness of 6.
A pattern of 0 tiles was created. The formed copper pattern was transferred and adhered to a polyethylene terephthalate film with a thickness of 50 squares coated with adhesive (Blymarl 621 manufactured by Sanyo Boeki ■) to a thickness of 20 scales at 100°C and 10 kg/cm2. and then further heat at 150°C130Kg/cm
It was cured for 2.1 hour and a patterned circuit was formed.

Example 2 After a glass epoxy base material with a thickness of 1.6 mm was catalyzed (manufactured by Hitachi Chemical, H9IOIB), a photosensitive dry film P25 (thickness 2
5) was laminated using a laminator, and then this dry film was exposed to light using a mask to obtain a latent image with a pitch of 25. After that, the above P is applied on this dry film.
While aligning the 25 film with the reference position using an aligner, lamination was repeated three more times and exposure using the same mask as above was repeated to form a dry film with a thickness of approximately 100 mm and a 25 ul pinch latent image. formed a layer.

It was then developed with 1,1,1-trichloroethane to obtain a dry film pattern on the substrate with 25 pitches and a thickness of about +001 LI. Next, a 5-plated film was deposited on this dry film pattern by electroless Ni plating (I-Pnicolon 60, manufactured by Okuno Pharmaceutical Co., Ltd.), and then an electric layer plating of IOA/da2 (wand 1 bath) was performed. A Ni plating pattern circuit with a thickness of 100 mm was created.

Claims (1)

[Claims] A method for manufacturing a fine pattern circuit having a thick film conductor on an insulating substrate, comprising: (+) laminating a photosensitive resin film on a base material -L; (2) a step of exposing the photosensitive resin film in a pattern; (a step of laminating the photosensitive resin film again on the photosensitive resin film exposed in the 3ρ pattern; and (4) applying the unexposed photosensitive resin film to the A step of pattern exposure so that at least a part of the same position as the step of (2) is overlapped, and (5) as desired, according to the conductor thickness of the fine pattern circuit as described above (3). and (4); (6) developing the photosensitive resin coating layer that has been formed to a predetermined thickness and has been exposed to light; (7) A step of depositing Menki gold Jl and a coating in the recesses of the photosensitive resin pattern by electroless plating and/or electroplating to form a fine pattern circuit; (8) If desired, depositing the photosensitive resin pattern (9) If the paste material is not insulating, the formed fine pattern circuit is peeled off from the base material and the pattern circuit is transferred to an insulating substrate. A method for manufacturing a thick film fine pattern circuit, characterized by: