JPS59123365U - circuit device - Google Patents
circuit deviceInfo
- Publication number
- JPS59123365U JPS59123365U JP1615983U JP1615983U JPS59123365U JP S59123365 U JPS59123365 U JP S59123365U JP 1615983 U JP1615983 U JP 1615983U JP 1615983 U JP1615983 U JP 1615983U JP S59123365 U JPS59123365 U JP S59123365U
- Authority
- JP
- Japan
- Prior art keywords
- circuit device
- electrode
- chip
- conductor round
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はハンダ付けする前の本考案実施例回路装置の要
部断面図、第２図はハンダ付は後の同実施例要部断面図
、第３図は本考案に適用するプリント基板のパターン実
施例平面図、第４図は他の実施例の要部斜視図、第５図
は他の実施例の要部断面図である。
符号の説明、１・・・・・・プリント基板、２Ａ・・・
・・・導体ラウンド、４・・・・・・凹部、５・・・・
・・チップ状回路部品、７・・・・・・電極、８・・・
・・・ハンダ。Fig. 1 is a sectional view of the main parts of the circuit device according to the present invention before soldering, Fig. 2 is a sectional view of the main parts of the same embodiment after soldering, and Fig. 3 is a sectional view of the main parts of the circuit device according to the present invention. FIG. 4 is a plan view of a pattern embodiment, FIG. 4 is a perspective view of a main part of another embodiment, and FIG. 5 is a sectional view of a main part of another embodiment. Explanation of symbols, 1...Printed circuit board, 2A...
...Conductor round, 4...Concavity, 5...
...Chip-shaped circuit component, 7...Electrode, 8...
...Solder.
Claims (1)
付けすべく導体ラウンドを具備したプリント基板とから
なる回路装置であって、上記電極外側より該電極に略対
向せる位置あるいは該電極に密着せる位置にまで連なっ
た凹部を上記導体ラウンドに設け、上記電極と上記導体
ラウンドがハンダ付けされている回路装置。A circuit device consisting of a chip-shaped circuit component and a printed circuit board equipped with a conductor round for soldering the electrodes of the chip-shaped circuit component, the circuit device being placed at a position substantially facing the electrode from the outside or in close contact with the electrode. A circuit device, wherein the conductor round is provided with a concave portion extending up to a certain position, and the electrode and the conductor round are soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1615983U JPS59123365U (en) | 1983-02-08 | 1983-02-08 | circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1615983U JPS59123365U (en) | 1983-02-08 | 1983-02-08 | circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59123365U true JPS59123365U (en) | 1984-08-20 |
Family
ID=30147460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1615983U Pending JPS59123365U (en) | 1983-02-08 | 1983-02-08 | circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59123365U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232737A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Aic Inc | Printed-wiring board |
| JP2006005112A (en) * | 2004-06-17 | 2006-01-05 | Shinko Electric Ind Co Ltd | Semiconductor device and circuit board used therefor |
-
1983
- 1983-02-08 JP JP1615983U patent/JPS59123365U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232737A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Aic Inc | Printed-wiring board |
| JP2006005112A (en) * | 2004-06-17 | 2006-01-05 | Shinko Electric Ind Co Ltd | Semiconductor device and circuit board used therefor |
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