JPS5893339A - Interface assembly for testing integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic device testing apparatus. More particularly, the present invention relates to a contact assembly that is insensitive to aX frequencies and allows broadband testing with fast rising signals, and an interface assembly for integrating such a contact assembly into a test circuit.

BACKGROUND OF THE INVENTION In the manufacture and use of integrated circuits (ICs) and similar electronic devices, it is important to accurately, reliably, and rapidly test the devices. Automatic testing and processing equipment is available that can accomplish this task. Apparatus suitable for testing dual-in-line packaged ICs is commercially available from Demark Corporation of Massachusetts. DIPi! In this case, the circuit is housed within a molded plastic body having a rectangular box-like configuration. 2 rows of fi! The parallel connecting ends are arranged along the parallel sides of the body, and each pin extends in a direction y-perpendicular to the main surface of the body.

In each of the devices described above, the IC is placed between test positions KN where a set of contacts, typically double Kelvin contacts, are bent by camming so that they are electrically connected to the pins of the device. I am forced to do it. Contacts establish an electrical connection between the test circuit and the device. The contact is typically part of a probe or contact assembly, and the assembly includes an insulative base member to which the contact is mounted. Contacts are usually narrow strips of resilient, highly conductive material. The contact also makes an electrical connection at the free end opposite the base member with the associated connection bin. The cross-section of the contacts is such that (11) the conditions that all contacts must be connected at the same time in a pair of closely spaced bins, and r2) that the contacts can be operated for hundreds of cycles without fatigue of the material. It is relatively small due to the requirement that it must be bent for a period of time. The length of the contacts is determined by the spacing between the test stations and test circuits of the IC processing equipment.

Testing of integrated circuits often requires that the test signal be a "fast rise" signal, ie, the potential increases in very steep steps. A typical fast rise signal is characterized by a voltage change of 5V/nanosecond. A signal of this type can be described by Fourier analysis as consisting of a large number of superimposed sinusoids of very high frequency, typically around 300 mHz. Therefore, the rapid rise signal emitted by the test circuit and transmitted to the device by the contact includes components with very high frequencies.

The main problem with this test device is that the signal is subject to an inductive reactance XL due to the inherent inductance of the contacts. This reactance causes distortion and reflections that degrade test quality and accuracy.

The inductance L of a contact is a function of the cross-sectional area and length of the conductor.

That is, inductance increases in proportion to length and inversely to cross-sectional area. Inductive reactance XL = 2
For the very high frequencies associated with fast rising signals, the inductive reactance becomes a significant source of distortion and limits the accuracy of the measurements, even in conjunction with the relatively short contacts normally used.

One possible solution is to increase the cross-sectional area of the contact. However, the useful dimensions of the contacts are limited due to the physical limitations of the test environment. For example, a contact must be laterally separated from an adjacent contact while maintaining a unique association with one pin on the IC.

Also, the contacts must be thin enough to be repeatedly bent without exhibiting fatigue. Other possible solutions are:
The goal is to shorten the contacts. This solution works well if the IC can be inserted into the test circuit by hand.

However, high-speed automated operation (e.g. 00 to unit time)
0 units), the test circuit is physically separated from the Debye-Z processing mechanism and the electrical connection must be made through some short distance established by a globe or contact assembly of the type described above. Must be. In short, modern manufacturing methods require contacts with lengths that are cumbersome for fast rising signals. Another solution is to surround each contact with a shield like a coaxial cable. However, the shield impedes the flexibility of the enclosed contacts. Yet another possible solution is to simply test each device slowly to allow distortions and reflections to disappear.

However, for many modern ICs, the speed specification of the device cannot be determined if the test operation is prolonged long enough for the distortion and echoes induced by the rapid rise test signal to subside. The operating speed is fast. In short, the test operation must have a speed comparable to that of the device being tested. Currently, contact assemblies for use with 14-1 automated IC and processing equipment are capable of establishing a reliable electrical connection between an IC device and a test circuit while simultaneously testing the IC with a rapid rising signal. There is no known method which can avoid distortions, reflections, and the measurement uncertainties caused by them.

Another consideration is minimizing reference-to-voltage changes caused by "ground noise" or current surges during the test process that simulate device operation. A typical situation is testing where a change in device state results in a current surge in the range of 20 milliamps/nanoseconds. Such surge currents can move the ground reference by one inch or more17 and distort ground-referenced measurements by more than 20 degrees. As a result of this, even good devices may not pass the test and have their ratings reduced.

Another problem with test equipment for electronic devices lies in the way the probe or contact assembly is connected to the test circuit. A high density of electrical contacts in a limited area is difficult to connect to the test circuit while maintaining signal fidelity. The distortion and reflection issues mentioned above are important design considerations.

Previously, each contact of a test contact assembly was electrically connected to a test circuit by a set of wires supported on a mounting plate and soldered to the desired connection points. This hard connection increased manufacturing time due to the inherent difficulty of making various permanent electrical connections in very limited areas. This also means that each contact assembly and associated test circuit board are now a single assembly. As a result, different I
In order to accommodate C, it was necessary to replace the entire test set. -Also, in the case of hard wiring, the performance of the assembly depends on the skill of the person performing the wiring.

Such a situation reduces the reliability of the assembly.

OBJECTS OF THE INVENTION It is, therefore, an object of the present invention to provide an interface assembly between a test circuit and a contact assembly in which a high density of electrical contacts is provided within a limited area and which is suitable for rapid rising test signals. The objective is to provide a device with excellent signal transmission characteristics.

A particular object of the invention is to provide an interface assembly that allows convenient replacement of contact assemblies and/or test circuits, which increases the variability of operation and reduces the inventory of test parts required. It is to provide.

Another particular object of the invention is to provide the above-mentioned advantage of not requiring strict alignment to establish the test circuit and the only electrical connection necessary to the quantity of contacts or other components of the contactor assembly. By providing an interface device with 7.

Yet another particular object of the invention is to provide an interface assembly with the above-mentioned advantages of transmitting fast-rise signals with substantially % impedance.

Yet another particular object of the invention is to provide a test apparatus in which the electrical path from an electronic device being tested to the test circuit is relatively short.

Yet another particular object of the invention is to provide an interface assembly with the above-mentioned advantages having a generally simple, low cost and highly durable construction.

SUMMARY OF THE INVENTION A contact assembly of the present invention for an electronic device, particularly a dual in-line package (DIP) IC with two parallel rows of connection pins, has a base supporting at least one row of resilient electrical contacts. , and these contacts are connected at their lower ends to the base and extend perpendicularly to the base. Typically, the free end is bent toward the associated pin so as to electrically connect with the associated pin when the contact is bent toward the device. Each contact has a small cross-section and is designed to conduct electrical signals along its length between the test circuit and the device. Each contact is configured to resiliently flex from a first non-test position in which its free end is spaced apart from an associated pin to a second test position in which its free end is brought into electrical contact with the pin. ing. The lower end of each contact preferably extends through the substrate and makes electrical connection with the interface assembly.

The base also supports a conductive plate associated with and oriented in y-parallel and proximate relationship with each contact row. It is preferable that the spacing be uniform. In a preferred form, the plate is continuous and the associated contact rows extend over the entire y length.

The plate may also be fixed to the base at the edges and be elastic. The dimensions and spacing of the plates create a distributed capacitance in terms of the signal transmitted along the contacts.

The resulting capacitive reactance value substantially cancels the inductive reactance generated by the contact's self-inductance. As a result, a characteristic impedance substantially acts on the rapid rise signal emitted by the contact. In other words, the contact assembly is substantially frequency independent and therefore can operate over a wide band. The plate extends through the substrate and also makes electrical connection to the interface assembly.

The contact assembly may include a layer of flexible insulating material interposed between the upright plate and the associated row of contacts. The insulating layer maintains the desired separation distance between the plate and the associated contact during bending operations as the contact connects and disengages from the pin. Also in a preferred form, the value of the characteristic impedance is in the range r50 to 100Ω.

Another special configuration of the contact assembly is that at least one plate is located between the associated contact row and the device under test. This "inner J-plate supports a contact member configured and positioned to make electrical connection with one of the pins. The present invention is adapted for use with devices having two parallel rows of pins. In the preferred form of ~1, there are two
There are two "-inside" boards for this building. These plates and contacts are closely positioned to
A means is provided for supplying a K large test current surge. The dimensions of the plates are such that they impart low inductance. One inner plate is connected to a high current surge source and the other inner plate is connected to ground. The opposite side plates are connected to each other via small capacitors that can be placed either above or below the base.

An interface assembly connects the test contact assembly to the test circuit. The interface assembly is a zero-resistance connector comprising a contact substrate having a conductive stripe pattern formed on at least one side, the electrical connection being established between the conductive stripe and an associated contact or plate of the contact assembly. be done.

Each resilient connector is elongated and carries a series of narrow conductive strips on its surface. The stripes are spaced apart from each other and oriented perpendicular to the y-perpendicular axis with respect to one longitudinal axis of the elastic member. Each elastic connector is attached to the contact board (゛)
A unique electrical connection is established between one conductive strip and the associated contact or plate of the contact assembly.

In a preferred form, the assembly includes two connector frames having openings configured to receive the lower ends of the resilient connectors and contacts. One frame is positioned between the contact substrate and the test contact assembly, and the other frame is positioned below the contact substrate. These connector frames position and secure the resilient connectors relative to both the conductive stripes on the contact substrate and the contacts or plates of the contact assembly. The frame itself is fixed in a preselected spatial relationship with respect to the contact assembly and contact substrate. The interface components use a set of screw-like lamp means to connect the conductive stripes on the contact substrate, the conductive strips and the conductive members of the contact assembly between the conductive members of the contact assembly. are secured to the contact assembly and to each other with sufficient force to establish a viable electrical connection. Preferably, the dimensions of the resilient connector and connector frame are such that upon tightening, the resilient members are compressed to ensure electrical connection with adjacent conductive members. The frame is formed of a substantially rigid material and has a thickness such that the clamp can control the degree of deflection of the moderately elastic connector. Due to the deflection of the connector, the electrical connection described above is established while the structural integrity of the conductive strip is maintained.

In a preferred form, the contact substrate also includes at least one internal conductive path in the form of a metal layer sandwiched into the platen. This layer k is such that a fast rising signal transmitted along the conductive stripes has a unique impedance.

The conductive stripes ICQI may be positioned to set distributed capacitance. The contact substrate may include plated through holes extending from the top and/or bottom of the contact substrate into the intermediate metal layer to establish electrical connections between the intermediate metal layer and the one or more conductive stripes.

These and other particular features and objects of the invention will be readily understood from the following description taken in conjunction with the drawings.

DESCRIPTION OF THE CONTACT ASSEMBLY Referring to FIGS. 1-4, the base 14 and the four rows 16a, 1
6b 116C and 16d contacts 16 and a pair of R, hereinafter collectively referred to as plates 18, are connected to sexual plates 18a, 1
Test contact assembly plate 1 comprising 8b, 18C and 18d
2 is shown. For purposes of this description, the base will be viewed as being horizontally oriented. Further, the base is insulating and has a Y-plate shape. Each plate 18 is associated with a row of contacts. Each contact 16 has a lower end 20 secured to the base 14 and an associated pin 2 of the integrated circuit device 26.
It has a free end or upper end 22 bent towards 4. The cross section of each contact 16 is preferably an X-square, with the wide side of each contact facing parallel to the pin 24. As shown, columns 16a and 1
The contacts of row ISb are arranged to form a Kelvin pair, namely the contacts 161 of row ISb and the contacts of row 16.6b. 161 of the outer row 16a are adapted to simultaneously make an electrical connection with the same pin 24.
The contact 161 in the column farthest from the device is the contact 1
6"kir, and the free end of contact 161' overlaps the free end of contact 161. Similarly, row 16
One contact of C and the associated overlapping contact of row 16d form a Kelvin pair and electrically connect with a pin on the opposite side of device 260. Columns 1-6a and 16
Contact pair b is y-opposite to similar contact pairs in rows 16C and 16d such that contact assembly 12 is electrically connected to all pins of DIPIC 2d of the type shown in FIGS. Enables you to connect to. Column ISa~16
d contacts to each other and to the connection bin 24 of the device 26.
It is parallel to the column.

The lower ends 20 of the pair of contacts include insulating strips 2B, 2
They are separated by 8. The contact is y-perpendicular to the base 14 in the normal, unflexed position shown in FIGS. 1 and 2. In this position, the end 22 of the contact is spaced apart from the pin 24. In addition to being comprised of a highly conductive material, the contact 16 is formed from a material that is resilient and resistant to fatigue of the material during repeated flexural movements relative to the test positions shown in FIGS. . In the bent state, the end surface 22a of the free end 22 is connected to the associated pin 24.
electrically connect with. The spacer rods 50 are arranged in row 16a.
and 16b and between columns 16C and 16a. The rod 3o is indicated by arrows 52 and 521 in FIG.
A transverse force (usually provided by a cam (not shown)) applied in the direction indicated by C ensures the desired spacing between the contacts during the bending movement caused by k.

The main feature of the invention is a set of conductive plates 18a-18d, each associated with a row of contacts 16. Board 185
~18d is preferably square-shaped and is secured to the base 14) with its lower edge 34 passing through a suitable opening in the base 14. The flange 2 portion 36 of each plate extends below and ir-parallel to the base 14 and provides an area of electrical connection to the footing (plates 18a and 18d).

The inner plates 18b and 18c also have seven flange-like portions 37.
Preferably, the 7 flange-like portions have a 7 langous portion 3 except that the 7 langous portions extend along the upper part of the base 14.
6 is the same as y. The flange-like portion 57 is connected to the plate 188
For plate 18bk, electrical connection is made to ground, and for plate 18bk, electrical connection is made to a high current surge source. The plate is formed from a conductive sheet material that is elastic and has a substantially uniform thickness. Each plate also has an associated contact row K
ir parallel to each other and are oriented so as to be spaced apart from the row of contacts by a substantially constant distance. The plates extend vertically over the entire length of the contact and include inner plates 18b and 1B.
, C and the top portion 22 which overlies the inner rows of contacts 16b and 1,6C. Each plate extends transversely at least the length of the associated contact row. For any contact, the associated plate approximates a parallel plate with unrestricted dimensions.

In the preferred form shown, a thin layer 38 of flexible insulating material, such as fluoroplastic, maintains each plate at a preselected spacing from the six associated rows of contacts. Layer 3B is
has sufficient Shore hardness that transverse bending forces (forces in the direction of arrow 52) do not appreciably compress it and do not substantially reduce the spacing between the plates and associated contact rows. It should be.

On the other hand, layer 3B should be flexible enough not to appreciably impede bending movements. Similarly, the plate 18
It should have such flexibility that it does not appreciably impede bending movement due to transverse forces applied through the insulating rods 40 held in alignment with the outer rods 30 of a and 18d. Layer 3B preferably extends over the entire height of the plate and provides a uniform dielectric constant between the plate and the associated row of contacts. The spacing between the plates and the contacts can also be maintained by other means, such as small inelastic spacer members and air as the primary insulating medium.

Each contact has an I
The signal is guided along its length to the end 22 which comes into contact with the associated pin 24 of C26. Each contact, like a common conductor, has a specific inductance L, which is a function of cross-sectional area and length. contact 1
In the case of a conductor with a rectangular cross section of the fir square, such as 6, the thickness of the contact (measured in the direction of the y-arrow 32), the width of the contact W (measured along the direction of the lot 30) and the width of the contact It is a function of length. When a fast rise signal is fired, a contactor contact having a significant length (a typical length is about 1 inch) will generate an inductive reactance xL equal to 2πfL. The inductive impedance generated is
Of course, it depends on the shape of the conductor and the nature of the fast rising signal itself. As mentioned above, since the rapid rise signal can be analyzed as a collection of waves with an extremely high frequency (the typical frequency is soomHz), even the extremely small inductance of the contactor 16 is sufficient to create an inductive actance and prevent transmission. may introduce distortion and reflections into the signal being received.

The plates of the present invention neutralize this inductive reactance by providing distributed capacitance along the length of the contact. This equivalent circuit for a single contact is shown in FIG. 5, where the contact 16 is represented as a series of inductors 42 and the distributed capacitance between the contacts and associated plates is shown in FIG. is represented as a series of capacitors connected between inductor 42 and ground. A signal source or test circuit 46 is connected to one end of the circuit, and an IC 26, represented as a load 48, is connected to the other end. For a given contact and a given test signal, calculating the inductance and Wt of the contact 16 and associated plate 1B using conventional transmission line theory and equations cancels out the phase shift of the inductive reactance xL. It is possible to calculate the plate-to-contact spacing that yields a distributed capacitance of capacitive reactance Xc. As a result, the rapid rise signal transmitted by the contact 16 is subject to a substantially resistive characteristic impedance. That is, there is no net phase shift between current and voltage due to capacitive or inductive elements of the transmission line.

Therefore, the impedance Zo is substantially independent of the frequency of the signal and the test contact assembly 12 is broadband.

Typically, IC26 has a contact assembly impedance of 5.
Tested in 0Ω or 100Ω systems. Therefore, the contact assembly 12 of the present invention preferably has plates 18a-18d configured and positioned relative to the contact 16 to provide a characteristic impedance having one of these values.

The Ω value of ZO is given by the square root of L/C. Of course, the inductance of the contactor or the capacitance introduced by plate 18 will act as a characteristic impedance acting on the signal.
It can be designed to produce a value less than 00, more than 1000, or some intermediate value.

For the contact assembly of the present invention, calculations can give a fairly good indication of the properties, especially if the members are rigid and fixed and the insulating medium is air, but it is not possible to produce the desired characteristic impedance. Achieving such a configuration usually requires trial and error adjustment. Since the pairs of contacts forming a Kelvin contact are connected to the same pin and carry the same signal, the capacitance between the pairs is not important as a practical matter.

However, the capacitance between transversely adjacent contacts is important. To reduce this capacitance, for some applications it may be preferable to use a single contact for each pin rather than a Kelvin pair. Demark. - For a typical Kelvin contact assembly of the type used in test/processors manufactured by the Corporation, approximately 0.014 inch It has been found that the plate-to-contact spacing produces the desired response.

Another important feature of the contact assembly of the present invention is that the inner plates 18b and 18C have pins mounted flush adjacent the IC 24 and positioned to contact the IC's associated bin 24. Contact members 50 and 52 are provided. Contact members 50 and 52 are L-shaped conductors and are welded or brazed to the inner plate. These components are useful for testing the operation of ICs in response to large current surges. One of the inner plates, preferably plate 11b, is
A suitable high current surge source (e.g. a capacitor (not shown))
), and the current surge can be supplied via plate 18b and contact member 50. Board 113b
Note that because the dimensions of the contact are large compared to a single contact, inductive impedance problems normally associated with large current surges are minimized. Contact member 52 is connected to ground via plate 18C, similar to plates 18maro and 18d.

Plates 18b and 18C are interconnected via a small capacitor 54. The function of capacitor 54 can be better understood with reference to FIG. The high current surge source is designated by reference numeral 56.

The IC is shown as a load, and capacitor 54 is connected in parallel with the load. Since the capacitance is small, its impedance to ground is very small. As a result, even though plate 18b is connected to a high voltage source, for fast rising signals, plate 18b
8b works as if it were at ground potential. The advantage of this arrangement is that it provides a high current surge source located very close to the device being tested. This also results in reduced distortion in the transmission and improves the accuracy of test results.

Capacitor 54 is shown in FIGS. 1 and 3 as being positioned on the top surface of base 14 and connected between seven ranks and three ports. This arrangement is IC241'
C has the advantage that capacitors can be placed very close together. However, under certain test conditions, the temperature environment KWl! can adversely affect the IC and some capacitors near the IC! <It is necessary. In these cases, capacitor 54 can be connected between seven ranks 36 of plates 18b, 18c located on the underside of base 14 (shown in phantom). This arrangement allows for thermal isolation for capacitor 54 without substantially increasing the distance between I(1' and the capacitor).

Description of the Interface Assembly Referring to Figures 7-11, the contact assembly 12 is connected to the test channel 44 via an interface assembly 10C1 located directly below the base 14 of the assembly. The interface assembly 10Q is connected to the upper connector frame 1o.
5. It has an upper elastic connector 110, a contact board 115, a lower connector frame 120, a lower elastic connector 125 and a connector clamp plate 150. Upper part: The connector frame 105 is held in contact with the contact assembly 120 base 14 and the upper surface of the contact substrate 115. The lower connector frame 120 is located below the contact board 115 and below the clamp plate 13.
0 is held on the top surface. Interface assembly 10
0 has a sandwich-like structure, as can be seen in Figures 8.9 and 11.

The upper elastic connector 110 has an upper part=connector frame 10
5 is received in the opening 105a.

The lower elastic connector 125 is attached to the lower connector frame 12
The opening 120 of fl is received by i1c. connector 110
The dimensions of the cross-sections of and 125 are such that they slightly protrude above and below the associated openings 105a and 120a. When the assembly 1'O'O is clamped, these protrusions are compressed and create a resilient force that brings the connector into contact with adjacent members above or below the assembly.

Upper elastic; upper for connector 111c; the opening in the connector frame 105 is spaced a short distance from the opening for the lower end 2o of the contact 16, so that the upper elastic connector
It would be appreciated if the electrical connection should be made to the plate 18 rather than to the plate 6. Also elastic; Nectar 110.125
The thickness of the frame 105.120 with respect to the cross-sectional dimensions is:
Controls the degree of deformation of the connectors when they are clamped, and thus the amount of elastic force and shear stress applied to the conductive filaments 145 carried on the outer surface of the connector, which establish the desired electrical connection. do.

The lower end 2o of the contactor 16 is connected to the upper connector frame 10.
5. One set in the contact board 115, lower connector frame 120 and connector clamp plate 150. A screw 135 is screwed into the alignment hole in the lower surface of the base member 14 of the contact assembly through the connector clamp plate 13o, the lower 1 connector frame 12o, the contact board 115 and the upper connector frame 105. The interface assembly is secured to the contact assembly and the components of the interface assembly are tightened together, which tightening creates a compressive force in the resilient connector.

The contact substrate 115 has a top surface 115 and a bottom surface 115 thereof.
A conductive stripe pattern 140 is supported on the substrate b.

The stripes are formed using conventional printed circuit board techniques. Each stripe is electrically insulated from adjacent stripes and electrically connects at one end with a connecting member of a test circuit and at the other end with a contact or other conductive member of a contact assembly. A given contact substrate carries a striped pattern that directs a given test signal to the associated contact 16. To accommodate a different IC, the contact substrate 115 typically need only be modified and configured with a different set of electrical connections.

・、：・．

Upper and lower elastic; Nectar 110. and 125 is
It is an elongated member made of an elastic insulating material. These members are aligned with the rows of contacts 16. The outer surface of each connector 110, 125 carries a number of narrow, spaced apart conductive strips 145. Each conductive strip is oriented perpendicular to the longitudinal axis of the connector and is preferably wrapped around the connector.
It may have a circular cross-section, or it may have other shapes, such as the rectangular cross-section seen in FIG. 10B. This type of resilient connector is commercially available.

Each upper elastic connector 110 is connected to the upper surface 1 of the contact substrate 115.
A single electrical connection is established between one conductive stripe 140 on 15a and the associated clamping portion 36 of plate 18. Each lower elastic connector 125 connects to the lower surface 1 of the board 115.
Contact 1 associated with one conductive stripe on 15b
The only electrical connection is established between the lower ends 20 of 6. The signal emitted by the test circuit passes from the conductive stripes on the contact substrate 115 through one or more conductive strips on the upper or lower resilient connectors 145 to the contacts or plates of the contact assembly. The important lessons of the present invention are the above-mentioned features.
This design ensures that when the contact board is positioned on the contact assembly, the desired electrical connection is established with the resilient connector, without the need for strict alignment, complex fittings, or point-to-point hard wiring. This means that it is not necessary.

As shown in FIG. 11 5, the contact substrate 115 may include an internal conductive path, preferably a metal layer 155 sandwiched in the center of the contact substrate 115 .

This layer typically comprises at least 1i115a and 115
The electrical current is distributed in the transverse direction up to the stripe pattern on b. Conventional plated holes 140 extending from the top or bottom surface of the contact substrate to the metal plate form an electrical connection path from the exterior of the substrate 115 to the inner layer 155. The electrical signal is transmitted from the plate 155 to the contact substrate 1 through the plating through hole 160.
15 and then through conductive strips 145 on the upper or lower resilient connector to the contacts or plates of the contact assembly. One such plated hole 11SO is shown in FIG.
Stripe 140 (31) on top is shown as being large. In FIG. 11, the thickness of stripe 140 is greatly exaggerated.

Also, although one layer 155 is illustrated in FIG. 11, two or more layers can be used. layer 1
55 functions similarly to plate 18 with respect to contact 16 with respect to stripe 14G, in addition to providing a ground connection. Specifically, the dimensions and spacing of layers 155 are:
For the fast rising test signal carried by stripe 140, the interface assembly is selected to provide a distributed capacitance such that it exhibits a substantially 41-wire impedance or a purely resistive impedance. One more layer 155
This function can be performed by a metal layer formed on the outer surface of the contact substrate 115. Furthermore, for purposes of this application, the term "pattern of conductive stripes" includes the case where the pattern is a substantially continuous metal layer.

The interface assembly of the present invention allows for high-density electrical connections in a limited area while providing excellent signal transfer properties. It is also important to be able to establish the required electrical connections without requiring strict alignment between other components. In particular, precise point-to-point alignment of contacts with pin connectors or socket connectors can be avoided. Because the contacts are not soldered to the circuit board, the same interface assembly used with Kelvin contacts can be used with a single contact. Also, when integrated circuits with different pin assignments are being tested, interface components may be replaced.

The resilient connector and the same contact assembly can be used with different contact substrates to test new devices. This separability of mechanical and electrical components of the device results in a considerable reduction in the number of test parts required in inventory.

Although the present invention has been described in connection with preferred embodiments, those skilled in the art will recognize that various modifications and changes will occur from the foregoing description and drawings. For example, although the invention has been described with respect to a continuous plate, the capacitive function of the plate can be performed with a series of conductive strips (see FIG. 11), each associated with a contact, or with a non-rectangular plate that is not necessarily continuous.

Additionally, although the plate 18 has been described as a substantially resilient member with one edge secured to the base member 14, substantially inflexible plates and plates that are not secured to the substrate may also be utilized as desired in the present invention. operating characteristics. One example would be to utilize a plate that is adhesively secured to the associated layer 58 and not directly to the substrate 14. The resilient connector has also been described as having a conductive strip transversely surrounding its periphery. However, an open-loop strip would accomplish the same function if it was energized long enough to make the desired electrical connection. It should be understood that one skilled in the art may devise other modifications and changes within the scope of the claims.

[Brief explanation of the drawing]

1 is a perspective view of a broadband contact assembly constructed in accordance with the present invention and utilizing two opposing rows of double gel pin contacts suitable for testing DIPIC; FIG.
3 is a vertical cross-sectional view of the contact assembly illustrated in FIG. 3, and FIG. The corresponding schematic diagram, FIG. 4, is a representative IC illustrated in FIG.
FIG. 5 is a schematic circuit diagram for one contact and its associated plate; FIG. 6 is a detailed perspective view of the free end of the contact making electrical connection with the inner capacitor plate shown in FIG. FIG. 7 is a schematic circuit diagram of an interface assembly constructed in accordance with the present invention in combination with the contact assembly shown in FIGS. 1-4, and FIG. Figure 9 is an isometric view of the interface assembly shown in Figures 7 and 8 with portions removed to show the interior of the interface assembly; FIGS. 10A and 10B are perspective views of two different embodiments of resilient connectors used in the interface assemblies illustrated in FIGS. 7-9; FIG. FIG. 10 is a detailed cutaway view of an interface assembly of the same type as shown in FIGS. 7-10; 12: Contact assembly 14: Base 16: Contacts 16a-16d: Contact rows 188-18a: Capacitive plate 20: Contact bottom end 22: Contact top end 24: Integrated circuit device bin 26: Integrated circuit Device 28: Insulating strip 30: Spacer rod 36: Flange portion 57 = Flange-like portion 58: (Insulating) thin layer 40: Insulating rod 100: Interface assembly 105: Upper connector frame 115: Contact substrate 120: Lower connector Frame 125: Lower elastic connector 130: Connector clamp plate 140: Conductive stripe FIG, 6 FIG, 7 FIG, θ FIG, 9

Claims (1)

[Claims] (11. In an apparatus for establishing an accurate and reliable electrical connection between a test circuit and a plurality of connection pins of an integrated circuit device arranged in at least one row without using rigorous assembly techniques. , a base made of an insulating material, arranged in at least one row, a lower end fixed to the base and an upper end one of the pins.
a plurality of contacts adapted to make electrical connection with the front pin, each having a first position in which said top end is spaced from said pin; and a second position in which said top end is in electrical connection with said front pin; said at least one row of contacts, said at least one row of contacts being flexible to move between positions and each adapted to conduct an electrical signal along its length to an associated pin of the device; plates spaced apart and fixed in parallel relationship, the dimensions of said plates and said spacing being generated by said signal in said contact due to a distributed capacitive reactance in said contact caused by the presence of said plates; 5. A contact assembly configured to cancel inductive reactance so that fI\f-based impedance acts on the signal over a wide band; and a contact substrate having a conductive stripe pattern on at least one surface. and,
at least one elongated resilient connector comprising spaced apart electrically conductive strips oriented perpendicular to the longitudinal axis thereof and carried on an outer surface thereof; and means for securing said resilient connector; an interface assembly comprising: a conductive strip on the contact substrate and the contact assembly; the contact substrate and the contact assembly being maintained in a fixed position relative to each other; An electrical connection setting device characterized in that it sets only one electrical two-way connection between the three-dimensional contactor or one of the plates. (2. The device according to claim 1, wherein the contacts are double Kelvin contacts arranged in four nr parallel rows and uniformly spaced apart along the direction of the rows. 3. The apparatus of claim 2, wherein the plate includes an inner plate and an outer plate associated with each row of the Kelvin probes. is located between the bottle and the contact, and is fixed to the plate so that the contact is connected to the second contact.
An electrical connection setting device comprising a contact member adapted to set an electrical connection with one of the pins when in position. (4) An electrical connection setting device according to claim 3, wherein the plates are electrically connected to each other via a small capacitor. (51% allowance) In the device according to claim 1 or 2, the fixing means is located at the foot of the upper connector 7 located between the base and the contact board, and at the bottom of the connector 7 located directly below the contact board. a connector frame; the contact board;
An electrical connection setting device including clamping means for clamping the resilient connector and the front arm portion and lower connector frame together and to the contact assembly. (6) The device according to claim 5, wherein the clamp means includes a connector clamp plate located under the lower connector frame, the connector clamp plate, the lower connector frame, the contact substrate, and the An electrical connection setting device comprising a classical screw threaded freely through the upper connector frame and into an alignment screw hole in the base member. 7. The apparatus of claim 5, wherein said upper and lower connector frames each include an opening for receiving and locating one of said resilient connectors. (8) % Pestle An electrical connection setting device according to claim 1 or 2, wherein the contact substrate has at least one internal conductive path. (9) Scope of claims! l! 3. The electrical connection setting device according to claim 2, wherein the internal conductive path comprises a metal layer. 0.01 % permissible range In the apparatus of clause 9, the conductive strip drive pattern is such that the metal layer provides a distributed capacitance with respect to the conductive stripe nozzle. an electrical connection setting device positioned and dimensioned relative to the electrically conductive strip such that a fast rising signal transmitted by the conductive strip has a substantially % impedance; Qll. The apparatus of claim 8, including means for establishing an electrical connection between the internal conductive path and a portion of the conductive stripe formed on at least one outer surface of the contact substrate. electrical connection setting equipment including;