JPS5890060A - Bag for packing electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a packaging bag, and more particularly to a bag for packaging electronic components.

Electronic components that are sensitive to static electricity, such as semiconductors, are easily damaged by static electricity before they are attached to electronic circuits, and even after they are attached to electronic circuits, which poses a major problem. Therefore, in order to protect electronic components from static electricity,
Plastic films and metal foils mixed with conductive substances such as carbon and metal powder are used as packaging materials for electronic components.

However, since all of these are opaque, it is impossible to confirm the existence and damage of the electronic components inside, or to identify the type.On the other hand, plastic films containing antistatic agents are used. However, this has a relatively high air resistance per unit area, and is completely inadequate for protecting electronic components.Additionally, some types of antistatic agents are easily affected by moisture and have poor stability. I'm lacking in energy.

The present invention eliminates the above-mentioned drawbacks and provides a bag for packaging electronic components that allows the electronic components contained in the package to be seen through and is sufficient to protect the electronic components from static electricity. Furthermore, the present invention provides an extremely convenient, useful, and novel bag for packaging electronic components in which the packaging sheet used therein can be heat-sealed on both sides.

That is, the present invention has the following features: A) A transparent plastic film having heat-sealable properties on both the front and back surfaces is coated with metal thin films on both the front and back surfaces.

B) The light transmittance of the metal thin film is 25% or more when light passes through the metal thin films on both the front and back surfaces.

C) The electrical resistance per unit area of the metal thin film is less than io''Ω.

Illusion A transparent protective layer containing an antistatic agent or not containing an antistatic agent is provided as necessary on the thin metal film with a thickness of 1μ or less ◎Meets the above requirements M) to E) This bag for packaging electronic parts is formed by forming a package using a packaging sheet that can be heat-sealed on both the front and back sides.

Next, this invention will be explained with reference to the drawings.

Both FIG. 1 and FIG. 2 are partially enlarged cross-sectional views showing an example of a packaging sheet used in the electronic component packaging bag of the present invention, and the fifth issue shows an embodiment of the present invention. FIG. 2 is a partially cutaway perspective view of a package formed using the packaging sheet of FIG. 1;

In the figure, 1 is a transparent plastic film having heat sealability on both the front and back surfaces, 2 is a metal thin film, 3 is a transparent storage layer, and 4 is a heat seal portion.

The transparent plastic film 1, which has heat-sealability on both the front and back surfaces, is made of polyethylene film, ionomer resin film, ethylene-vinyl acetate copolymer film, polished polypropylene film, vinyl chloride 77'
If the plastic film itself is heat-sealable, such as lum, it can be used as is.

The transparent plastic film 1, which has heat-sealing properties on both the front and back sides, may also include polyester film, acrylic film, vinyl chloride film, fluororesin film,
It can also be obtained by providing a transparent heat-sealable layer on both the front and back sides of a styrene film, polypropylene film, polyethylene film, or other transparent plastic film that can be used as a coloring material.This heat-sealable layer is a plastic film. F-μ can be provided by pasting polyethylene or other heat-sealable films on top, or by extruding and laminating or coating polyethylene or other resin.
Examples of resins that can be used for the adhesive layer include polyethylene, soft vinyl chloride, modified polyester, MVM, and various other heat-fusible resins. The heat V-μ layer can also be provided not on the entire surface, but only on the part where heat sealing is actually performed. The metal thin film 2 can be formed using a vacuum evaporation method, a sputtering method, an ion blating method, or an electron beam evaporation method. A transparent plastic film 10 having heat-sealability is provided on both the front and back surfaces by a conventionally known thin film production method such as It includes a thin film made of a single metal, a thin film made of an alloy, and a thin film made of a metal compound such as a metal oxide.The metal thin film 2 contains Cr, Ni, Muls, etc.
1, A9, Mu1, Cu%Sn, Zn, Ti, Ni-
Cr, engineering n20. Any material that can produce a thin film, such as It is necessary to satisfy the conditions of thickness 10X to 25 oz. These conditions of light transmittance, electrical resistance, and film thickness are essential for achieving the purpose of this invention.In other words, the light transmittance in the above case is If it is lower than 25-, it will be difficult to see through the electronic components inside the package.

Furthermore, if the electrical resistance of the metal thin film is higher than 10 8 Ω, the conductivity is poor and it is insufficient to protect electronic components from static electricity charging.

Film thickness shows the relationship with light transmittance and electrical resistance, and at the same time shows the relationship with heat sea ρ.
If the following conditions are met, the thickness of the O film without nose is 10;
If it is thinner, the electrical resistance tends to be higher than 1♂Ω depending on the metal, and the protection of electronic components becomes insufficient. If the film is thicker than 250mm, the light transmittance will be 25mm depending on the metal.
- It becomes lower, making it difficult to see through the electronic components inside.

In this way, the light transmittance, electrical resistance per unit area, and film thickness of the metal thin film 2 in the above case are closely related to each other, and the metal thin film 2 satisfies all of these three conditions. The thickness of the thin metal film 2 that needs to be formed is also of critical importance when forming a heat-sealed package.If the thickness of the thin metal film 2 is below 250A Since this is extremely thin, it does not particularly affect the heat seal /I/, and heat sealing is possible in the same way as when the metal thin film 2 does not exist. ◎ This invention involves heat-sealing both the front and back sides to form a package and packaging electronic components in the package.
Since the electrical resistance per unit area of the metal thin film 2 is conductive, it can sufficiently protect electronic components from static electricity generated inside and outside the packaging.In particular, both the inside and outside of the packaging are made of metal. Since the thin film 2 exists on the surface, the effects of static electricity can be almost completely eliminated.Furthermore, since this invention uses a packaging sheet that can be heat-sealed on both the front and back sides, the above effects, In addition to its advantages, it also has the following extremely convenient and beneficial effects.

■ Conventional products use a material that can be heat-sealed on only one side, so it is necessary to check in advance to confirm which side can be heat-sealed when heat-sealing. The invention is based on such a heat sea μ
There is no need to check the surface ■ There is no possibility of setting the front and back sides incorrectly during automatic bag making @ Therefore, work efficiency is greatly improved In the case of seals as well, heat sea μ can occur in any combination of the same surfaces or opposite surfaces.

- Since heat sealing can be performed in any combination on both sides, it is extremely easy to increase the width of the sheet by heat sealing.

■ By stacking multiple sheets and heating them, it is possible to assemble the sheet firmly. This invention is a transparent differential film that has heat sealability.
In addition, in this invention, a transparent protective layer 3 made of an appropriate resin can be provided on the metal thin film 2, and in this case, a transparent protective layer 3 containing an antistatic agent can be used. 3 can also contain an antistatic agent. However, the protective layer 3 needs to be extremely thin, with a thickness of 1 μm or less. This is because if the thickness of the protective layer 3 exceeds 1μ, it will have some effect on the removal of static electricity and heat sealing due to its presence on the surface. If it is less than 1μ, it is extremely thin, so it has almost no effect on static electricity removal or heat sealing, and even if it does, it is so small that it can be ignored for electronic component packaging. ◎ Of course, this invention can be colored or printed as appropriate, and this invention also includes items that are colored and printed at appropriate locations.

Example 1 A Cr vapor-deposited film with a light transmittance of 78 inches, an electrical resistance per unit area of 6 x 1♂Ω, and a film thickness of soX was formed on one side of a transparent polyethylene film with a thickness of 40μ by vacuum deposition. Next, a Cr vapor-deposited film having a light transmittance of 80 cm, an electrical resistance per unit area of 1.5×1♂Ω, and a film thickness of 40 Å was formed on the other side of the polyethylene film by the same vacuum deposition method. The light transmittance of the entire sheet-like material thus obtained was about 61 inches.

Next, using the sheet-like material thus obtained, a package A with the 50A Cr film thickness on the outside and a package B with the Cr film thickness of 40λ on the outside were formed by heat sealing. 〇Example 2゜ N film with a light transmittance of 75 cm, an electrical resistance per unit area of 4 x 10'Ω, and a film thickness of 50A was deposited on both sides of a transparent ionomer resin film with a thickness of 40μ by vacuum evaporation.
1 evaporated film was formed, and then a transparent resin paint containing 0.11 s of antistatic agent was applied to the N1 evaporated film on both sides using the 90 method.
The light transmittance of the entire sheet-like product thus obtained, on which a protective layer with a thickness of 2 μm was formed, was about 50 μm.

Next, using the sheet-like material obtained in this way, a package C is formed by heat sealing. A zero-order heat-sealable polyester film in which a Cr vapor-deposited film with a light transmittance of 50 cm, an electrical resistance per unit area of 4 x 1♂Ω, and a film thickness of 120 A is formed on one side of a polyester film using an electron beam evaporation method. A Cr vapor-deposited film with a light transmittance of 60%, an electrical resistance per unit area of 2 x 105 Ω, and a film thickness of 60 µm was formed on the other side of the ◇Sheet-like article obtained in this way. The overall light transmittance was about 50 inches.

Next, using the y-)-shaped product obtained in this way, packaging was carried out with the side with the Cr film thickness of 120X outside, and the Cr film thickness was 60A.
Packaging E with the side facing outward was formed by heat sealing.◎ Next, a comparative example with a conventional product is shown.

As a comparative example, a conventionally commercially available heat-sealable non-static polyethylene packaging (pink plastic bag manufactured by Tokyo Denki Kagaku Kogyo Co., Ltd. was used as Sump/v1), and a polyester film with a thickness of 25 μm and a polyethylene film were laminated together. This was adopted as sump A/2 @ Packagings A- and 1 obtained in Examples 1 to 3, and a liquid crystal plate was sealed in each of the packages of Samples 1 and 2. aooo from a distance of 101 toward each package containing
v~10000V static electricity generator (ZICRO8TAT
) was irradiated with ions of ■ and e, and the presence or absence of disorder in the letters and numbers in the liquid crystal panel was inspected. The transparency of the packaging was also compared.The results are as follows:○...No disturbance at all.

×...Extremely disordered It is clear from the results in the 〇 table that when the electronic parts packaging bag of this invention is used, the characters and numbers on the liquid crystal display are not disordered at all, compared to conventional products. Regarding film retention from static electricity,
This has extremely significant effects.

[Brief explanation of the drawing]

Both FIG. 1 and FIG. 2 are partially enlarged sectional views showing an example of a packaging sheet used in the electronic component packaging bag of the present invention, and FIG. 3 is a partially enlarged sectional view showing an example of the packaging sheet of the present invention. , is a partially cutaway perspective view when a package is formed using the packaging sheet shown in Figure 1.
Transparent Goofstick Film 2...Metal Thin Film 5...Transparent Protective Layer 4...Heat Sea μ Department Patent Applicant Reiko Co., Ltd. Figure 1 3 years old

Claims (1)

[Claims] A) Metal thin films are provided on both the front and back sides of a transparent plastic film that has heat-sealing properties on both sides. B) The light transmittance of the metal thin film is determined by The electrical resistance per unit area of the metal thin film is 108Ω or less. E) A transparent protective layer containing an antistatic agent or not containing an antistatic agent with a thickness of 1μ or less is provided as necessary on the metal thin film. Electronic component packaging bag O formed by forming a package using a packaging sheet that can be heat-sealed on both the front and back sides, which is characterized by meeting the requirements.