JPS58195481U - 電子装置 - Google Patents
電子装置Info
- Publication number
- JPS58195481U JPS58195481U JP9317782U JP9317782U JPS58195481U JP S58195481 U JPS58195481 U JP S58195481U JP 9317782 U JP9317782 U JP 9317782U JP 9317782 U JP9317782 U JP 9317782U JP S58195481 U JPS58195481 U JP S58195481U
- Authority
- JP
- Japan
- Prior art keywords
- circuit unit
- case
- electronic equipment
- opening
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は本考案になる電子装置を示す断面図。、１・・
・・・・電子装置、２・・・・・・ケース、３・・・・
・・回路ユニット、４．５・・・・・・硬化性充填材、
６・・・・・・板材。
・・・・電子装置、２・・・・・・ケース、３・・・・
・・回路ユニット、４．５・・・・・・硬化性充填材、
６・・・・・・板材。
Claims (1)
- 開口部を有するケース内部に、電子部品が装着−された
基板からなる回路ユニットを収納すると共（こ硬化性充
填材を充填させ、該回路ユニットの一部を該ケースの開
口部から突出させて該回路ユニットと該ケースとを一体
的に固定せしめ、該回路ユニットの一部に板材を配した
ことを特徴とする電子装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9317782U JPS58195481U (ja) | 1982-06-21 | 1982-06-21 | 電子装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9317782U JPS58195481U (ja) | 1982-06-21 | 1982-06-21 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58195481U true JPS58195481U (ja) | 1983-12-26 |
| JPH0129828Y2 JPH0129828Y2 (ja) | 1989-09-11 |
Family
ID=30223845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9317782U Granted JPS58195481U (ja) | 1982-06-21 | 1982-06-21 | 電子装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58195481U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002050900A1 (fr) * | 2000-12-19 | 2002-06-27 | Sony Corporation | Dispositif a circuits electroniques |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519622U (ja) * | 1974-07-05 | 1976-01-24 | ||
| JPS519628U (ja) * | 1974-07-08 | 1976-01-24 |
-
1982
- 1982-06-21 JP JP9317782U patent/JPS58195481U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519622U (ja) * | 1974-07-05 | 1976-01-24 | ||
| JPS519628U (ja) * | 1974-07-08 | 1976-01-24 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002050900A1 (fr) * | 2000-12-19 | 2002-06-27 | Sony Corporation | Dispositif a circuits electroniques |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129828Y2 (ja) | 1989-09-11 |
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