【発明の詳細な説明】
本発明はプリント配線板に用いられる鋼張積層板０１１
面清浄化方決に関し、銅張積層板をアル九り性駿化処層
液に浸漬して鋼ｆＩｉ表面を酸化させ、次でこれを酸濤
ＩＮＫ浸漬することによ〕酸溶液に酸化鋼を涛解畜せる
こと１０黴とすゐ鋼張積層板ｏ＊ＦＩｊａｍ浄化方決に
係るものであり０鋼張積層板Ｏ＃ＩＷ／ｉ表面には防錆
剤が付着して一九り、手あか岬Ｏ有機物が付着していた
り、ｔたは酸化物が付着していＡＩする場合があるので
、これらを除去するえめにプリント配線板への製造工１
ｉＫお−て鋼箔表１１１ｉｔ清浄化するｌ１が多く設け
られて−る０
すなわち、（Ｉ） エッチンクレジストインクやめク
ーレジストインクの印刷の前ｌＩ＆運、（１）７オトレ
ジストのコーチインクや感光性ドライフィルムの５工ネ
ートの前地理、（１） ツルターレジストインクの印
刷０＊Ｊ６１１．ｋ） 多層プリント配線板積層成形
前ｏｈｍ運等における清浄ＩＪ＆瑠であるＯかかる清浄
地理にあ良りて従来は研磨機を用いて鋼種表面を研磨す
ることによ）、鋼箔の１１面を清浄化するようにしてお
９、かかる機械的研磨では薄い鋼張が研磨機の０−ルに
番曹込まれて剥れ九り損傷したりずゐおそれがあ如、を
九銅箔が引寝伸ばされて回路の位置精度に狂ｉが生じえ
りするおそれも６１さらには均一な清浄化は１１１１ｍ
で清浄が不十分になり九りするおそれがあり九。このよ
うに清浄化が不十分な場合には、上記（１） 、 （ｊ
ｌ）の場合レジストインクの鋼惰へ０１１着が不十分に
なりてＩツチ：／クヤめり難工程中に剥離を起こし正常
な回路を形成で自ないことに＆ｉ（ｇ＋）ｏ場会レジス
トやフィルムの鋼箔への密着が不十分であ参牛田付けの
工１に耐えることがで曹ないことになり、ｆｌｄＯ場会
に場合層回路鋼箔と接着用プリプレグとＯ密着が不十分
で会層の密着不嵐や耐熱不嵐を起ζすおそれがあるとい
う問題を生じるものであゐ・
本発明は上記０点に鑑みてなされたものであって、研磨
の場合のような問題点が生じるおそれなく清浄化を行な
うことがで曹る鋼張積層板Ｏｍ１面清浄化方ａｔ提供す
ることを目１とするものである・
以下木ａ明を実施例によシ詳述する〇
鋼張積層板は、紙、Ｂラス布勢基＃にフェノール樹脂、
Ｉ車中シ樹脂等熱硬化性樹脂を含浸乾燥せしめて得えプ
リプレグを複数枚重ね−さもに鋼ｍを重ねて加熱加圧成
形することＫよ砂得られるもので、かかゐ鋼張積層板の
鋼箔表面を清浄化するにあえりては、先ず銅張積層板を
酸化銅旭運液に浸漬する・
酸化鋼＃６Ｉｌ液としては）（ａｃＩｅｓヤＮａＯＨの
水溶液（例えばＮａＣｌ０ｍのｇｏｏｒ／１８１１ヤＮ
ａＯＨの５ｏｏｔ／ｌ １１液）を用いることがで自、
この処ｌｌ液を・Ｏ〜８０’ＣＫ加温し良状態で畠分ｍ
楊度浸漬するものであゐ・このように処理すると鋼張積
層板０Ｉｌｌ向には極めて薄く酸化銅の被膜が形成され
る０次でこのように処理した鋼張積層板を酸溶液に浸漬
する。酸溶液としては１０５１ＨＣｊ＠液ヤ１０１１ｕ
ｓ！ｉｏａ＃ＩＦ液などを用いることかで曹、このよう
に酸Ｓ＊に浸漬することにより、鋼箔表面に形成されえ
酸化銅Ｏ被膜を溶解除去し１酸化鋼被膜が除去されゐＩ
ＩＫ鋼張鋼張真打着し九防錆剤、有機物、酸化物などが
酸化銅被膜とともに除去され１端張積層板の１１１面の
清浄化が行なわれるものである上述のように本発明は、
鋼張積層＃Ｌｔアルカリ性駿化魁瀾箪Ｋｆｆｌ漬して鍋
漸表ｍを酸化させ、次でこれｔ酸溶液に浸漬することに
よ）酸溶液に酸化鋼を溶解させるようにしたので一研磨
機による機械的研磨を行なう必Ｕ＊＜化学的手段で鋼箔
表面の清浄化を行なうことがで會、研磨機による清浄化
の方決に付随する問題点を一掃し丸鋼箔表面の清浄化を
行なうことがで曹るものである〇代理人 弁理士 石
１）長 七Detailed Description of the Invention The present invention provides a steel clad laminate 011 used for printed wiring boards.
Regarding the surface cleaning method, the copper-clad laminate is immersed in an alkali-based oxidation treatment solution to oxidize the steel fIi surface, and then immersed in acid INK to clean the oxidized steel in the acid solution. 10 This is related to the method of purifying mold and steel clad laminate O*FIjam. Teaka MisakiO Organic substances or oxides may adhere to AI, so in order to remove these, the manufacturing process 1 on the printed wiring board must be carried out.
There are many ways to clean the steel foil surface (I) before printing with etching resist ink and cool resist ink, (1) 7 with etching resist ink and cool resist ink and photosensitive coating. Previous geography of the five-layer dry film, (1) Printing of Tsurutaresist ink 0*J611. k) Before lamination molding of multilayer printed wiring boards, the 11 sides of the steel foil were polished by polishing the surface of the steel using a polishing machine. In such mechanical polishing, there is a risk that the thin steel foil may get stuck in the polisher's hole and be damaged by peeling off. There is also the risk that the positional accuracy of the circuit may be disrupted by being stretched out.61 Furthermore, uniform cleaning is impossible.
There is a risk of insufficient cleanliness and injury. If the cleaning is insufficient in this way, the above (1), (j
In the case of l), the resist ink does not adhere to the steel plate sufficiently and peels off during the difficult process, making it impossible to form a normal circuit. If the adhesion of the film to the steel foil is insufficient, it will not be able to withstand the process 1 of attaching Ushida, and in the case of fldO, the adhesion between the layer circuit steel foil and the adhesive prepreg is insufficient. This may cause problems such as poor adhesion of the layer and poor heat resistance.The present invention was made in view of the above point 0, and it does not solve the problems such as those in the case of polishing. The first objective is to provide a method for cleaning one side of a steel clad laminate that can be cleaned without the risk of causing. The tension laminate is made of paper, B lath cloth base #, phenol resin,
It is obtained by impregnating and drying a thermosetting resin such as a car interior prepreg, and by stacking multiple sheets of prepreg.Similarly, it is obtained by stacking steel sheets and molding them under heat and pressure. To clean the steel foil surface of the plate, first immerse the copper-clad laminate in copper oxide solution. 1811yaN
It is possible to use aOH (5oot/l 11 liquid).
This treated solution was heated to 0~80'CK, and then heated to 1000 ml in good condition.
When treated in this way, a very thin copper oxide film is formed on the steel clad laminate.The steel clad laminate treated in this way is immersed in an acid solution. . As an acid solution, 1051HCj@liquidya1011u
s! By immersing in acid S* in this way, the copper oxide O film that may be formed on the surface of the steel foil is dissolved and removed, and the steel mono oxide film is removed.
As described above, the present invention is one in which rust preventives, organic substances, oxides, etc. are removed together with the copper oxide film by IK steel-clad steel-clad steel bonding, and one side of the edge-strapped laminate is cleaned.
Steel clad laminate #Lt was soaked in alkaline water to oxidize the pot, and then immersed in an acid solution to dissolve the oxidized steel in the acid solution. It is necessary to perform mechanical polishing using a machine.It is possible to clean the surface of the steel foil by chemical means, which eliminates the problems associated with the cleaning method using a polishing machine and cleans the surface of the round steel foil. 〇Representative Patent Attorney Ishi 1) Chief Seven