JPS57210645A - Hybrid integrated circuit module and manufacture thereof - Google Patents
Hybrid integrated circuit module and manufacture thereofInfo
- Publication number
- JPS57210645A JPS57210645A JP9463781A JP9463781A JPS57210645A JP S57210645 A JPS57210645 A JP S57210645A JP 9463781 A JP9463781 A JP 9463781A JP 9463781 A JP9463781 A JP 9463781A JP S57210645 A JPS57210645 A JP S57210645A
- Authority
- JP
- Japan
- Prior art keywords
- case
- integrated circuit
- bottom plate
- circuit module
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To reduce the size of a hybrid integrated circuit module and to improve the reliability of the module by forming an insulating layer which places electronic parts on the bottom plate of the module and filling resin from upper hole in an enclosure. CONSTITUTION:An insulating substrate 25 which places electronic parts such as resistors or the like is formed on a bottom plate 24 to become a radiator, a case having filling holes 22 is disposed on the upper surface, sealing resin 23 is filled through the holes 22 into the case, and the case 21 is bonded to the bottom plate 24. Since a frame mounting space becomes unnecessary in this case, the size of a produce profile can be reduced, and the reliability can be improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9463781A JPS57210645A (en) | 1981-06-19 | 1981-06-19 | Hybrid integrated circuit module and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9463781A JPS57210645A (en) | 1981-06-19 | 1981-06-19 | Hybrid integrated circuit module and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57210645A true JPS57210645A (en) | 1982-12-24 |
Family
ID=14115778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9463781A Pending JPS57210645A (en) | 1981-06-19 | 1981-06-19 | Hybrid integrated circuit module and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57210645A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038842A (en) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52103677A (en) * | 1976-02-25 | 1977-08-31 | Sanyo Electric Co | Method of sealing hybrid integrated circuit |
-
1981
- 1981-06-19 JP JP9463781A patent/JPS57210645A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52103677A (en) * | 1976-02-25 | 1977-08-31 | Sanyo Electric Co | Method of sealing hybrid integrated circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038842A (en) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | Semiconductor device |
| JPH0532907B2 (en) * | 1983-08-12 | 1993-05-18 | Hitachi Ltd |
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