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JPS57206042A - Method for checking wiring pattern of wafer - Google Patents

Method for checking wiring pattern of wafer

Info

Publication number
JPS57206042A
JPS57206042A JP8160281A JP8160281A JPS57206042A JP S57206042 A JPS57206042 A JP S57206042A JP 8160281 A JP8160281 A JP 8160281A JP 8160281 A JP8160281 A JP 8160281A JP S57206042 A JPS57206042 A JP S57206042A
Authority
JP
Japan
Prior art keywords
wafer
wiring pattern
insulating film
infrared rays
metallic wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8160281A
Other languages
Japanese (ja)
Inventor
Nobuo Iijima
Akinori Tanizaki
Kunimichi Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8160281A priority Critical patent/JPS57206042A/en
Publication of JPS57206042A publication Critical patent/JPS57206042A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To perform the checking of the metallic wiring pattern of the wafer readily and automatically by irradiating infrared rays to the wafer, utilizing the reflected light or the transmitted light, and discriminating the metallic wiring pattern of the wafer surface and an insulating film. CONSTITUTION:In the wafer 10, the metallic wiring pattern and the insulating film are formed on a semiconductor substrate. When the infrared rays are utilized, the reflectivity with respect to metal is very large. Conversely, the transmittance with respect to the insulating film is high. The infrared rays are irradiated to the wafer 10 from lamps 12a and 17, and the reflected light or the transmitted light is detected as electric signals by image sensors 15a and 15b. Then the outputs A and B from the image sensors 15a and 15b are applied to a differential amplifier 16, and the difference signal A-B is obtained. When said difference signal A-B is present, the defect is present in either metallic pattern.
JP8160281A 1981-05-28 1981-05-28 Method for checking wiring pattern of wafer Pending JPS57206042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8160281A JPS57206042A (en) 1981-05-28 1981-05-28 Method for checking wiring pattern of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8160281A JPS57206042A (en) 1981-05-28 1981-05-28 Method for checking wiring pattern of wafer

Publications (1)

Publication Number Publication Date
JPS57206042A true JPS57206042A (en) 1982-12-17

Family

ID=13750860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8160281A Pending JPS57206042A (en) 1981-05-28 1981-05-28 Method for checking wiring pattern of wafer

Country Status (1)

Country Link
JP (1) JPS57206042A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020528A (en) * 1983-07-14 1985-02-01 Nec Kansai Ltd Selecting method of semiconductor pellet
US4825093A (en) * 1986-05-20 1989-04-25 Fujitsu Limited Methods for identifying semiconductor wafer with bar code pattern thereon and methods for manufacturing semiconductor device
WO2012063859A1 (en) * 2010-11-09 2012-05-18 株式会社ニコン Substrate inspection method, substrate inspection device, exposure system, and manufacturing method for semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020528A (en) * 1983-07-14 1985-02-01 Nec Kansai Ltd Selecting method of semiconductor pellet
US4825093A (en) * 1986-05-20 1989-04-25 Fujitsu Limited Methods for identifying semiconductor wafer with bar code pattern thereon and methods for manufacturing semiconductor device
WO2012063859A1 (en) * 2010-11-09 2012-05-18 株式会社ニコン Substrate inspection method, substrate inspection device, exposure system, and manufacturing method for semiconductor device
US10460998B2 (en) 2010-11-09 2019-10-29 Nikon Corporation Method for inspecting substrate, substrate inspection apparatus, exposure system, and method for producing semiconductor device

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