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JPS5649547A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5649547A
JPS5649547A JP12413979A JP12413979A JPS5649547A JP S5649547 A JPS5649547 A JP S5649547A JP 12413979 A JP12413979 A JP 12413979A JP 12413979 A JP12413979 A JP 12413979A JP S5649547 A JPS5649547 A JP S5649547A
Authority
JP
Japan
Prior art keywords
pellet
tub
resin
lead
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12413979A
Other languages
Japanese (ja)
Inventor
Hideo Inayoshi
Yoshiaki Wakashima
Hiroshi Koyama
Tatsu Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12413979A priority Critical patent/JPS5649547A/en
Publication of JPS5649547A publication Critical patent/JPS5649547A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve resins in adhesive property by attaching carbon-functional silane to the surface of the tub or a lead frame of a pellet upon resin molding after fitting the pellet on the surface of the tub. CONSTITUTION:A semiconductor pellet 3 is fastened to the upper surface of a tub provided at the central part of a lead frame 1 and thus-obtained electrode is connected to the lead 4 of the frame 1 using a wire 5. Next, the pellet 3 is turned upside down and one or several drips of carbon-functional silane 6 let fall onto the reverse side of the tub 2. Thereafter, the frame 1 and pellet 3 are supported in a chamber 9 consisting of upper and lower dies 7 and 8 and a resin 10 is molded through pressure-supply for completing a package. Silane 6 is superior in the affinity with the resin 10 and liable to combining with O2 of the oxide layer on the surface of the lead 4 or SiO2 on the surface of the pellet 3 so that the resin 10 improves in adhesive property.
JP12413979A 1979-09-28 1979-09-28 Manufacture of semiconductor device Pending JPS5649547A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12413979A JPS5649547A (en) 1979-09-28 1979-09-28 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12413979A JPS5649547A (en) 1979-09-28 1979-09-28 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5649547A true JPS5649547A (en) 1981-05-06

Family

ID=14877880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12413979A Pending JPS5649547A (en) 1979-09-28 1979-09-28 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5649547A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0283319A2 (en) * 1987-03-19 1988-09-21 The Dexter Corporation Encapsulating electronic components
JPS63245946A (en) * 1987-03-31 1988-10-13 Nitto Electric Ind Co Ltd Resin-sealed semiconductor device
US5158735A (en) * 1987-03-19 1992-10-27 The Dexter Corporation Encapsulating electronic components

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5436454A (en) * 1977-08-26 1979-03-17 Danfoss As Liquid pressure type control device of servo motor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5436454A (en) * 1977-08-26 1979-03-17 Danfoss As Liquid pressure type control device of servo motor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0283319A2 (en) * 1987-03-19 1988-09-21 The Dexter Corporation Encapsulating electronic components
US5158735A (en) * 1987-03-19 1992-10-27 The Dexter Corporation Encapsulating electronic components
JPS63245946A (en) * 1987-03-31 1988-10-13 Nitto Electric Ind Co Ltd Resin-sealed semiconductor device

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