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JPS56160893A - Absorbing film for laser work - Google Patents

Absorbing film for laser work

Info

Publication number
JPS56160893A
JPS56160893A JP6554480A JP6554480A JPS56160893A JP S56160893 A JPS56160893 A JP S56160893A JP 6554480 A JP6554480 A JP 6554480A JP 6554480 A JP6554480 A JP 6554480A JP S56160893 A JPS56160893 A JP S56160893A
Authority
JP
Japan
Prior art keywords
laser
film
face
adhesive
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6554480A
Other languages
Japanese (ja)
Inventor
Naoya Horiuchi
Takafumi Ohara
Reiji Sano
Yoshiharu Nanba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6554480A priority Critical patent/JPS56160893A/en
Publication of JPS56160893A publication Critical patent/JPS56160893A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To obtain a laser absorbing film for laser work, by coating an adhesive and a laser absorbing matter on one face and the other face of a supporting film consisting of cellulose or the like, respectively. CONSTITUTION:An adhesive is coated on one face of a supporting film 2 consisting of cellulose or the like, and a laser absorbing matter 3 suc as SiO2, TiO2, Al2O3, manganese phosphate, and graphite is coated on the other face. Further, exfoliating bands 21 are fitted in end parts or the peripheral part of the supporting film. This film is stuck to the surface, which should be subjected to heat treatment work, of a material 1 to be worked such as steel manufactures by the adhesive, and a laser beam 6 such as CO2 laser is irradiated from above to perform the heat treatment work. At this time, since the laser is absorbed by the laser absorbing matter, the energy absorptivity of the laser beam is very high, and the heat treatment is performed with a superior energy efficiency. After the treatment, this film is exfoliated and removed esily from the material 1 by exfoliating bands.
JP6554480A 1980-05-16 1980-05-16 Absorbing film for laser work Pending JPS56160893A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6554480A JPS56160893A (en) 1980-05-16 1980-05-16 Absorbing film for laser work

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6554480A JPS56160893A (en) 1980-05-16 1980-05-16 Absorbing film for laser work

Publications (1)

Publication Number Publication Date
JPS56160893A true JPS56160893A (en) 1981-12-10

Family

ID=13290060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6554480A Pending JPS56160893A (en) 1980-05-16 1980-05-16 Absorbing film for laser work

Country Status (1)

Country Link
JP (1) JPS56160893A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60174294A (en) * 1984-02-16 1985-09-07 Toyota Auto Body Co Ltd Laser working method
JPS6127590U (en) * 1984-07-23 1986-02-19 昭和電工株式会社 Laser beam shielding plate
US6949215B2 (en) * 2002-02-21 2005-09-27 Ricoh Company, Ltd. Method for processing a three-dimensional structure by laser
US20090045180A1 (en) * 2007-08-15 2009-02-19 Zhaoli Hu Masking device for laser machining system and method
US7777154B2 (en) * 2002-11-06 2010-08-17 Sony Corporation Method for manufacturing divided waveplate filter
JP2016508069A (en) * 2012-11-29 2016-03-17 コーニング インコーポレイテッド Sacrificial cover layer and method for laser drilling a substrate
WO2019147407A1 (en) * 2018-01-23 2019-08-01 Fero Corporation Carbide, nitride and silicide enhancers for laser absorption
US10756003B2 (en) 2016-06-29 2020-08-25 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60174294A (en) * 1984-02-16 1985-09-07 Toyota Auto Body Co Ltd Laser working method
JPS6127590U (en) * 1984-07-23 1986-02-19 昭和電工株式会社 Laser beam shielding plate
US6949215B2 (en) * 2002-02-21 2005-09-27 Ricoh Company, Ltd. Method for processing a three-dimensional structure by laser
US7482052B2 (en) 2002-02-21 2009-01-27 Ricoh Company, Ltd. Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
US7777154B2 (en) * 2002-11-06 2010-08-17 Sony Corporation Method for manufacturing divided waveplate filter
US8262829B2 (en) 2002-11-06 2012-09-11 Sony Corporation Method for manufacturing divided waveplate filter
US20090045180A1 (en) * 2007-08-15 2009-02-19 Zhaoli Hu Masking device for laser machining system and method
US8242408B2 (en) * 2007-08-15 2012-08-14 Caterpillar Inc. Masking device for laser machining system and method
JP2016508069A (en) * 2012-11-29 2016-03-17 コーニング インコーポレイテッド Sacrificial cover layer and method for laser drilling a substrate
US10435796B2 (en) 2012-11-29 2019-10-08 Corning Incorporated Work piece including a sacrificial cover layer for laser drilling substrates
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US10756003B2 (en) 2016-06-29 2020-08-25 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11972993B2 (en) 2017-05-25 2024-04-30 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
WO2019147407A1 (en) * 2018-01-23 2019-08-01 Fero Corporation Carbide, nitride and silicide enhancers for laser absorption
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness

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