JPS56140351A - Formation of pattern - Google Patents
Formation of patternInfo
- Publication number
- JPS56140351A JPS56140351A JP4418280A JP4418280A JPS56140351A JP S56140351 A JPS56140351 A JP S56140351A JP 4418280 A JP4418280 A JP 4418280A JP 4418280 A JP4418280 A JP 4418280A JP S56140351 A JPS56140351 A JP S56140351A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- resist
- polyimide
- substrate
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To accurately form a fine pattern by laying a polyimide layer on a substrate, masking the layer with a resist, and pattering the layer with gaseous plasma contg. a fluorocarbon compound. CONSTITUTION:Polyimide layer 2 is laid on Al or Si substrate 1, and on layer 2 resist layer 3 is formed with a commercially available resist in a thickness corresponding to about 1/3 of the thickness of layer 2. Using layer 3 as a mask disclosed part (a) of layer 2 is etched with plasma of a gaseous fluorocarbon compound such as CF4 contg. O2. Since the etching speed of polyimede layer 2 is 3-4 times as high as that of resist layer 3, layer 2 is etched selectively. Layer 3 is then removed to accurately obtain a polyimide pattern with disclosed substrate 1. Using this polyimide film an insulating layer, etc. for a semiconductor devices, etc. are obtd. with high resolution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4418280A JPS56140351A (en) | 1980-04-04 | 1980-04-04 | Formation of pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4418280A JPS56140351A (en) | 1980-04-04 | 1980-04-04 | Formation of pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56140351A true JPS56140351A (en) | 1981-11-02 |
Family
ID=12684425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4418280A Pending JPS56140351A (en) | 1980-04-04 | 1980-04-04 | Formation of pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56140351A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5785828A (en) * | 1980-11-18 | 1982-05-28 | Sumitomo Electric Ind Ltd | Etching of polyimide resin |
JPS58147033A (en) * | 1982-02-26 | 1983-09-01 | Nippon Telegr & Teleph Corp <Ntt> | Pattern formation |
JPS611171A (en) * | 1984-06-14 | 1986-01-07 | Canon Inc | Color picture processor |
JPS61231720A (en) * | 1985-04-01 | 1986-10-16 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Plasma etching of substrate |
JPS63501186A (en) * | 1985-10-25 | 1988-04-28 | タンデム コンピユ−タ−ズ インコ−ポレ−テツド | Method for forming vertical connections in polyimide insulation layers |
-
1980
- 1980-04-04 JP JP4418280A patent/JPS56140351A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5785828A (en) * | 1980-11-18 | 1982-05-28 | Sumitomo Electric Ind Ltd | Etching of polyimide resin |
JPS58147033A (en) * | 1982-02-26 | 1983-09-01 | Nippon Telegr & Teleph Corp <Ntt> | Pattern formation |
JPH0234453B2 (en) * | 1982-02-26 | 1990-08-03 | Nippon Telegraph & Telephone | |
JPS611171A (en) * | 1984-06-14 | 1986-01-07 | Canon Inc | Color picture processor |
JPS61231720A (en) * | 1985-04-01 | 1986-10-16 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Plasma etching of substrate |
JPS63501186A (en) * | 1985-10-25 | 1988-04-28 | タンデム コンピユ−タ−ズ インコ−ポレ−テツド | Method for forming vertical connections in polyimide insulation layers |
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