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JPS56131620A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS56131620A
JPS56131620A JP3379380A JP3379380A JPS56131620A JP S56131620 A JPS56131620 A JP S56131620A JP 3379380 A JP3379380 A JP 3379380A JP 3379380 A JP3379380 A JP 3379380A JP S56131620 A JPS56131620 A JP S56131620A
Authority
JP
Japan
Prior art keywords
epoxy resin
dbu
quat
ammonium hydroxide
undecene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3379380A
Other languages
Japanese (ja)
Inventor
Shinichi Kudo
Tamotsu Wakahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3379380A priority Critical patent/JPS56131620A/en
Publication of JPS56131620A publication Critical patent/JPS56131620A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: An epoxy resin whose curing time, transparency and cure shrinkage are improved, by adding an acid anhydride, a quat. ammonium hydroxide and 1,8- diazabicyclo[5,4,0]undecene-7 to an epoxy resin.
CONSTITUTION: To 100pts.wt. epoxy resin are added 60W160pts.wt. curing agent comprising an acid anhydride, 0.05W1pt.wt. quat. ammonium hydroxide of formula I wherein R1WR4 are each an alkyl, benzyl or phenyl as a cure accelerator and 0.1W10pts.wt. fatty acid salt of 1,8-diazabicyclo[5,4,0]undecene-7 (DBU) represented by formula II, wherein R is a C5 or higher alkyl. Examples of the quat. ammonium hydroxide which can be used include benzyltrimethyl-ammonium hydroxxide and phenyltrimethylammonium hydroxide. Examples of the fatty acid salt of DBU include DBU.2-methylpentanoate and DBU.2,3-dimethylbutanoate.
COPYRIGHT: (C)1981,JPO&Japio
JP3379380A 1980-03-17 1980-03-17 Epoxy resin composition Pending JPS56131620A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3379380A JPS56131620A (en) 1980-03-17 1980-03-17 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3379380A JPS56131620A (en) 1980-03-17 1980-03-17 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS56131620A true JPS56131620A (en) 1981-10-15

Family

ID=12396341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3379380A Pending JPS56131620A (en) 1980-03-17 1980-03-17 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS56131620A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device
US20120004377A1 (en) * 2009-03-17 2012-01-05 Nippon Soda Co., Ltd. Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device
US20120004377A1 (en) * 2009-03-17 2012-01-05 Nippon Soda Co., Ltd. Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
US9023956B2 (en) * 2009-03-17 2015-05-05 Nippon Soda Co., Ltd. Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor

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