JPS56115534A - Formation of pattern - Google Patents
Formation of patternInfo
- Publication number
- JPS56115534A JPS56115534A JP1886180A JP1886180A JPS56115534A JP S56115534 A JPS56115534 A JP S56115534A JP 1886180 A JP1886180 A JP 1886180A JP 1886180 A JP1886180 A JP 1886180A JP S56115534 A JPS56115534 A JP S56115534A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- electron beam
- patterned
- layer
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Drying Of Semiconductors (AREA)
- Electron Beam Exposure (AREA)
Abstract
PURPOSE:To obtain the material to be patterned having a tapered sectional form by a method wherein a taper-shaped electron beam resist layer is formed on the material to be patterned having the etching rate of almost equal to the electron beam resist and then an etching is performed. CONSTITUTION:A material layer 12 to be patterned such as an Al and the like, and a negative type electron beam resist layer 13 such as a CPO and the like are formed on a substrate 11 successively. Then an electron beam 14 is irradiated and exposed limitedly within the scope of the outlines and form of the pattern, a developing process is performed and a resist pattern 13a, having the sectional form of gradually reduced thickness, is formed. Then, the patterning layer 12a having the similar sectional form to the resist pattern 13a can be obtained by performing an etching on the surface using an ion beam 15. Also, the pattern having the optionally controlled film thickness for each section of the pattern can be formed easily.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1886180A JPS596508B2 (en) | 1980-02-18 | 1980-02-18 | Pattern formation method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1886180A JPS596508B2 (en) | 1980-02-18 | 1980-02-18 | Pattern formation method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56115534A true JPS56115534A (en) | 1981-09-10 |
JPS596508B2 JPS596508B2 (en) | 1984-02-13 |
Family
ID=11983315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1886180A Expired JPS596508B2 (en) | 1980-02-18 | 1980-02-18 | Pattern formation method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS596508B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008285695A (en) * | 2007-05-15 | 2008-11-27 | Canon Inc | Method for working substrate |
US7511311B2 (en) | 2002-08-01 | 2009-03-31 | Nichia Corporation | Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same |
-
1980
- 1980-02-18 JP JP1886180A patent/JPS596508B2/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7511311B2 (en) | 2002-08-01 | 2009-03-31 | Nichia Corporation | Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same |
US8035118B2 (en) | 2002-08-01 | 2011-10-11 | Nichia Corporation | Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same |
US8330179B2 (en) | 2002-08-01 | 2012-12-11 | Nichia Corporation | Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same |
US8742438B2 (en) | 2002-08-01 | 2014-06-03 | Nichia Corporation | Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same |
JP2008285695A (en) * | 2007-05-15 | 2008-11-27 | Canon Inc | Method for working substrate |
Also Published As
Publication number | Publication date |
---|---|
JPS596508B2 (en) | 1984-02-13 |
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