JPS5544765A - Manufacture of semiconductor - Google Patents
Manufacture of semiconductorInfo
- Publication number
- JPS5544765A JPS5544765A JP11823478A JP11823478A JPS5544765A JP S5544765 A JPS5544765 A JP S5544765A JP 11823478 A JP11823478 A JP 11823478A JP 11823478 A JP11823478 A JP 11823478A JP S5544765 A JPS5544765 A JP S5544765A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- wafer
- porous alumina
- protective film
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Weting (AREA)
Abstract
PURPOSE: To obtain a given Al wafer pattern for low speed of etching from side face through the process consisting of changing Al wafer into porous alumina through selective chemical treatment using photo-resist as protective film, and etching the alumina.
CONSTITUTION: The Al wafer 3 having attached to the surface of a semiconductor substrate 2 having insulating film 6 is chemically treated using patterned photo- resist 1 for changing the portion at the range not covered with the protective film 1 thereof into porous alumina 4. At this time, the portion at the range convered with the protective film 1 of the Al wafer 3 does not change at all, and the remainder portion become almost to the protective film 1 in size. Next, etching treatment is made with etching liquid of which the etching speed for porous alumina 4 is sufficiently higher than that for Al 3 or non-porous alumina 5. Since the non- porous alumina 5 serves as good pro tective film, a low rate is developed of etching from the side face of the Al wafer 3 so that Al pattern almost equal to photo-resist pattern in size can be obtained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11823478A JPS5544765A (en) | 1978-09-25 | 1978-09-25 | Manufacture of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11823478A JPS5544765A (en) | 1978-09-25 | 1978-09-25 | Manufacture of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5544765A true JPS5544765A (en) | 1980-03-29 |
Family
ID=14731540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11823478A Pending JPS5544765A (en) | 1978-09-25 | 1978-09-25 | Manufacture of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5544765A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0867929A3 (en) * | 1997-03-25 | 1999-04-14 | P.C.B. Ltd. | Electronic interconnect structure and method for manufacturing it |
-
1978
- 1978-09-25 JP JP11823478A patent/JPS5544765A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0867929A3 (en) * | 1997-03-25 | 1999-04-14 | P.C.B. Ltd. | Electronic interconnect structure and method for manufacturing it |
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