JPS55137180A - Adhesion by using a filmy adhesive - Google Patents
Adhesion by using a filmy adhesiveInfo
- Publication number
- JPS55137180A JPS55137180A JP4451479A JP4451479A JPS55137180A JP S55137180 A JPS55137180 A JP S55137180A JP 4451479 A JP4451479 A JP 4451479A JP 4451479 A JP4451479 A JP 4451479A JP S55137180 A JPS55137180 A JP S55137180A
- Authority
- JP
- Japan
- Prior art keywords
- polar compound
- adhesive
- adhesion
- melted
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To make easier the adhesion of unit plates in the manufacture of plywood, by the procedure in which a filmy adhesive formed by laminating thermoplastic rein thin layers on both sides of an intermediate layer of a polar compound is inter laminated between objects to be bonded, melted, pressed, and then cooled.
CONSTITUTION: A filmy adhesive (A), formed by laminating a 0.5W300 micron- thick thermoplastic resin thin layer (ii) as a surface layer on both sides of an intermediate layer (i) of an adhesive polar compound, is interlaminated between objects (B) to be bonded, melted, pressed, and cooled. As (i), a polar compound, having a molecular weight of less than 4,000, a melting point of less than 300°C, and a boiling point of 100°C or more preferably, is used, and also as (ii), PE, PVC, ethylene- vinyl acetate copolymer, etc., are used.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4451479A JPS55137180A (en) | 1979-04-11 | 1979-04-11 | Adhesion by using a filmy adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4451479A JPS55137180A (en) | 1979-04-11 | 1979-04-11 | Adhesion by using a filmy adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55137180A true JPS55137180A (en) | 1980-10-25 |
JPS6159357B2 JPS6159357B2 (en) | 1986-12-16 |
Family
ID=12693648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4451479A Granted JPS55137180A (en) | 1979-04-11 | 1979-04-11 | Adhesion by using a filmy adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55137180A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60102751A (en) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | Adhesive film for fixing semiconductor element |
EP0944653A4 (en) * | 1996-12-16 | 2004-10-13 | Vernay Laboratories | Polymeric coupling agents for the adhesion of macromolecular materials and metal substrates |
KR20100107401A (en) * | 2009-03-25 | 2010-10-05 | 후지 기카이 고교 가부시키가이샤 | Coating apparatus |
JP2013241005A (en) * | 2012-04-27 | 2013-12-05 | S B Sheet Waterproof Systems Co Ltd | Bonding method |
-
1979
- 1979-04-11 JP JP4451479A patent/JPS55137180A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60102751A (en) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | Adhesive film for fixing semiconductor element |
EP0944653A4 (en) * | 1996-12-16 | 2004-10-13 | Vernay Laboratories | Polymeric coupling agents for the adhesion of macromolecular materials and metal substrates |
KR20100107401A (en) * | 2009-03-25 | 2010-10-05 | 후지 기카이 고교 가부시키가이샤 | Coating apparatus |
JP2010221204A (en) * | 2009-03-25 | 2010-10-07 | Fuji Kikai Kogyo Kk | Coater |
TWI548463B (en) * | 2009-03-25 | 2016-09-11 | Fuji Kikai Kogyo Kk | Coating device |
JP2013241005A (en) * | 2012-04-27 | 2013-12-05 | S B Sheet Waterproof Systems Co Ltd | Bonding method |
Also Published As
Publication number | Publication date |
---|---|
JPS6159357B2 (en) | 1986-12-16 |
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