Nothing Special   »   [go: up one dir, main page]

JPS55123142A - Rotation positioing method for semiconductor wafer - Google Patents

Rotation positioing method for semiconductor wafer

Info

Publication number
JPS55123142A
JPS55123142A JP3047679A JP3047679A JPS55123142A JP S55123142 A JPS55123142 A JP S55123142A JP 3047679 A JP3047679 A JP 3047679A JP 3047679 A JP3047679 A JP 3047679A JP S55123142 A JPS55123142 A JP S55123142A
Authority
JP
Japan
Prior art keywords
sigma
wafer
distributions
scanned
maximum value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3047679A
Other languages
Japanese (ja)
Inventor
Tetsuya Sano
Hidekazu Sekizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3047679A priority Critical patent/JPS55123142A/en
Publication of JPS55123142A publication Critical patent/JPS55123142A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

PURPOSE:To position rotary angles by a method wherein a wafer is scanned in the direction of y at two spots several chips apart in the direction of x on the wafer, and a maximum value of correlative function between distributions of contrast detection outputs is used therefor. CONSTITUTION:After combining a wafer 1 by means of a face 7, it is scanned for several chips by moving a bed in the direction of y at postions separated in the direction x, and distributions f1(y-sigma), f2(y) having a periodicity at every chips are obtained as detection output thereby. For sigma, measuring points A, B are selected so as to have at 1/2 or below of a length Ly in the direction of y, and sigma' whereby correlative function of the output distributions f1 and f2 becomes a maximum value is sought under the above conditions. If the distance between A and B is Lx in this case, an amplitude to correct theta=tan<-1>(sigma'/Lx). According to this method, where a pattern comes on a dicing line, a rotation positioning is secured accurately even if the difference between the dicing line and the character is a pellet is not clear.
JP3047679A 1979-03-15 1979-03-15 Rotation positioing method for semiconductor wafer Pending JPS55123142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3047679A JPS55123142A (en) 1979-03-15 1979-03-15 Rotation positioing method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3047679A JPS55123142A (en) 1979-03-15 1979-03-15 Rotation positioing method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS55123142A true JPS55123142A (en) 1980-09-22

Family

ID=12304898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3047679A Pending JPS55123142A (en) 1979-03-15 1979-03-15 Rotation positioing method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS55123142A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5611508A (en) * 1979-07-10 1981-02-04 Nippon Kogaku Kk <Nikon> Correction unit for shift of rotation
JPS6097412A (en) * 1983-10-31 1985-05-31 Nitto Seiko Co Ltd Positioning device for orthogonal coordinate type robot
JPS63107139A (en) * 1986-10-24 1988-05-12 Nikon Corp Wafer pre-alignment system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5611508A (en) * 1979-07-10 1981-02-04 Nippon Kogaku Kk <Nikon> Correction unit for shift of rotation
JPS6097412A (en) * 1983-10-31 1985-05-31 Nitto Seiko Co Ltd Positioning device for orthogonal coordinate type robot
JPS63107139A (en) * 1986-10-24 1988-05-12 Nikon Corp Wafer pre-alignment system

Similar Documents

Publication Publication Date Title
JPS5218132A (en) Binary circuit
JPS5352483A (en) Detecting method for concrete construction destruction
ES438877A1 (en) Method and apparatus for detecting a registration mark on a target such as a semiconductor wafer
JPS55123142A (en) Rotation positioing method for semiconductor wafer
JPS52144895A (en) Control method for cam machining apparatus
JPS5429977A (en) Detection system for position
JPS5333530A (en) Decision method for bar code pattern
JPS51147152A (en) Pattern angle detector
JPS5741714A (en) Position detecting and positioning method
JPS55123141A (en) Positioning method for semiconductor wafer
JPS5321575A (en) Pattern inspection method
JPS522339A (en) Unnecessary portion eliminating equipment in pattern identifying equip ment
JPS51120747A (en) Device for inspecting line symmetrical patterns
JPS53108772A (en) Production of semiconductor device
JPS5353978A (en) Rotating position relation adjusting method
JPS5223223A (en) Method of reading bar codes
JPS5427370A (en) Edge processing method in pattern test
JPS5216177A (en) Probe card
JPS52137984A (en) Drawing apparatus
JPS5365668A (en) Electron beam exposure device
JPS52150938A (en) Method and apparatus for code reading
JPS52147974A (en) Manufacture of semiconductor device
JPS55111135A (en) Semiconductor device and its manufacturing method
JPS5328380A (en) Function inspecting method of semiconductor elements
JPS5366255A (en) Minute dimension measuring method and its apparatus