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JPS55124237A - Semiconductor treatment device - Google Patents

Semiconductor treatment device

Info

Publication number
JPS55124237A
JPS55124237A JP3260279A JP3260279A JPS55124237A JP S55124237 A JPS55124237 A JP S55124237A JP 3260279 A JP3260279 A JP 3260279A JP 3260279 A JP3260279 A JP 3260279A JP S55124237 A JPS55124237 A JP S55124237A
Authority
JP
Japan
Prior art keywords
ion
main section
open air
applying
room
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3260279A
Other languages
Japanese (ja)
Inventor
Masayuki Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3260279A priority Critical patent/JPS55124237A/en
Publication of JPS55124237A publication Critical patent/JPS55124237A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To prevent the pollution by the open air by applying laser beams after an implantation of ion, without exposing to the open air, in the laser beam applying room which is connected to an ion implantation room and by giving an annealing. CONSTITUTION:An injection of ion impurities is performed by applying an ion beam 2 to the main section of a semiconductor substrate. Then, laser beams 11 are applied from a laser oscillation device 11 to the main section of a semicodncutor substrate 9 for which a crystalline damage has been given by the above-mentioned ion injection. Thus, only the damaged main section is liquefied, and it is recrystallized by stopping the application of laser beams, and the anealing is finished. Thus, without using a special high vacuum heating device, the main section of a semiconductor substrate 9 can be annealed in the vacuum room where there is no fear of pollution by the open air.
JP3260279A 1979-03-19 1979-03-19 Semiconductor treatment device Pending JPS55124237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3260279A JPS55124237A (en) 1979-03-19 1979-03-19 Semiconductor treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3260279A JPS55124237A (en) 1979-03-19 1979-03-19 Semiconductor treatment device

Publications (1)

Publication Number Publication Date
JPS55124237A true JPS55124237A (en) 1980-09-25

Family

ID=12363401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3260279A Pending JPS55124237A (en) 1979-03-19 1979-03-19 Semiconductor treatment device

Country Status (1)

Country Link
JP (1) JPS55124237A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60107249A (en) * 1983-11-14 1985-06-12 Mitsubishi Electric Corp Device for implanting ion into semiconductor and thermal processing
JPH06252079A (en) * 1993-02-23 1994-09-09 G T C:Kk Ion implantation method and its device
JP2002175772A (en) * 2000-12-06 2002-06-21 Ulvac Japan Ltd Ion implanting device and ion implanting method
US7118996B1 (en) 1996-05-15 2006-10-10 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for doping
JP2007274007A (en) * 2007-06-18 2007-10-18 Toshiba Corp Method for manufacturing semiconductor device
GB2514900A (en) * 2013-04-10 2014-12-10 Grey Technology Ltd Vacuum cleaner

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60107249A (en) * 1983-11-14 1985-06-12 Mitsubishi Electric Corp Device for implanting ion into semiconductor and thermal processing
JPH06252079A (en) * 1993-02-23 1994-09-09 G T C:Kk Ion implantation method and its device
US7118996B1 (en) 1996-05-15 2006-10-10 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for doping
US7315035B2 (en) 1996-05-15 2008-01-01 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for doping
US7521699B2 (en) 1996-05-15 2009-04-21 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for doping
US8003958B2 (en) 1996-05-15 2011-08-23 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for doping
US8344336B2 (en) 1996-05-15 2013-01-01 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for doping
JP2002175772A (en) * 2000-12-06 2002-06-21 Ulvac Japan Ltd Ion implanting device and ion implanting method
JP2007274007A (en) * 2007-06-18 2007-10-18 Toshiba Corp Method for manufacturing semiconductor device
GB2514900A (en) * 2013-04-10 2014-12-10 Grey Technology Ltd Vacuum cleaner
GB2514900B (en) * 2013-04-10 2016-10-26 Grey Tech Ltd Vacuum cleaner

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