JPS55100993A - Supersonic plating - Google Patents
Supersonic platingInfo
- Publication number
- JPS55100993A JPS55100993A JP665379A JP665379A JPS55100993A JP S55100993 A JPS55100993 A JP S55100993A JP 665379 A JP665379 A JP 665379A JP 665379 A JP665379 A JP 665379A JP S55100993 A JPS55100993 A JP S55100993A
- Authority
- JP
- Japan
- Prior art keywords
- supersonic
- plated
- plating
- vibrator
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To obtain a pinholeless uniform plated surface by performing effectively a supersonic plating in which a supersonic vibration is applied directly to an object to be plated so as to cause supersonic action only on the object and its adjacent areas.
CONSTITUTION: The supersonic vibrator 3 as an object to be plated is vibrated by supersonic waves from the supersonic oscillator 8, under the condition the temperature of the plating liquid 2 is as certained as to whether it is desirable, and then a voltage is applied from the power source 5 across the vibrator 3 and the electrode 4. In this way, the plated layer 10, as, for example, of hard Cr layer, is formed on the radiating surface 3A while vibrating supersonically the supersonic vibrator 3 as an object to be plated. Thus, the pinholeless plated layer 10, even in the case of porous plating of hard Cr, etc., can be formed by defoaming action of supersonic waves.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP665379A JPS55100993A (en) | 1979-01-23 | 1979-01-23 | Supersonic plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP665379A JPS55100993A (en) | 1979-01-23 | 1979-01-23 | Supersonic plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55100993A true JPS55100993A (en) | 1980-08-01 |
Family
ID=11644332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP665379A Pending JPS55100993A (en) | 1979-01-23 | 1979-01-23 | Supersonic plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55100993A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01294888A (en) * | 1988-05-19 | 1989-11-28 | Mitsubishi Electric Corp | Electrolytic plating equipment |
GB2247027A (en) * | 1990-08-17 | 1992-02-19 | Hans Henig | Vibrating workpiece eg: printed circuit board in contact with chemical or electrolytic treatment solutions |
US6372116B1 (en) * | 1998-11-14 | 2002-04-16 | Hyundai Microelectronics Co., Ltd | Method of forming a conductive layer and an electroplating apparatus thereof |
JP2012077356A (en) * | 2010-10-01 | 2012-04-19 | Yamagata Prefecture | Method and device for processing composite plating |
JP2012162791A (en) * | 2011-02-09 | 2012-08-30 | Jx Nippon Mining & Metals Corp | Plated material for terminal or connector and manufacturing method therefor |
CN113019824A (en) * | 2021-03-23 | 2021-06-25 | 湖南大学 | Ultrasonic cavitation-based method and device for modifying surfaces of inner wall and outer wall of cavity |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS503033A (en) * | 1973-05-15 | 1975-01-13 | ||
JPS5223535A (en) * | 1975-08-19 | 1977-02-22 | Mitsubishi Electric Corp | Vibratory electrolytic apparatus |
-
1979
- 1979-01-23 JP JP665379A patent/JPS55100993A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS503033A (en) * | 1973-05-15 | 1975-01-13 | ||
JPS5223535A (en) * | 1975-08-19 | 1977-02-22 | Mitsubishi Electric Corp | Vibratory electrolytic apparatus |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01294888A (en) * | 1988-05-19 | 1989-11-28 | Mitsubishi Electric Corp | Electrolytic plating equipment |
GB2247027A (en) * | 1990-08-17 | 1992-02-19 | Hans Henig | Vibrating workpiece eg: printed circuit board in contact with chemical or electrolytic treatment solutions |
GB2247027B (en) * | 1990-08-17 | 1995-04-26 | Hans Henig | Process and apparatus for electrolyte exchange |
US6372116B1 (en) * | 1998-11-14 | 2002-04-16 | Hyundai Microelectronics Co., Ltd | Method of forming a conductive layer and an electroplating apparatus thereof |
JP2012077356A (en) * | 2010-10-01 | 2012-04-19 | Yamagata Prefecture | Method and device for processing composite plating |
JP2012162791A (en) * | 2011-02-09 | 2012-08-30 | Jx Nippon Mining & Metals Corp | Plated material for terminal or connector and manufacturing method therefor |
CN113019824A (en) * | 2021-03-23 | 2021-06-25 | 湖南大学 | Ultrasonic cavitation-based method and device for modifying surfaces of inner wall and outer wall of cavity |
CN113019824B (en) * | 2021-03-23 | 2022-02-22 | 湖南大学 | Ultrasonic cavitation-based method and device for modifying surfaces of inner wall and outer wall of cavity |
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