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JPS5450271A - Device for dissipating heat of electronic unit subassembly - Google Patents

Device for dissipating heat of electronic unit subassembly

Info

Publication number
JPS5450271A
JPS5450271A JP10905678A JP10905678A JPS5450271A JP S5450271 A JPS5450271 A JP S5450271A JP 10905678 A JP10905678 A JP 10905678A JP 10905678 A JP10905678 A JP 10905678A JP S5450271 A JPS5450271 A JP S5450271A
Authority
JP
Japan
Prior art keywords
electronic unit
dissipating heat
unit subassembly
subassembly
dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10905678A
Other languages
English (en)
Japanese (ja)
Inventor
Shiyurinfuin Herumuuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS5450271A publication Critical patent/JPS5450271A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10905678A 1977-09-09 1978-09-05 Device for dissipating heat of electronic unit subassembly Pending JPS5450271A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772740772 DE2740772C3 (de) 1977-09-09 1977-09-09 Einrichtung zur Abführung der Verlustwärme elektronischer Baugruppen

Publications (1)

Publication Number Publication Date
JPS5450271A true JPS5450271A (en) 1979-04-20

Family

ID=6018583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10905678A Pending JPS5450271A (en) 1977-09-09 1978-09-05 Device for dissipating heat of electronic unit subassembly

Country Status (2)

Country Link
JP (1) JPS5450271A (de)
DE (1) DE2740772C3 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3044314C2 (de) * 1980-11-25 1986-08-14 kabelmetal electro GmbH, 3000 Hannover Gehäuse zur Aufnahme von mit Wärme erzeugenden elektronischen Bauteilen bestückten gedruckten Schaltungen
DE3228368C2 (de) * 1982-07-29 1985-03-14 Siemens AG, 1000 Berlin und 8000 München Gehäuse für elektrotechnische Geräte
DE3417986A1 (de) * 1984-05-15 1985-11-21 kabelmetal electro GmbH, 3000 Hannover Anordnung zum abfuehren der verlustwaerme von in gehaeusen angeordneten leiterplatten
DE3609083A1 (de) * 1986-03-18 1987-09-24 Siemens Ag Elektronisches geraet
DE102007056982B3 (de) * 2007-11-27 2009-12-24 Fujitsu Siemens Computers Gmbh Einschub für ein Serverrack sowie Anordnung mit einem Einschub und einer Kühlvorrichtung für ein Serverrack
DE202010004852U1 (de) 2010-04-09 2011-08-26 TRUMPF Maschinen Grüsch AG Laserbearbeitungsmaschine
AT523608B1 (de) * 2020-03-05 2022-01-15 Avl List Gmbh Schaltschrank für eine elektrische Umrichterbaugruppe

Also Published As

Publication number Publication date
DE2740772C3 (de) 1980-03-27
DE2740772A1 (de) 1979-03-22
DE2740772B2 (de) 1979-07-19

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