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JPS54136173A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54136173A
JPS54136173A JP4382978A JP4382978A JPS54136173A JP S54136173 A JPS54136173 A JP S54136173A JP 4382978 A JP4382978 A JP 4382978A JP 4382978 A JP4382978 A JP 4382978A JP S54136173 A JPS54136173 A JP S54136173A
Authority
JP
Japan
Prior art keywords
dicing
along
dicing line
accuracy
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4382978A
Other languages
Japanese (ja)
Inventor
Masanobu Koide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP4382978A priority Critical patent/JPS54136173A/en
Publication of JPS54136173A publication Critical patent/JPS54136173A/en
Pending legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To secure a high-accuracy dicing along the display part of the dicing line provided on the semiconductor substrate.
CONSTITUTION: N layer 2 and P layer 3 are laminated on N+-type GaAs substrate 1, and cross-shaped display part 8 is provided at the intersection of dicing line 6 and 7 between electrodes 4 along with electrode 4 itself. Thus, a high-accuracy dicing is possible along part 8. Furthermore, the separated cut surface becomes smooth after scribing with installation of 4 units of L-shaped display bar 9 holding the dicing line between.
COPYRIGHT: (C)1979,JPO&Japio
JP4382978A 1978-04-13 1978-04-13 Semiconductor device Pending JPS54136173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4382978A JPS54136173A (en) 1978-04-13 1978-04-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4382978A JPS54136173A (en) 1978-04-13 1978-04-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54136173A true JPS54136173A (en) 1979-10-23

Family

ID=12674637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4382978A Pending JPS54136173A (en) 1978-04-13 1978-04-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54136173A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61105106A (en) * 1984-10-29 1986-05-23 Toyo Commun Equip Co Ltd Substrate cutting method
US5593815A (en) * 1989-07-31 1997-01-14 Goldstar Co., Ltd. Cleaving process in manufacturing a semiconductor laser

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524177A (en) * 1975-06-27 1977-01-13 Toshiba Corp Automatic mask aligning method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524177A (en) * 1975-06-27 1977-01-13 Toshiba Corp Automatic mask aligning method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61105106A (en) * 1984-10-29 1986-05-23 Toyo Commun Equip Co Ltd Substrate cutting method
US5593815A (en) * 1989-07-31 1997-01-14 Goldstar Co., Ltd. Cleaving process in manufacturing a semiconductor laser

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