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JPS5411696A - Sealing method of electronic components - Google Patents

Sealing method of electronic components

Info

Publication number
JPS5411696A
JPS5411696A JP7637377A JP7637377A JPS5411696A JP S5411696 A JPS5411696 A JP S5411696A JP 7637377 A JP7637377 A JP 7637377A JP 7637377 A JP7637377 A JP 7637377A JP S5411696 A JPS5411696 A JP S5411696A
Authority
JP
Japan
Prior art keywords
electronic components
sealing method
exhausting
immersing
surely
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7637377A
Other languages
Japanese (ja)
Inventor
Koichiro Wakui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7637377A priority Critical patent/JPS5411696A/en
Publication of JPS5411696A publication Critical patent/JPS5411696A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified

Landscapes

  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To protect each part from external atmosphere surely and to improve the heat dissipation of electronic components, by dropping resin to the electronic components linked to the wiring conductor layer for the electrodes on the wiring substrate and immersing it to the entire surface through exhausting in the vacuum package.
JP7637377A 1977-06-27 1977-06-27 Sealing method of electronic components Pending JPS5411696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7637377A JPS5411696A (en) 1977-06-27 1977-06-27 Sealing method of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7637377A JPS5411696A (en) 1977-06-27 1977-06-27 Sealing method of electronic components

Publications (1)

Publication Number Publication Date
JPS5411696A true JPS5411696A (en) 1979-01-27

Family

ID=13603532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7637377A Pending JPS5411696A (en) 1977-06-27 1977-06-27 Sealing method of electronic components

Country Status (1)

Country Link
JP (1) JPS5411696A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6097598A (en) * 1983-11-01 1985-05-31 富士ゼロックス株式会社 Flash exposure device
JPS61258435A (en) * 1985-05-13 1986-11-15 Nec Corp Manufacture of resin-sealed semiconductor device
JPS63241955A (en) * 1987-03-30 1988-10-07 Hitachi Ltd Manufacture of resin-reinforced lsi mounting structure
EP0840369A4 (en) * 1995-06-30 2001-12-19 Toshiba Kk Electronic component and method of production thereof
WO2003040754A1 (en) * 2001-11-09 2003-05-15 Hitachi, Ltd. Mobile millimetric wave radar
FR2833754A1 (en) * 2001-12-13 2003-06-20 Gemplus Card Int Production of electronic component uses film handle fixed permanently to rear surface of semiconductor wafer for manipulating it

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6097598A (en) * 1983-11-01 1985-05-31 富士ゼロックス株式会社 Flash exposure device
JPS61258435A (en) * 1985-05-13 1986-11-15 Nec Corp Manufacture of resin-sealed semiconductor device
JPS63241955A (en) * 1987-03-30 1988-10-07 Hitachi Ltd Manufacture of resin-reinforced lsi mounting structure
EP0840369A4 (en) * 1995-06-30 2001-12-19 Toshiba Kk Electronic component and method of production thereof
US6628043B2 (en) 1995-06-30 2003-09-30 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6754950B2 (en) 1995-06-30 2004-06-29 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
WO2003040754A1 (en) * 2001-11-09 2003-05-15 Hitachi, Ltd. Mobile millimetric wave radar
FR2833754A1 (en) * 2001-12-13 2003-06-20 Gemplus Card Int Production of electronic component uses film handle fixed permanently to rear surface of semiconductor wafer for manipulating it

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