JPS4932999A - - Google Patents
Info
- Publication number
- JPS4932999A JPS4932999A JP47074764A JP7476472A JPS4932999A JP S4932999 A JPS4932999 A JP S4932999A JP 47074764 A JP47074764 A JP 47074764A JP 7476472 A JP7476472 A JP 7476472A JP S4932999 A JPS4932999 A JP S4932999A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7476472A JPS5649930B2 (fi) | 1972-07-25 | 1972-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7476472A JPS5649930B2 (fi) | 1972-07-25 | 1972-07-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4932999A true JPS4932999A (fi) | 1974-03-26 |
| JPS5649930B2 JPS5649930B2 (fi) | 1981-11-26 |
Family
ID=13556660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7476472A Expired JPS5649930B2 (fi) | 1972-07-25 | 1972-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5649930B2 (fi) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5920370A (ja) * | 1982-07-27 | 1984-02-02 | Toyo Ink Mfg Co Ltd | 導電性接着剤 |
| JPS63248824A (ja) * | 1987-04-03 | 1988-10-17 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| JPH01316365A (ja) * | 1988-03-24 | 1989-12-21 | Shikoku Chem Corp | １−ベンジルイミダゾール化合物、該化合物の合成方法及び該化合物を用いるポリエポキシ樹脂の硬化方法 |
| WO2010103809A1 (ja) * | 2009-03-11 | 2010-09-16 | 日本曹達株式会社 | エポキシ樹脂組成物、硬化剤及び硬化促進剤 |
| WO2010106780A1 (ja) | 2009-03-17 | 2010-09-23 | 日本曹達株式会社 | 包接錯体、硬化剤、硬化促進剤、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物 |
| WO2012035755A1 (ja) * | 2010-09-15 | 2012-03-22 | 日本曹達株式会社 | 液状の硬化性エポキシ樹脂組成物及びそれを含有する接着剤 |
| JP2013213168A (ja) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | プリプレグ用エポキシ樹脂組成物 |
| US8653160B2 (en) | 2007-09-21 | 2014-02-18 | Nippon Soda Co., Ltd. | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
| US8735529B2 (en) | 2006-12-21 | 2014-05-27 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS497599A (fi) * | 1972-05-29 | 1974-01-23 |
-
1972
- 1972-07-25 JP JP7476472A patent/JPS5649930B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS497599A (fi) * | 1972-05-29 | 1974-01-23 |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0242120B2 (fi) * | 1982-07-27 | 1990-09-20 | ||
| JPS5920370A (ja) * | 1982-07-27 | 1984-02-02 | Toyo Ink Mfg Co Ltd | 導電性接着剤 |
| JPS63248824A (ja) * | 1987-04-03 | 1988-10-17 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| JPH01316365A (ja) * | 1988-03-24 | 1989-12-21 | Shikoku Chem Corp | １−ベンジルイミダゾール化合物、該化合物の合成方法及び該化合物を用いるポリエポキシ樹脂の硬化方法 |
| US8735529B2 (en) | 2006-12-21 | 2014-05-27 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
| US8653160B2 (en) | 2007-09-21 | 2014-02-18 | Nippon Soda Co., Ltd. | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
| US8623942B2 (en) | 2009-03-11 | 2014-01-07 | Nippon Soda Co., Ltd. | Epoxy resin composition, curing agent, and curing accelerator |
| WO2010103809A1 (ja) * | 2009-03-11 | 2010-09-16 | 日本曹達株式会社 | エポキシ樹脂組成物、硬化剤及び硬化促進剤 |
| KR101349996B1 (ko) * | 2009-03-17 | 2014-01-13 | 닛뽕소다 가부시키가이샤 | 포접 착물, 경화제, 경화 촉진제, 에폭시 수지 조성물 및 반도체 밀봉용 에폭시 수지 조성물 |
| JP5459873B2 (ja) * | 2009-03-17 | 2014-04-02 | 日本曹達株式会社 | 包接錯体、硬化剤、硬化促進剤、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物 |
| WO2010106780A1 (ja) | 2009-03-17 | 2010-09-23 | 日本曹達株式会社 | 包接錯体、硬化剤、硬化促進剤、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物 |
| CN103936676A (zh) * | 2009-03-17 | 2014-07-23 | 日本曹达株式会社 | 包合配合物、固化剂、固化促进剂、环氧树脂组合物及半导体封装用环氧树脂组合物 |
| US9023956B2 (en) | 2009-03-17 | 2015-05-05 | Nippon Soda Co., Ltd. | Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
| WO2012035755A1 (ja) * | 2010-09-15 | 2012-03-22 | 日本曹達株式会社 | 液状の硬化性エポキシ樹脂組成物及びそれを含有する接着剤 |
| JP2013213168A (ja) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | プリプレグ用エポキシ樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5649930B2 (fi) | 1981-11-26 |