JPH1195873A - Loop type heat pipe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the need for fitting a wick in a liquid pipe and to enable a general pipe to be used by providing the wick in contact with a groove top formed in a container and forming a liquid pool by using the wick as its internal wall surface. SOLUTION: Plates 7 and 8 are provided opposite each other and grooves 10 are formed concentrically inside them. The wick 14 is provided in contact with the groove top 13 formed at the periphery of a connecting groove 11 connecting the grooves 10 and 10 and brought into contact with the plates 7 and 8 by a spring 17. The liquid pool 18 is formed in the area surrounded with the wick 15 and a seal member 15 formed at its periphery and working liquid 19 is put therein. One side of a condenser 23 is coupled with a steam pipe 21 connecting to a steam space 20 and the other is coupled with the liquid pipe 22 connecting to the liquid pool 18. Consequently, the wick 14 need not be fitted in the steam pipe 21 or liquid pipe 22 and a general-purpose pipe which has simple closed section is usable.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a loop heat pipe used as a heat transport device for space, industry, and home use.

[0002]

2. Description of the Related Art FIG.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top view and a partial cross-sectional view showing a conventional heat pipe shown in Japanese Unexamined Patent Application Publication No. H11-209,873. In the drawing, reference numeral 1 denotes an entire heat pipe, 2 denotes an evaporator which is a heat receiving plate, 3 denotes a condenser which is a heat dissipation plate, and the evaporator 2 and the condenser 3
Are integrated via the container 4. The evaporator 2 and the condenser 3 are formed by molding a good heat conductor such as aluminum, copper or the like to have a space inside. The container 4 is cylindrical and has a space inside. The space, the space inside the evaporator 2 and the condenser 3 form a space inside the heat pipe 1, and the inside contains a working fluid (not shown). It is kept in a vacuum except where it is.

[0003] The container 4 is formed of a flexible tube (flexible tube) such as silicone rubber or Teflon.
The inner space is provided with a braided wire such as nylon, glass, copper, or the like that becomes the wick 5 (composition made of a porous substance having a capillary effect).

Next, the operation will be described. A heating element (not shown) is attached to the evaporator 2, and heat generated by the heating element is first transferred to the evaporator 2. Inside the evaporator 2, the working fluid in a liquid phase absorbs heat and evaporates, and reaches the inside of the condenser 3 as a gas phase through the space of the container 4. The working fluid in the gas phase releases heat and condenses into a liquid phase. The liquid-phase working fluid in the condenser 3 returns to the evaporator 2 through the wick 5 by capillary pressure. that's all,
By repeating this, heat transport from the evaporator 2 to the condenser 3 is performed.

[0005]

Since the conventional heat pipe is configured as described above, the wick must be put in the container, and therefore, the diameter of the container cannot be reduced, and the space cannot be reduced. There is a problem that efficiency is poor or desired flexibility cannot be maintained.

Further, in order to obtain a desired heat transfer capability, the length of the container is limited, and thus the size of the electronic equipment which can be mounted is limited, so that the advantage of the flexibility of the container can hardly be exhibited. was there.

Further, since the condenser has a function of finally radiating heat to the surrounding environment, it is necessary to form the heat pipe into a shape that is well matched to the housing structure of the electronic device incorporating the heat pipe. There is a problem that it is difficult to match the housing structure of the electronic device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and provides a heat pipe having a container shape and a condenser shape that matches well with an electronic device housing structure by utilizing the flexibility of a container.
It is an object of the present invention to obtain a heat pipe in which the heat transport capacity does not decrease even when the container becomes long.

[0009]

According to a first aspect of the present invention, there is provided a loop heat pipe comprising an evaporator and a condenser, wherein the evaporator comprises a container having a groove formed in an inner peripheral wall. A wick provided in close contact with a groove in the container, and the wick as an inner wall surface,
A liquid connected to a liquid pipe for supplying a working fluid in a liquid phase;
A steam space for guiding a gas-phase working fluid to a steam pipe connected to an end of the vessel, the steam space being spatially connected to the groove, and a condenser being connected to the steam pipe and the liquid from the condenser. It is connected to the evaporator via a liquid pipe for refluxing the working fluid of the phase to the evaporator, and the steam pipe and the liquid pipe are configured as elastic members or plastic members.

According to a second aspect of the present invention, in the loop heat pipe according to the first aspect, the wick is formed by changing the diameter of the hole when the number of holes per unit volume is constant.

According to a third aspect, in the loop heat pipe according to the first aspect, the wick is formed by changing the number of holes when the diameter of the holes is substantially uniform. .

According to a fourth aspect, in the loop heat pipe according to the first aspect, the wick is formed of at least two wicks having different hole diameters.

According to a fifth aspect, in the loop heat pipe according to the first aspect, the wick is formed from at least two wicks having different numbers of holes.

According to a sixth aspect, in the loop heat pipe according to the first aspect, the steam pipe and the liquid pipe are formed in a spiral shape.

According to a seventh aspect, in the loop heat pipe according to the first aspect, the steam pipe and the liquid pipe are formed in a bellows shape.

According to an eighth aspect of the present invention, the first or sixth or seventh aspect is provided.
In the loop heat pipe according to the invention, at least one of the steam pipe and the liquid pipe is configured as a part of a hinge of the deployment structure.

The ninth invention is directed to the first, sixth or seventh embodiment.
In the loop type heat pipe according to the invention, at least one of the vapor pipe and the liquid pipe is formed as a part of a vibration control member of an evaporator and a heating element attached thereto.

According to a tenth aspect, in the loop heat pipe according to the first, sixth, or seventh aspect, at least one of the steam pipe and the liquid pipe is a pressure member for bringing the evaporator into close contact with the heating element. It is formed as a part.

According to an eleventh aspect of the present invention, in the loop heat pipe according to the first aspect, at least one or more of the condenser, the steam pipe, and the liquid pipe are formed to also serve as a fan grill which is a fan component. Things.

According to a twelfth aspect, in the loop heat pipe according to the first aspect, at least one or more of a condenser, a vapor pipe, and a liquid pipe is installed at an intake / exhaust port to provide a filter function. It is a thing.

According to a thirteenth aspect, in the loop heat pipe according to the first aspect, at least one or more of a condenser, a steam pipe, and a liquid pipe are embedded in a rubber having thermal conductivity. Things.

According to a fourteenth aspect, in the loop heat pipe according to the first aspect, the condenser is installed on the cooling plate, and the cooling plate is formed so as to be detachable from a slot in the card basket. .

According to a fifteenth aspect, in the loop heat pipe according to the fourteenth aspect, a cooling plate provided with a condenser is arranged close to a slot in a card basket.

According to a sixteenth aspect, in the loop heat pipe according to the first aspect, a coupling for pipe connection is provided for at least one of the steam pipe and the liquid pipe.

According to a seventeenth aspect, in the loop heat pipe according to the first aspect, the steam pipe and the liquid pipe are twisted together, or the liquid pipe is spirally wound around the steam pipe. A liquid tube is provided around the periphery of the container.

According to an eighteenth aspect of the present invention, in the loop heat pipe according to any one of the first to seventeenth aspects, the liquid pipe is constituted by a pipe having a smaller flow sectional area than a steam pipe.

According to a nineteenth aspect, in the loop heat pipe according to the first aspect, cooling fins are mounted around the evaporator.

According to a twentieth aspect, in the loop heat pipe according to the first aspect, a seal member is inserted between the wick and the groove or the groove crest.

According to a twenty-first aspect, in the loop-type heat pipe according to the first aspect, at least one location where a groove is not formed is present in a range of a projection area of a wick on an inner peripheral wall of the container. is there.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, a first embodiment of the present invention will be described with reference to FIG. FIG. 1A is a side view of an evaporator portion of the loop heat pipe, and FIG.
(B) is an overall view including an evaporator and a condenser. Here, the cross section of the evaporator is shown. FIG.
(C) shows the inner view of the plate which forms a part of the container of the evaporator. In FIG. 1, reference numeral 6 denotes the entire evaporator. 7,
Reference numeral 8 denotes a plate provided to face each other, and 9 denotes a side wall between the plate 7 and the plate 8 which makes the evaporator 6 a closed structure. Also, 1
Reference numeral 0 denotes a groove formed concentrically inside the plates 7 and 8, 11 denotes a connection groove formed inside the plates 7 and 8 and connects the groove 10.
Reference numeral 2 denotes an outermost peripheral groove similarly formed inside the plates 7 and 8 and connected to the connection groove 11, and reference numeral 13 denotes a groove crest around the groove 10 and the connection groove 11. 14 is a wick attached so as to be in close contact with the groove 13, 13 is a sealing member provided around the wick 14, 16 is a wick attached inside the wick 14 and has a larger hole diameter than the wick 14, and 17 is a wick A spring for bringing the wick 16 and the wick 14 into close contact with the plates 7 and 8. Reference numeral 18 denotes a liquid surrounded by the wick 14 and the sealing member 15, and reference numeral 19 denotes a working fluid stored in the liquid storage 18, which is a liquid phase here. The working fluid 19 itself changes reversibly between the liquid phase and the gas phase. . Reference numeral 20 denotes a steam space connected to the space from the connection groove 11 and the outermost peripheral groove 12 and is surrounded by the side wall 9 and the seal member 15. Reference numeral 21 denotes a steam pipe attached to the side wall 9 and connected to the steam space 20;
Is a condenser, one of which is connected to the vapor pipe 21 and the other of which is connected to the liquid pipe 22.
Reference numeral 24 denotes the flow direction of the gas-phase working fluid 19 passing through the connecting groove 11 and the outermost peripheral groove 12 of the plates 7 and 8; 25, the flow direction of the gas-phase working fluid 19 in the steam pipe 21; Is a flow direction of the liquid-phase working fluid 19, and 27 is a permeation direction of the liquid-phase working fluid 19 in the wick 16.

Next, the operation of the loop heat pipe configured as described above will be described. When heat (not shown) is applied to the plate 7, a portion of it conducts to the opposing plate 8. This heat is transmitted to the grooves of the plates 7 and 8. The working fluid 19 is a wick 16 having a large hole diameter.
The working fluid 19 penetrates not only in the thickness direction of the wick 16 but also in the direction of the penetration direction 27 due to the capillary force.
Is sucked up and penetrates the entire wick 16. Thereafter, the working fluid diffuses through the wick 14 having a smaller hole diameter than the wick 16 while penetrating by capillary force, receives heat at the groove 13 and evaporates, and changes from a liquid phase to a gas phase.

The working fluid 19 changed to the gas phase flows in the flow direction 2
As shown in FIG. 4, the gas exits the evaporator 6 from the groove 10 through the connecting groove 11 and the outermost peripheral groove 12, passes through the steam space 20, passes through the steam pipe 21, and exits. Then, the working fluid 19 flows in the steam pipe 21 in the flow direction 25, flows into the condenser 23, and condenses. The working fluid 19 condensed and changed from the gas phase to the liquid phase is supplied to the liquid pipe 2
It flows in the direction 2 in the flow direction 2 and returns to the evaporator 6.

The working fluid 19 in the liquid phase returned to the evaporator 6 is stored in the liquid storage 18. The liquid-phase working fluid 19 accumulated at the bottom of the liquid 18 penetrates the wick 16 by the capillary force of the wick 16, then penetrates the wick 14 by the capillary force of the wick 14, receives heat again at the groove 13, and evaporates. Then, the liquid phase changes to a gas phase. By repeating the above cycle, heat is transferred from the evaporator 6 to the condenser 23.

As described above, according to the present embodiment, there is no need to attach the wick to the inside of the vapor pipe 21 or the liquid pipe 22, but only to the inside of the evaporator 6, so that a special pipe is required. Instead, a general-purpose pipe having a simple closed cross section can be used. Further, since the steam pipe 21 and the liquid pipe 22 merely function as a passage for the working fluid in the gas phase or the liquid phase, they do not contribute to the heat transport performance of the loop heat pipe, and therefore, the pipe length can be set arbitrarily. Length can be set.

When the steam pipe 21 and the liquid pipe 22 are formed as elastic bodies, the loop heat pipe can be easily attached. Alternatively, if the steam pipe 21 and the liquid pipe 22 are made plastic, the loop heat pipe can be easily attached.

Embodiment 2 A second embodiment of the present invention will be described. In the first embodiment, two types of wicks 14 and 16 having different hole diameters are attached, but in the present embodiment, the configuration of the wick is configured as follows. That is,
(1) When the number of holes per unit volume is constant, a wick having a changed hole diameter is provided, or (2) When the hole diameter is substantially uniform, the number of holes is changed. Or (3) at least two wicks with different numbers of holes. Even when the wick is configured as described above, the same effects as in the first embodiment can be achieved.

Embodiment 3 Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 2 is a perspective transparent view when the present loop type heat pipe is mounted on an electronic device. In the figure, reference numeral 28 denotes the entire electronic device, and 2
Reference numeral 9 denotes a main body of an electronic device incorporating a heating element such as a circuit board (not shown) and an evaporator 6 attached to the heating element.
Is a door portion, 31 is a hinge which connects the electronic device main body portion 29 and the door portion 30 and serves as a fulcrum when the door portion 30 is opened and closed, 32 is attached to the condenser 23 and connects the condenser 23 to the door portion via this. 30 is an enlarged heat transfer surface that is brought into close contact with 30. Reference numeral 33 denotes a part of the steam pipe 21, which corresponds to the hinge 31, and is a helical or bellows-shaped steam pipe forming part. Reference numeral 34 denotes a part of the liquid pipe 22, which corresponds to the hinge 31. Is a liquid tube forming part formed in a spiral or bellows shape. In the figure, reference numerals 6, 21, 22, and 23 indicate the same components as those in FIG.

Next, the operation will be described. The method of realizing the heat transport is the same as in the first embodiment. Steam pipe 21 and liquid pipe 2
If 2 is made of an elastic material, bending stress applied to the steam pipe 21 and the liquid pipe 22 by the steam pipe forming part 33 and the liquid pipe forming part 34 can be reduced. Therefore, by mounting the loop type heat pipe on the electronic device as in the present embodiment, it is possible to prevent the working fluid 19 from leaking due to cracks or the like when the door is opened and closed,
Reliability can be improved. The steam pipe 2
The same effect can be obtained even when the liquid tube 1 and the liquid tube 22 have plasticity.

Embodiment 4 Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 3 is a diagram showing a mounting structure of the present loop type heat pipe. In the figure, reference numeral 35 denotes a heating element such as a circuit element attached to the evaporator 6, and 6, 21, 22, 23, 32, 33, 34.
Indicates the same elements as in FIGS. 1 and 2.

Next, the operation will be described. In the mounting structure as shown in FIG. 3, the steam pipe 21 and the liquid pipe 22 are made of an elastic material, and the condenser 23 and the enlarged heat transfer surface 32 are fixed to a structural member (not shown). Since the evaporator 6 is supported only by the resiliency of the steam pipe forming part 33 and the liquid pipe forming part 34, for example, when the present loop type heat pipe is attached to a vibrating object such as an automobile, the condenser 23 and the enlarging unit are enlarged. Vibration is transmitted to the heat transfer surface 32, but the vibration is absorbed and cut off to the evaporator 6 and the heating element 35 such as a circuit element attached thereto. In this manner, the electronic device that generates heat can be protected from vibration, and reliability can be improved.

Embodiment 5 FIG. Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 4 is a view showing a mounting structure of the present loop type heat pipe. In the figure, reference numeral 36 denotes a structure such as a circuit board on which a heating element 35 such as a circuit element is mounted. Reference numeral 37 denotes a screw for fixing the condenser 23 and the enlarged heat transfer surface 32 to the structure 36. still,
Reference numerals 6, 21, 22, 23, 32, 33, 34, and 35 indicate the same elements as those in FIGS.

Next, the operation will be described. In order to effectively transfer heat from the heating element 35 such as a circuit element to the evaporator 6, the adhesion between the heating element 35 such as a circuit element and the evaporator 6 is important. The condenser 23 and the enlarged heat transfer surface 32 are connected to the structure 3 by screws 37 via the spring properties of the steam pipe forming section 33 and the liquid pipe forming section 34.
By fixing the evaporator 6 to the heating element 6, the evaporator 6 can always be brought into close contact with the heating element 35 such as a circuit element by a spring force. By configuring the loop-shaped heat pipe mounting structure as described above, the efficiency from the heating element 35 such as a circuit element to the evaporator 6 can be increased without applying excessive force to the heating element 35 such as a circuit element due to the spring property. It is possible to conduct heat well.

Embodiment 6 FIG. Next, a sixth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a view showing the structure of the condenser section of the loop heat pipe. In the figure, reference numeral 21 denotes a vapor pipe, 22 denotes a liquid pipe, and 23 denotes a condenser, which are the same as those shown in FIGS. Reference numeral 38 denotes a cooling fan for blowing air to the condenser 23.

Next, the operation will be described. The cooling fan 38 is usually provided with a finger guard (not shown) for preventing hand entanglement, which is important for safety measures. In this structure, at least one or more of the steam pipe 21, the liquid pipe 22, and the condenser 23 is formed into a circumferential structure to form a finger guard shape. With this structure, the cooling air of the fan can be directly applied to the condenser 23 and the like, so that ideal heat radiation as the condenser can be realized and safety can be maintained.

Embodiment 7 Next, a seventh embodiment of the present invention will be described with reference to FIG. FIG. 6 is a diagram showing the structure of the condenser section of the loop heat pipe. In the figure, reference numeral 21 denotes a vapor pipe, 22 denotes a liquid pipe, and 23 denotes a condenser, which are the same as those shown in FIGS.

Next, the operation will be described. In a normal electronic device housing, a filter is attached to the ventilation opening or a punch hole is formed to prevent dust and dirt from entering the inside. In this structure, at least one or more of the steam pipe 21, the liquid pipe 22, and the condenser 23 is formed as a mesh structure having a mesh structure. With this structure, dust can be prevented from being mixed, and cooling air generated by a fan or natural ventilation can be directly applied to the condenser 23, so that efficient heat radiation can be realized.

Embodiment 8 FIG. Next, an eighth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a diagram showing a structure in which at least one or more of the steam pipe, the condenser, and the liquid pipe are embedded in a rubber having thermal conductivity. In the figure, reference numeral 21 denotes a vapor pipe, 22 denotes a liquid pipe, and 23 denotes a condenser, which are the same as those shown in FIGS. Reference numeral 39 denotes a thermally conductive rubber. Thermal conductive rubber 39
Has an effect of reducing the contact thermal resistance, so that efficient heat transfer can be performed to a heat radiating portion such as a sheet metal case.

Embodiment 9 FIG. Next, a ninth embodiment of the present invention will be described with reference to FIGS. FIG.
FIG. 3 is a view showing a structure in which a condenser is installed on a cooling plate. In the figure, 6 is an evaporator installed on a heating element such as a CPU, 21 is a steam pipe, 22 is a liquid pipe, 23 is a condenser, 36
Is a structure such as a circuit board. Reference numeral 40 denotes a cooling plate made of metal or the like, reference numeral 41 denotes a card basket for mounting the structure 36 such as a circuit board and the cooling plate 40, and reference numeral 42 denotes a radiation fin.

Next, the operation will be described. In the mounting structure according to the present embodiment, since the condenser 23 is installed on the cooling plate 40, a cooling unit can be provided in the card basket 41, and high-density mounting is possible, and the size of the housing is reduced. Can be configured. The cooling plate 40
If the radiating fins 42 are provided thereon, the radiating effect can be further increased.

Furthermore, if the cooling plates 40 are arranged close to each other as shown in FIG. 9, the wind of the cooling fan 38 can be concentrated and efficiently passed to that portion, and more effective heat radiation can be achieved. realizable.

Embodiment 10 FIG. Next, a tenth embodiment of the present invention will be described with reference to FIG. FIG.
Fig. 2 shows the arrangement of the steam pipe 21 and the liquid pipe 22 of the loop heat pipe. In the figure, reference numeral 21 denotes a steam pipe, and reference numeral 22 denotes a liquid pipe, which are the same as those shown in FIGS. Reference numeral 43 denotes a coupling for separating and connecting pipes.

Next, the operation will be described. In the figure, the vapor pipe 21 and the liquid pipe 22 are connected by using a confidential coupling 43 that does not leak the fluid inside the pipe even if they are separated in the middle, so that the pipe can be easily separated and connected. It has become. Since the separation and connection of the vapor pipe 21 and the liquid pipe 22 can be easily performed, piping can be easily performed, and there is an effect that the installation cost of the loop heat pipe can be easily reduced.

Embodiment 11 FIG. Next, an eleventh embodiment of the present invention will be described with reference to FIG. FIG.
(A) and FIG. 11 (b) show the arrangement of the steam pipe 21 and the liquid pipe 22 of the loop heat pipe.

Next, the operation will be described. FIG.
In (a), the vapor pipe 21 and the liquid pipe 22 are arranged like a single apparent pipe in a mutually twisted manner. In FIG. 11B, since the pressure loss inside the liquid pipe 22 is generally considerably smaller than the pressure loss inside the steam pipe 21, the liquid pipe 22 is formed of a pipe having a smaller diameter than the steam pipe 21. ing. The liquid pipe 22 is spirally wound around the vapor pipe 21 and is apparently arranged as a single pipe. As described above, since the steam pipe 21 and the liquid pipe 22 are apparently arranged like a single pipe, piping can be easily performed and the installation cost of the loop heat pipe can be easily reduced. Can be.

Embodiment 1 -Embodiment 11. Liquid pipe 2 in the loop heat pipe
2 may be constituted by a pipe having a smaller flow passage cross-sectional area than the steam pipe 21.

Embodiment 12 FIG. Next, a twelfth embodiment of the present invention will be described with reference to FIG. FIG.
The figure shows a structure in which radiating fins 44 are attached around the evaporator 6. According to the present embodiment, the evaporator 6
By attaching the fins 44 for heat radiation around the evaporator 6, a part of the heat transmitted to the evaporator 6 can be directly transmitted to the space around the evaporator 6 via the fins 44.
Therefore, in addition to the heat radiation effect by the heat pipe function, a heat radiation effect by the expanded heat transfer surface from the evaporator 6 itself is obtained, so that the heat radiation performance can be further improved.

Embodiment 13 FIG. Next, a thirteenth embodiment of the present invention will be described with reference to FIG. Also,
FIG. 13 shows a state in which a sealing member 45 is inserted between the wick 14 and the groove 13 of the plate 7. With the above-described structure, even if the wick 14 is pressed by the seal member 15, it is possible to prevent the connection groove 11 from being closed due to the pressing. Further, it is possible to prevent a phenomenon in which a space is formed between the wick and the seal member and the steam flows backward.

In place of the sealing member 45 shown in FIG. 13, a portion of the plate 7 opposed to the sealing member 15 is cut into the groove space without passing through the groove, and a tunnel structure is formed in the steam space 20 to allow the steam to pass therethrough. You may make it connect. By adopting such a structure, it is possible to further improve the sealing performance.

[0059]

As described above, according to the present invention, there is no need to attach a wick inside a steam pipe or a liquid pipe, so that a general-purpose pipe having a simple closed cross section can be used. Further, the length of the steam pipe or the liquid pipe does not contribute to the heat transport performance of the present loop-type heat pipe, so that the length can be set to an arbitrary length. Further, since the steam pipe and the liquid pipe are configured as elastic bodies or have plasticity, there is an effect that the loop heat pipe can be easily attached.

According to the present invention, a wick having a different hole diameter or the number of holes is used, so that the permeability of the working fluid to the wick can be increased, and an efficient heat pipe can be realized. There is an effect that can be.

Further, according to the present invention, since the vapor pipe and the liquid pipe are made of an elastic body or a plastic body, and a part of them is formed in a spiral or bellows shape, the condenser is removed from the evaporator. Even if the door is separated from the door, the bending stress applied to the steam pipe and the liquid pipe when the door is opened and closed can be reduced, and the leakage of the working fluid due to cracks or the like can be prevented, and the reliability can be improved.

Further, according to the present invention, the steam pipe and the liquid pipe are made of an elastic body, and the evaporator is supported by the spring property of the steam pipe and the liquid pipe. Vibration can be cut off for the evaporator and the heating elements such as circuit elements attached to the evaporator, and the reliability can be improved.

Further, according to the present invention, the condenser and the enlarged heat transfer surface are fixed to the structure through the spring property of the vapor pipe and the liquid pipe, so that the evaporator can be used as a heating element such as a circuit element. Since it can be brought into close contact with a spring force and can prevent an excessive force from being applied, there is an effect that a heating element such as a circuit element can be protected from destruction.

Further, according to the present invention, at least one or more elements of the vapor pipe, the liquid pipe, and the condenser are formed into a circumferential structure,
Since the finger guard shape is formed, the cooling air of the fan can be directly applied to the condenser and the like, so that heat can be ideally radiated as the condenser and safety can be maintained.

According to the present invention, at least one of the steam pipe, the liquid pipe, and the condenser is formed into a mesh structure to form a mesh structure. In addition to the above, it is possible to achieve ideal heat dissipation as a condenser and to prevent dust from entering through a ventilation hole.

Further, according to the present invention, since at least one of the steam pipe, the condenser and the liquid pipe is embedded in the rubber having thermal conductivity, the contact heat resistance in the entire heat radiation system is reduced, and the heat generation is reduced. Efficient heat transfer from the object is possible.

Further, according to the present invention, since the condenser is installed on the cooling plate, a cooling section can be provided in the card basket, and high-density mounting is possible.

Further, according to the present invention, the cooling plates are collectively arranged close to each other, so that the cooling fan air can be intensively blown there, thereby enabling efficient concentrated cooling.

Further, according to the present invention, the separation and connection of the steam pipe and the liquid pipe are performed by using the coupling, so that the piping work can be easily performed, and the installation of the present loop type heat pipe is achieved. There is an effect that cost can be reduced.

Further, according to the present invention, since the steam pipe and the liquid pipe are arranged so as to be entangled with each other like a single pipe, piping can be easily performed, and the installation cost of the loop heat pipe is reduced. There is an effect that reduction can be achieved.

Further, according to the present invention, since the sectional area of the flow path of the liquid pipe is made smaller than that of the steam pipe, the installation space can be easily secured and the production cost can be reduced. is there.

Further, according to the present invention, since the fins are attached around the evaporator, in addition to the heat radiation effect by the heat pipe function, the heat radiation effect by the expanded heat transfer surface from the evaporator itself can be obtained. The heat radiation performance can be further improved.

According to the present invention, since the seal member is inserted between the wick and the groove, it is possible to prevent the wick from being pressed by the seal member and closing the connection groove. It is possible to improve the sealing performance. Further, a space is formed between the wick and the seal member, and it is possible to prevent a phenomenon in which steam flows backward.

Further, according to the present invention, a groove is not cut at a portion of the plate facing the seal member, and this portion has a tunnel structure for passing steam and is connected to the steam space. Therefore, it is possible to further improve the sealing performance, and it is also possible to prevent a phenomenon in which steam flows backward from the space between the wick and the sealing member.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a loop heat pipe according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a state in which a loop heat pipe according to a third embodiment of the present invention is mounted on an electronic device.

FIG. 3 is a mounting structure diagram of a loop heat pipe according to a fourth embodiment of the present invention.

FIG. 4 is a view showing a mounting structure of a loop heat pipe according to a fifth embodiment of the present invention.

FIG. 5 is a structural diagram of a condenser of a loop heat pipe according to a sixth embodiment of the present invention.

FIG. 6 is a structural diagram of a condenser of a loop heat pipe according to a seventh embodiment of the present invention.

FIG. 7 is a structural view of a loop type heat pipe according to an eighth embodiment of the present invention when a condenser is embedded in a rubber band having thermal conductivity.

FIG. 8 is a structural diagram showing a ninth embodiment of the present invention in which a condenser of a loop heat pipe is installed on a cooling plate and arranged in a card basket.

FIG. 9 is a structural view of a loop-type heat pipe according to a ninth embodiment of the present invention when a cooling plate is closely arranged in a card basket.

FIG. 10 is a view showing an arrangement of a loop type heat pipe by coupling a steam pipe and a liquid pipe according to a tenth embodiment of the present invention.

FIG. 11 is a view showing the arrangement of steam pipes and liquid pipes of a loop heat pipe according to an eleventh embodiment of the present invention.

FIG. 12 is a cross-sectional view of a loop-type heat pipe according to a twelfth embodiment of the present invention, in which a radiation fin is attached to an evaporator.

FIG. 13 is a detailed sectional view of a loop type heat pipe according to a thirteenth embodiment of the present invention, in which a sealing member is inserted between a wick and a groove of an evaporator of a loop heat pipe.

FIG. 14 is a top view (partially sectional view) showing a conventional heat pipe device.

[Explanation of symbols]

6 evaporator, 7, 8 plate, 10 groove, 11 connecting groove, 1
2 outermost circumferential groove, 13 groove peaks, 14, 16 wick, 18
Liquid reservoir, 20 vapor space, 21 vapor pipe, 22 liquid pipe, 23 condenser, 33 vapor pipe molding part, 34 liquid pipe molding part, 39 heat conductive rubber, 40 cooling plate, 41
Card basket, 43 Coupling, 42, 44
Fins, 15, 45 Seal members.

Continued on the front page (72) Inventor ▲ Taka ▼ Junji 2-3-2 Marunouchi 2-chome, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (21)

[Claims] 1. A loop heat pipe comprising an evaporator and a condenser, wherein the evaporator is provided so as to be in close contact with a container having a groove formed on an inner peripheral wall and a groove in the container. Wick and
The wick as an inner wall surface, comprising a liquid connected to a liquid pipe for supplying a liquid-phase working fluid, and a vapor space for guiding a gas-phase working fluid to a vapor pipe connected to an end of the container, The vapor space is spatially connected to the groove, the condenser is connected to the evaporator via a vapor pipe, and a liquid pipe for returning a liquid-phase working fluid from the condenser to the evaporator, The steam pipe and the liquid pipe are configured as elastic members or plastic members. 2. The loop heat pipe according to claim 1, wherein the wick is formed by changing the diameter of the hole when the number of holes per unit volume is constant. 3. The loop heat pipe according to claim 1, wherein the wick is formed by changing the number of holes when the diameter of the holes is substantially uniform. 4. The loop heat pipe according to claim 1, wherein said wick is formed from at least two wicks having different hole diameters. 5. The loop heat pipe according to claim 1, wherein said wick is formed from at least two wicks having different numbers of holes. 6. The loop heat pipe according to claim 1, wherein said steam pipe and said liquid pipe are formed in a spiral shape. 7. The loop heat pipe according to claim 1, wherein said steam pipe and said liquid pipe are formed in a bellows shape. 8. The loop heat according to claim 1, wherein at least one of the steam pipe and the liquid pipe is formed as a part of a hinge of a deployment structure. pipe. 9. The method according to claim 1, wherein at least one of the vapor pipe and the liquid pipe is formed as a part of a vibration control member of an evaporator and a heating element associated therewith. The loop heat pipe according to claim 7. 10. The steam pipe and / or the liquid pipe, wherein at least one of the steam pipe and the liquid pipe is formed as a part of a pressure member for bringing the evaporator into close contact with the heating element. The loop heat pipe as described. 11. The loop heat pipe according to claim 1, wherein at least one or more of the condenser, the vapor pipe, and the liquid pipe are formed so as to also serve as a fan grill which is a fan component. . 12. The loop heat pipe according to claim 1, wherein at least one or more of the condenser, the vapor pipe, and the liquid pipe are provided at an intake / exhaust port to have a filter function. . 13. The loop heat pipe according to claim 1, wherein at least one of the condenser, the vapor pipe, and the liquid pipe is embedded in a rubber having thermal conductivity. . 14. The condenser is placed on a cooling plate,
2. The loop heat pipe according to claim 1, wherein said cooling plate is detachably formed in a slot in a card basket. 15. The loop heat pipe according to claim 14, wherein said cooling plate provided with said condenser is arranged in close proximity to a slot in a card basket. 16. The loop heat pipe according to claim 1, wherein a coupling for connecting the pipe is provided for at least one of the steam pipe and the liquid pipe. 17. A liquid pipe is provided around a steam pipe by twisting the steam pipe and the liquid pipe together or spirally winding the liquid pipe around the steam pipe. The loop heat pipe according to claim 1. 18. The loop heat pipe according to claim 1, wherein the liquid pipe is formed of a pipe having a smaller flow path cross-sectional area than a steam pipe. 19. The loop heat pipe according to claim 1, wherein cooling fins are mounted around the evaporator. 20. The loop heat pipe according to claim 1, wherein a sealing member is inserted between the wick and the groove or the groove. 21. The loop-type heat pipe according to claim 1, wherein at least one portion where a groove is not formed exists within a projection area range of the wick on the inner peripheral wall of the container.