JPH1164228A - Surface inspecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To measure position and height of a to-be-inspected object quickly with precision. SOLUTION: A CCD camera 16 for imaging the image of the surface of a CS(chip size) package 53 which is a to-be-inspected object, an image processing device 24 wherein, based on the image taken with the CCD camera 16. the position of a projection (solder ball) on the surface of to-be-inspected object is calculated, a sensor 12 for detecting the height of the projection on the surface of to-be-inspected object, and a sensor position setting device 22 and a drive device 20 which, according to the position of projection calculated with the image processing device 24, moves the sensor 12 to the position of projection on the surface of to-be-inspected object, are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a visual inspection of a chip size package (CS) and the like, in particular, a position of a solder ball,
The present invention relates to a surface inspection device suitable for measuring height.

[0002]

2. Description of the Related Art Conventionally, a method of assembling an LSI package on a substrate is performed as follows. As shown in FIG. 11, an LSI package 51 with leads is mounted on a substrate 52 with through holes so that the leads are inserted into the through holes, and is fixed mainly by soldering. In order to use such a conventional assembly method,
The total wiring length in the package becomes longer, and the processing of leads is complicated.

In recent years, with the diversification of semiconductor devices, there have been various demands on the number of pins and the size. Particularly, in response to the demand for increasing the number of pins, a chip size package 53 (hereinafter referred to as CS ).

The biggest feature of this CS package 53 is that
By changing the connection terminal row from the peripheral arrangement to the surface arrangement, and without limiting the pin pitch, the solder balls 54 shown in FIG.
That is, the number of pins has been increased. The size of the solder balls 54 is 0.2 mm in diameter and 0.5 to 1.0 mm in pitch. The CS package 53 includes a substrate for arranging the solder balls 54.

[0005]

However, the CS package 53, which has excellent electrical characteristics as a next-generation mounting chip, and can be compactly and densely mounted, has a solder ball as a contact in order to secure an electrical contact as a substrate. Accuracy is required so that the height error of 54 is about ± 0.5 μm to 5.0 μm. For this reason, there has been a demand for a device that accurately and quickly measures the height of the solder ball 54 as an inspection target.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a surface inspection apparatus capable of measuring the position and height of an inspection object with high accuracy and at high speed. I do.

[0007]

According to the present invention, there is provided an image pickup means for picking up an image of the surface of an inspection object, and an image processing for calculating the position of a projection on the surface of the inspection object from the image picked up by the image pickup means. Means, a height detecting means for detecting the height of the projection on the surface of the inspection object, and the height detection means according to the position of the projection calculated by the image processing means. Moving means for moving to the position of the projection.

[0008] Further, a transport means for transporting the inspection object to a predetermined position for performing the detection by the height detection means, and the inspection object transported by the transport means is detected by the height detection means. And a detecting means for detecting that the vehicle has reached a predetermined position for performing the operation, and when the detection by the detecting means is detected, the conveyance by the conveying means is interrupted.

When the detection means detects that the inspection object has reached a predetermined position, the inspection object conveyed by the conveyance means is moved to an inspection position by the height detection means. It is characterized by having moving means.

The present invention also provides imaging means for capturing an image of the surface of the inspection object, image processing means for calculating the position of a projection on the surface of the inspection object from the image captured by the imaging means, Height detecting means for detecting the height of the projection on the surface of the object; coarse movement positioning means for moving the inspection object to a predetermined position for performing detection by the height detecting means; A coarse movement position control means for controlling the movement of the coarse movement positioning means in accordance with the position of the projection calculated by the processing means, and an inspection object at a predetermined position for performing detection by the height detection means. Fine movement positioning means for positioning with high precision, and fine movement position control means for controlling positioning by the fine movement positioning means according to the position of the projection calculated by the image processing means Characterized in that was.

Further, the fine-movement positioning means includes a fine-movement positioning means for positioning the inspection object in a plane perpendicular to the height direction detected by the height detection means, and the height detection means. Characterized by: tilt fine movement positioning means for adjusting the inclination of the surface of the inspection object relative to the object; and height fine movement positioning means for positioning the inspection object in the height direction detected by the height detection means. And

The height detecting means outputs a signal corresponding to the height of the projection on the surface of the inspection object, and the height detecting means outputs a signal based on the signal output from the height detecting means. And a height signal processing means for calculating a height of the protrusion on the surface of the inspection object.

[0013] Further, there is provided a display means for displaying a height of the projection on the surface of the inspection object calculated by the height signal processing means. Further, the height detecting means includes an inspection detection microcoil for detecting the height of the protrusion on the inspection object surface, and a reference detection object surface on which the height of the projection is measured in advance. A reference detection microcoil for detecting the height of the protrusion is provided, and the height signal processing is performed by measuring in advance the signals output from the inspection detection microcoil and the reference detection microcoil, and The height of the projection on the inspection object surface is calculated based on the height of the projection on the reference inspection object surface.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing the configuration of the surface inspection apparatus according to the first embodiment. As shown in FIG. 1, the surface inspection device according to the first embodiment includes a detection device 1, a control device 2, and a transport device 3.

The detecting device 1 receives a signal from a chip size package 53 (hereinafter abbreviated as CS), which is an object to be inspected.
This is for detecting data for measuring the height of the solder ball 54 of the S package 53.

The detecting device 1 includes a photoelectric switch 10, a sensor 12, a CS package receiving frame 14, a CCD camera 16,
And various mechanisms for the guide rod 18 are provided. The photoelectric switch 10 is a switch for detecting that the chip size package 53 to be inspected is at the inspection position on the transport path, and outputs a detection signal to the transport device 3 described later.
To the control function that controls the driving of the.

The sensor 12 is moved so as to scan while facing the surface of the CS package 53 at the inspection position. The sensor 12 detects a signal for detecting the height of the solder ball 54 of the CS package 53 and detects a signal. (Oscillator /
The output is output to the dumodulator 26).

The CS package receiving frame 14 is for defining the CS package 53 to be located at an inspection position where scanning by the sensor 12 is performed. Is pressed up and in contact with the CS package 53.

The CCD camera 16 is connected to the CS at the inspection position.
The package 53 captures an image of the front surface before the sensor 12 performs scanning, and outputs an image signal of the captured image to the image processing device 24 of the control device 2.

The guide rod 18 defines a path direction when the sensor 12 is moved to scan the CS package 53. The control device 2 controls the detection of data by the detection device 1 and outputs a detection result. The control device 2 includes a driving device 20, a sensor position setting device 22, a display device 23, an image processing device 24, an oscillator
Dumodulator 26, signal processor 28, display 29
Is provided.

The driving device 20 includes a sensor position setting device 22
Guide rod 18 according to the sensor position set by
The sensor 12 is moved so as to scan over the solder balls 54 of the CS package 53 along the direction defined by

The sensor position setting device 22 sets the sensor position so that the sensor 12 scans on the solder ball 54 of the CS package 53 according to the processing result of the image processing device 24.

The display 23 displays and outputs the position of the solder ball 54 of the CS package 53, which is the processing result of the image processing device 24. The image processing device 24 includes the detection device 1
The position of the solder ball 54 of the CS package 53 is calculated based on the image taken by the CCD camera 16 together with the control of the CCD camera 16.

The oscillator / dumodulator 26 is
The signal detected by the sensor 12 of the detection device 1 is subjected to signal processing so that the signal processing device 28 can process the signal. The signal processing device 28 detects a solder ball 54 of the CS package 53 based on a signal detected by the sensor 12 obtained through the oscillator / dumodulator 26.
Detect the height of

The display 29 displays and outputs the height of the solder ball 54 detected by the signal processing device 28. The transport device 3 is for transporting the CS package 53 to be inspected to the inspection position by the detection device 1, and is provided with a conveyor 30 and a CS package lifting device 32.

The conveyor 30 continuously transports a plurality of CS packages 53 to be inspected in the direction of the inspection position by the detecting device 1 under the transport control by a control function (not shown). The conveyor 30 stops conveying the CS package 53 when the photoelectric switch 10 of the detection device 1 detects that the CS package 53 has reached the inspection position and is notified to the control function.

The CS package lifting device 32 controls the CS package 53 under transport control by a control function (not shown).
Is moved to the inspection position by the detection device 1, and the CS package 53 transported by the conveyor 30 is sandwiched by the chuck 34 and the detection device 1 is moved from above the conveyor 30.
To the CS package receiving frame 14 (inspection position) of the conveyor 30 after the processing by the detecting device 1 is completed.
Return to top. The CS package lifting device 32 includes the detection device 1
When the conveyance of the CS package 53 by the conveyor 30 is stopped, the CS package 53 on the conveyor 30 is pushed up, so that the CS package 53 is placed in the CS package receiving frame 14 of the detection device 1. It can be pressed and fixed at the inspection position.

FIG. 2 is a schematic plan view of the transfer device 3. As shown in FIG. 2, the CS package lifting device 3
Reference numeral 2 is provided so as to sandwich the CS package 53 transport path by the conveyor 30, and the CS package 53 on the conveyor 30 can be sandwiched from both sides.

FIG. 3 is a sectional view showing a detailed configuration of the sensor 12. The sensor 12 shown in FIG. 3 shows an example configured by a mutual induction type micro coil. As shown in FIG. 3, the sensor 12 includes an exciting coil 40
The detection microcoil array 42 for inspection and the detection microcoil array 44 for reference are provided on both sides of. In the vicinity of the reference detection microcoil array 44,
A reference CS package 46 is provided.

The reference detection microcoil array 44 and the reference CS package 46 are set at a specific distance L1 between the coil surface of the reference detection microcoil array 44 and the apex of the solder ball of the reference CS package 46. I have. The distance L1 is the detection microcoil array 42 for inspection.
This serves as a reference when measuring the height of the solder ball 54 of the CS package 53.

Next, the operation of the surface inspection apparatus according to the first embodiment will be described. The CS package 53 to be inspected is sequentially transported by the conveyor 30 of the transport device 3 in the direction of the inspection position by the detection device 1. When the CS package 53 conveyed by the conveyor 30 enters a position below the detection device 1, the arrival of the leading end is detected by the photoelectric switch 10.

Subsequently, when the CS package 53 is conveyed and reaches just below the CS package receiving frame 14 and the rear end is detected by the photoelectric switch 10, the control function of the conveying device 3 is notified, and The transport is stopped.

When the conveyance of the CS package 53 by the conveyor 30 is stopped, the CS package 53 on the conveyor 30 is detected by the CS package lifting device 32 by the detection device 1.
To the inspection position. That is, the CS package 53 is sandwiched by the chuck 34 and is pushed upward to be pressed against the CS package receiving frame 14 of the detection device 1. In the CS package receiving frame 14, a shoulder (a corner formed by the upper surface and the side surface) around the CS package 53 is held, and the CS package 53 is stabilized at the inspection position.

When the CS package 53 is pressed against the CS package receiving frame 14 and held at the inspection position, the upper surface of the CS package 53, that is, the solder balls 54 are provided by the CCD camera 16 under the control of the image processing device 24. The taken surface is imaged.

FIG. 4 shows an example of an image of the upper surface of the CS package 53 taken by the CCD camera 16. The image processing device 24 obtains a vertex T as the position of each ball of the solder ball 54 based on the image captured as shown in FIG. The image processing device 24 uses the calculated position of the vertex T of the solder ball 54 as the sensor position setting device 2
Notify 2. The display 23 is provided with an image processing device 24.
A display indicating the position of the solder ball 54 of the CS package 53 calculated by the above is output. As described above, since the scanning position of the sensor 12 is obtained by the image processing, C
The process of measuring the height of the solder balls 54 of the S package 53 can be speeded up.

The sensor position setting device 22 sets the position at which the sensor 12 scans the solder ball 54 with respect to the CS package 53 according to the position of the vertex T of the solder ball 54 calculated by the image processing device 24. . The sensor position setting device 22 causes the driving device 20 to move the sensor 12 according to the set sensor position, and causes the CS package 53 at the inspection position to scan.

[0038] Above the CS package receiving frame 14, FIG.
As shown in FIG. 1, a guide rod 18 is provided. The guide bar 18 is installed so as to be parallel to the arrangement direction of the solder balls 54 with the CS package 53 held at the inspection position.

The CCD camera 16 driven by the driving device 20 slides on the guide rod 18. Therefore, the sensor 12 is moved so as to scan while facing the surface of the CS package 53 at the inspection position, and can detect a signal for detecting the height of the solder ball 54 of the CS package 53.

As shown in FIG. 3, the sensor 12 of the surface inspection apparatus according to the first embodiment comprises a detection microcoil array 42 for inspection and a detection microcoil array 44 for reference. 44
Is maintained so that the distance L1 between the coil surface and the top of the solder ball of the reference CS package 46 is constant.

By scanning the CS package 53, a signal measured by the detection microcoil array 42 for inspection is input to the signal processing device 28 via the oscillator / dumodulator 26.

The signal waveform S of the signal detected by the sensor 12 is, for example, as shown in FIG. As shown in FIG. 6, the signal waveform S has a peak in the signal level at a position corresponding to the apex T of each solder ball in accordance with the arrangement of the solder balls 54. That is, a signal level corresponding to the height of the apex T of the solder ball is obtained.

The signal processing device 28 uses the signal obtained through the oscillator / dumodulator 26 as a reference, based on the signal level at a distance L1 obtained based on the reference CS package 46 by the reference detection microcoil array 44. , The height of the solder ball 54 is determined. That is,
Since the height of the solder ball at the signal level detected at the distance L1 is known in advance, the distance L2 can be calculated from the actually detected signal level, and the height of the solder ball can be accurately obtained. The display 29 outputs a display indicating the height of the solder ball 54 of the CS package 53 obtained by the signal processing device 28.

The detection microcoil array 42 for inspection of the sensor 12 and the detection microcoil array 44 for reference
By narrowing the pitch of the coils, the apex of the solder ball 54 can be detected by any of the coils even if the position of the CS package 53 is shifted.
Therefore, the height of the solder ball 54 of the CS package 53 having any shape can be measured.

The aforementioned sensor 12 uses an inspection detection microcoil array 42 having a configuration in which a plurality of microcoils are arranged in a predetermined direction, and as shown in FIG. However, as shown in FIG. 7, a single microcoil 42a may be used to sequentially scan in accordance with the arrangement of the solder balls 54, as shown in FIG.

Next, a second embodiment of the present invention will be described. FIG. 8 is a block diagram showing the configuration of the surface inspection apparatus according to the second embodiment. As shown in FIG. 8, the surface inspection device according to the second embodiment includes a detection device 61, a control device 62, and a transport system. The transport system includes an inspection unit 63, a carry-in device 64, a carry-out device 66, a loader 67, an unloader 68, and a control function (not shown).

The detection device 61 converts the chip size package 53 (CS package 53) to be inspected into
This is for detecting data for measuring the height of the solder ball 54 of the S package 53.

The detection device 61 is provided with a laser focus displacement meter 70 and a CCD camera 72. The laser focus displacement meter 70 measures the height of the solder ball 54 of the CS package 53, which is the inspection target, located at the irradiation destination of the laser light using the laser light. It is assumed that the laser focus displacement meter 70 in the second embodiment has a capability of, for example, a measurement range of ± 0.3 mm and a resolution of 0.1 μm.

The CCD camera 72 is connected to the CS at the inspection position.
For the package 53, the laser focus displacement meter 70
Before the measurement of the height of the solder ball 54 is performed, an image of the surface is captured, and an image signal of the captured image is output to the image processing device 94 of the control device 62.

The control device 62 controls the data detection by the detection device 61 and outputs the detection result. The controller 90, the waveform monitor 91, the fine movement table control device 92, and the coarse movement stage control device 93 , An image processing device 94, and a display 95.

The controller 90 controls the measurement of the height of the solder ball 54 by the laser focus displacement meter 70, and causes the waveform monitor 91 to output the measurement result obtained by the laser focus displacement meter 70.

The waveform monitor 91 outputs a signal waveform representing the height of the solder ball 54 of the CS package 53 measured by the laser focus displacement meter 70 under the control of the controller 90.

Based on the position of the solder ball 54 of the CS package 53 calculated by the image processing device 94, the fine movement table control device 92 controls the height tilt fine movement table 78 and the XY rotation fine movement table in the inspection section 63 of the transport system. 80 controls the positioning of the CS package 53. The positioning by the fine movement table control device 92 is performed with high accuracy according to the performance of the laser focus displacement meter 70.

The coarse movement stage control device 93 controls the movement of the CS package 53 by the coarse movement stage 74 in the inspection section 63 of the transport system to the inspection position by the laser focus displacement meter 70 at high speed. The driving is performed by controlling the driving motors 75 and 76.

The image processing device 94 detects the CC of the detecting device 61.
Together with the control of the D camera 72, the position of the solder ball 54 of the CS package 53 is calculated based on the image captured by the CCD camera 72.

The display 95 displays and outputs the position of the solder ball 54 of the CS package 53, which is the processing result of the image processing device 24. In the transport system, an inspection unit 63, a loading device 64, a loading device 66, a loader 67, and an unloader 68 are provided.

The inspection section 63 moves the CS package 53 to be inspected to an inspection position by the detecting device 61. The detailed configuration will be described later. The operation of the loading device 64 is controlled by a transport function (not shown).
Plural units are conveyed in units of 6. When the carry-in device 64 transports the magazine 56 to a predetermined position, the carry-in device 64 temporarily stops to move the CS package 53 to the inspection unit 63.
The CS packages 53 are transported in a state where they are placed on the cells 58, respectively. At this time, the solder ball 54 of the CS package 53 is placed on the cell 58 so as to be on the upper surface side.

The operation of the unloading device 66 is controlled by a transport function (not shown). The unloading device 66 transports a plurality of the CS packages 53 that have been inspected by the inspection section 63 in units of a magazine 56.

The operation of the loader 67 is controlled by a transport function (not shown). The loader 67 picks up one CS package 53 to be inspected from the magazine 56 transported to a predetermined position by the carry-in device 64 and inspects it. The fixed frame 82 is moved to the position 63 and is at the carry-in position (A) of the inspection unit 63.
The CS package 53 is placed on top. The loader 67 has one CS for each CS package 53 of the magazine 56.
Each time the inspection of the package 53 is completed, the above operation is repeated.

The operation of the unloader 68 is controlled by a transport function (not shown). The unloader 68 picks up the inspected CS package 53 from the fixed frame 82 at the unloading position (C), which has been inspected by the inspection section 63, and The user moves onto the unloading device 66 and puts it on the magazine 56 on the unloading device 66. However, the unloader 68 is used for the inspected CS package 5
In accordance with the judgment of the passed or rejected product based on the height of the solder ball 54 of No. 3, the product is sorted out.

As shown in FIG. 8, the inspection section 63 includes a coarse movement stage 74, coarse movement motors 75 and 76, screw screws 77a and 77b, a height tilt fine movement table 78, an XY rotation fine movement table 80, and a fixed frame 82. Is provided.

The coarse movement stage 74 includes a height tilt fine movement table 78, an XY rotation fine movement table 80, and a fixed frame 82.
(On which the CS package 53 is placed) to move to the inspection position by the detection device 61.

The coarse movement motors 75 and 76 generate a driving force for moving the coarse movement stage 74 to the inspection position by the detection device 61 under the control of the coarse movement stage control device 93. The coarse motor 76 has a screw screw 77a.
Is rotated to move the coarse movement stage 74 engaged with the screw screw 77a to the screw screw 77a.
In the direction of the axis. The coarse movement motor 75 rotates the screw screw 77b arranged in a direction perpendicular to the screw screw 77a to thereby rotate the screw screw 7a.
The stage on which the coarse movement stage 74, the coarse movement motor 76, and the screw screw 77a, which are engaged with the screw 7b, are mounted is moved in the axial direction of the screw screw 77b. The coarse movement motors 75 and 76 move the coarse movement stage 74
It is used to move to the inspection position by the detection device 61 at high speed.

The height tilt fine movement table 78 is fixed to the fixed frame 8.
2, coarse movement stage 7 with XY rotation fine movement table 80
Under the control of the fine movement table control device 92, the inspection surface of the CS package 53 placed on the fixed frame 82 is horizontal with respect to the laser focus displacement meter 70 of the detection device 61. It is a table for adjusting the height and the inclination with high precision so that the height of the solder ball 54 falls within the inspection range.

The XY rotation fine movement table 80 is
Is mounted on the height tilt fine movement table 78 and is mounted on the fixed frame 82 with respect to the laser focus displacement meter 70 of the detection device 61 under the control of the fine movement table control device 92. The inspection surface of the CS package 53 is horizontal,
And, so that the height of the solder ball 54 falls within the inspection range,
It is a table for adjusting the rotational position with high precision in the X direction and the Y direction (the X direction and the Y direction are directions perpendicular to each other).

The fixed frame 82 is provided with an XY rotation fine movement table 80.
It is provided above and holds the CS package 53 transported by the loader 67 as an inspection target. next,
The operation of the surface inspection device according to the second embodiment will be described.

The magazine 56 to be inspected is sequentially conveyed by the carry-in device 64 in a predetermined direction. When the transported magazine 56 reaches a predetermined position, the transport by the loading device 64 is temporarily stopped by the control function.

Further, the loader 67 is driven by the control function, and one CS is read from the magazine 56 on the loading device 64.
The package 53 is taken out, transported in the direction of the inspection unit 63, and placed on the fixed frame 82 at the carry-in position (A) of the inspection unit 63.

When the CS package 53 to be inspected is placed on the fixed frame 82, the coarse movement stage control device 93 of the control device 62 drives the coarse movement motors 75 and 76 to rotate, and the coarse movement stage 74 To the inspection position (B) located below the detection device 61 at high speed.

Further, the fine movement table control device 92 controls the height tilt fine movement table 78 and the XY rotation fine movement table 80, and controls the CS package 5 mounted on the fixed frame 82.
3 is positioned with high precision with respect to the laser focus displacement meter 70 so that the inspection surface on which the solder balls 54 are provided is parallel and within the inspection range in the height direction.

When the CS package 53 is positioned at a predetermined position in the inspection section 63, the CS package 5 is controlled by the CCD camera 72 under the control of the image processing device 94.
The upper surface of 3, that is, the surface on which the solder balls 54 are provided is imaged.

FIG. 4 shows an example of an image of the upper surface of the CS package 53 taken by the CCD camera 72 (the same as in the first embodiment). The image processing device 94 obtains a vertex T as a position of each ball of the solder ball 54 based on an image captured as shown in FIG. The image processing device 94 notifies the fine movement table control device 92 of the calculated position of the vertex T of the solder ball 54. The display 95 outputs a display indicating the position of the solder ball 54 of the CS package 53 calculated by the image processing device 94. As described above, since the height measurement position of the solder ball 54 by the laser focus displacement meter 70 is obtained by the image processing, the measurement processing of the height of the solder ball 54 of the CS package 53 can be speeded up.

The fine movement table control device 92 drives the coarse movement motors 75 and 76 by the coarse movement stage control device 93 in accordance with the position of the vertex T of the solder ball 54 calculated by the image processing device 94, and performs the coarse movement. Positioning is performed within the positioning accuracy range of the stage 74.

Further, the fine movement table control device 92 controls the height tilt fine movement table 78 or the XY rotation so that the position of the apex T of the solder ball 54 coincides with the irradiation position of the laser beam irradiated from the laser focus displacement meter 70. The fine movement table 80 (or both) is driven to adjust the position of the CS package 53 with high accuracy.

It should be noted that the fine movement table control device 9 is applied to the plurality of solder balls 54 provided on the CS package 53.
No. 2 controls positioning so that measurement is performed according to the measurement direction as shown in FIG.

The controller 90 irradiates the CS package 53, which has been positioned with high precision by the fine movement table control device 92, with laser light by the laser focus displacement meter 70, and thereby the laser focus displacement meter 70 and the solder balls 54. Generate a signal based on the distance to

The signal waveform S of the signal generated by using the laser focus displacement meter 70 is, for example, as shown in FIG. As shown in FIG. 10, the signal waveform S is
In accordance with the arrangement of No. 4, a peak appears at the signal level at a position corresponding to the vertex T of each solder ball. That is, a signal level corresponding to the height of the apex T of the solder ball is obtained.

The controller 90 obtains the height of each solder ball 54 from the detected signal based on a distance L1 from a predetermined reference point. Further, under the control of the controller 90, the waveform monitor 91
A display indicating the height of the solder ball 54 of the package 53 is output.

In the same manner, based on the position of the solder ball 54 calculated from the photographed image of the CS package 53 to be inspected by the image processing device 94, the coarse movement stage control device is operated in accordance with the measurement direction shown in FIG. Under the control of 93, the coarse movement stage 74 is positioned at a high speed, and under the control of the fine movement table controller 92, the laser focus displacement meter 70 is controlled by the height tilt fine movement table 78 and the XY rotation fine movement table 80. High-precision positioning according to the performance is performed, and the height of the solder ball 54 is measured as described above.

When the inspection at the inspection position (B) of the inspection section 63 is completed, the coarse movement motors 75 and 76 are driven by the coarse movement stage control device 93 to move the coarse movement stage 74 to the unloading position (C). Is done.

The CS package 53 having the measured height of the solder ball 54 is classified into a pass product and a reject product based on the measurement result. The CS package 53 placed on the fixed frame 82 on the coarse movement stage 74 moved to the unloading position (C) is lifted by the unloader 68,
It is moved in the direction of the unloading device 66 and placed on the magazine 56 on the unloading device 66. At this time, under the control of the transport function, the inspected CS package 53 is separated into a passable product and a rejected product, and is carried out.

As described above, in the surface inspection apparatus according to the second embodiment, the CS package 53 to be inspected is inspected by using the coarse movement stage 74, the height tilt fine movement table 78 and the XY rotation fine movement table 80 properly. Can be moved to a position.

That is, in general, the positioning accuracy is poor on a stage that can be moved at high speed, and the movement speed is slow on a stage that can be positioned with high accuracy.
In the second embodiment, in order to perform high-precision positioning at high speed, the coarse movement stage 74 is first moved to a target inspection position at high speed within the positioning accuracy range of the coarse movement stage 74, and then the height tilt fine movement table 78 and the XY Rotary fine movement table 80
Thereby, it can be positioned to a target inspection position with high accuracy.

By performing such control, the CS package 53 to be inspected can be positioned at the inspection position with high speed and high accuracy.
The position and height of 4 can be measured accurately and at high speed.

[0084]

As described above in detail, according to the present invention, an image pickup means for picking up an image of the surface of an inspection object, and the position of a projection on the surface of the inspection object are determined by the image picked up by the image pickup means. Image processing means to calculate, height detection means to detect the height of the protrusion on the inspection object surface, according to the position of the protrusion calculated by the image processing means,
Moving means for moving the height detecting means to the position of the projection on the surface of the inspection object, thereby detecting the position of the projection on the surface of the inspection object and the height detecting means by image processing High-speed processing is possible.

Further, a transport means for transporting the inspection object to a predetermined position for performing the detection by the height detection means, and the inspection object transported by the transport means is detected by the height detection means. And a detecting means for detecting that a predetermined position for performing the inspection has been reached, and when the detection by the detecting means is performed, the transport by the transport means is interrupted, so that a plurality of inspection objects are continuously provided. An object can be supplied as an inspection object.

When the detection means detects that the inspection object has reached a predetermined position, the inspection object transported by the transportation means is moved to the inspection position by the height detection means. By providing the moving means, when a plurality of inspection objects are continuously inspected, each of them is reliably moved to the inspection position, so that accurate measurement becomes possible.

Further, an image pickup means for picking up an image of the surface of the inspection object, an image processing means for calculating the position of a projection on the surface of the inspection object from the image picked up by the image pickup means, Height detecting means for detecting the height of the upper protrusion, coarse positioning means for rapidly moving the inspection object to a predetermined position for performing detection by the height detecting means, and the image processing means In accordance with the calculated position of the projection, a coarse movement position control means for controlling movement by the coarse movement positioning means, and a test object with high accuracy at a predetermined position for performing detection by the height detection means. Since there are provided fine movement positioning means for positioning, and fine movement position control means for controlling positioning by the fine movement positioning means in accordance with the position of the projection calculated by the image processing means, It is possible to position the test object fast and with high accuracy, the position of the test object, accurately height, it is possible to measure at high speed.

Further, the fine-movement positioning means includes a flat-fine-motion positioning means for positioning the inspection object in a plane perpendicular to the height direction detected by the height detection means, and the height detection means. Inspection means for adjusting the inclination of the surface of the object to be inspected with respect to the object and height fine movement positioning means for positioning the object to be inspected in the height direction detected by the height detecting means. The target object can be positioned at the inspection target position with high accuracy.

The height detecting means outputs a signal corresponding to the height of the projection on the surface of the inspection object, and the height detecting means outputs a signal based on the signal output from the height detecting means. And a height signal processing means for calculating a height of the protrusion on the surface of the inspection object.

Further, a display means for displaying a height of the projection on the surface of the inspection object calculated by the height signal processing means is provided. Further, the height detecting means includes an inspection detection microcoil for detecting the height of the protrusion on the inspection object surface, and a reference detection object surface on which the height of the projection is measured in advance. A reference detection microcoil for detecting the height of the protrusion is provided, and the height signal processing is performed by measuring in advance the signals output from the inspection detection microcoil and the reference detection microcoil, and The height of the projection on the inspection object surface is calculated based on the height of the projection on the reference inspection object surface.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a surface inspection apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a schematic configuration of a transfer device 3 shown in FIG.

FIG. 3 is a sectional view showing a detailed configuration of a sensor 12 shown in FIG. 1;

FIG. 4 is a view showing an example of an image on the upper surface of the CS package 53 taken by the CCD camera 16 in the first embodiment.

FIG. 5 is a diagram showing an installation state of a guide rod 18 provided above a CS package receiving frame 14 shown in FIG. 1;

FIG. 6 is a view showing an example of a signal waveform S of a signal detected by the sensor 12 shown in FIG. 1;

FIG. 7 shows a CS using a single microcoil 42a.
FIG. 4 is a diagram for explaining a scanning direction of a package 53 with respect to a solder ball 54.

FIG. 8 is a block diagram showing a configuration of a surface inspection device according to a second embodiment of the present invention.

9 is a view for explaining a measurement direction of a solder ball 54 of a CS package 53 that is controlled to move by an inspection unit 63 shown in FIG. 8;

FIG. 10 is a diagram showing an example of a signal waveform S of a signal detected by the laser focus displacement meter shown in FIG. 8;

FIG. 11 is a diagram showing a conventional LSI package.

FIG. 12 is a diagram showing an example of a chip size package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Detecting device 2 Control device 3 Transport device 10 Photoelectric switch 12 Sensor 14 CS package receiving frame 16 CCD camera 18 Guide rod 20 Drive device 22 Sensor position setting device 23,29 Display 24 Image processing device 28 Signal processing device 30 Conveyor 32 CS package Push-up device 42 Inspection detection microcoil array 44 Reference detection microcoil array 64 Loading device 66 Unloading device 67 Loader 68 Unloader 70 Laser focus displacement meter 74 Coarse motion stage 78 Height tilt fine movement table 80 XY rotation fine movement table 82 Fixed frame 90 Controller 91 Waveform monitor 92 Fine movement table control device 93 Coarse movement stage control device 94 Image processing device

──────────────────────────────────────────────────の Continuation of front page (51) Int.Cl. ⁶ Identification code FI H01L 21/66 G06F 15/62 405B H04N 7/18 15/70 350B (72) Inventor Naotaka Komatsu 2-chome, Araimachi Shinama, Takasago City, Hyogo Prefecture No. 1 In the Takasago Research Laboratory, Mitsubishi Heavy Industries, Ltd.

Claims (8)

[Claims] An imaging unit configured to capture an image of a surface of the inspection target; an image processing unit configured to calculate a position of a protrusion on a surface of the inspection target based on an image captured by the imaging unit; Height detecting means for detecting the height of the upper projection; and moving the height detecting means to the position of the projection on the surface of the inspection object in accordance with the position of the projection calculated by the image processing means. A surface inspection apparatus comprising: a moving unit. 2. A transport unit for transporting an inspection target to a predetermined position for detection by the height detection unit, and an inspection target transported by the transport unit is detected by the height detection unit. Detecting means for detecting that the vehicle has reached a predetermined position for carrying out, and when the detecting means detects, the conveyance by the conveying means is interrupted. Surface inspection equipment. 3. When the detection means detects that the inspection object has reached a predetermined position, the inspection object conveyed by the conveyance means is moved to an inspection position by the height detection means. 3. The surface inspection apparatus according to claim 2, further comprising a moving unit. 4. An image pickup means for picking up an image of the surface of the inspection object, an image processing means for calculating the position of a protrusion on the surface of the inspection object from the image picked up by the image pickup means, and the inspection object surface Height detecting means for detecting the height of the upper protrusion, coarse positioning means for moving the test object to a predetermined position for performing detection by the height detecting means at a high speed, and the image processing means Coarse movement position control means for controlling the movement by the coarse movement positioning means in accordance with the calculated position of the projection, and the inspection object with high precision at a predetermined position for detection by the height detection means. Fine movement positioning means for positioning, and fine movement position control means for controlling positioning by the fine movement positioning means in accordance with the position of the protrusion calculated by the image processing means. Characteristic surface inspection equipment. 5. The fine movement positioning means for positioning a test object in a plane perpendicular to the height direction detected by the height detection means, and the height detection means. Tilt fine movement positioning means for adjusting the inclination of the surface of the test object with respect to the object, and height fine movement positioning means for positioning the test object in the height direction detected by the height detection means. The surface inspection apparatus according to claim 4, wherein 6. The height detecting means outputs a signal corresponding to the height of a protrusion on the surface of the inspection object, and the height detecting means outputs a signal based on the signal output from the height detecting means. 6. The apparatus according to claim 1, further comprising height signal processing means for calculating a height of the protrusion on the surface of the inspection object. Surface inspection equipment. 7. A display device for displaying a height of the projection on the surface of the inspection object calculated by the height signal processing unit.
Surface inspection device as described. 8. The inspection detection microcoil for detecting the height of a projection on the surface of the inspection object, the reference detection object for which the height of the projection is measured in advance. A reference detection microcoil for detecting the height of the protrusion on the object surface is provided, and the height signal processing includes a signal output from the inspection detection microcoil and the reference detection microcoil, The height of the protrusion on the surface of the inspection object is calculated based on the height of the protrusion on the surface of the reference inspection object measured in advance. Item 7. A surface inspection apparatus according to Item 7.