JPH1160692A - Resin composition for printed wiring board and printed wiring board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition which has a low water absorptivity, a high glass transition temperature (Tg), good thermal resistance and good adhesiveness, and also has a low relative dielectric constant and a low dielectric loss tangent, and a printed wiring board using this composition. SOLUTION: This resin composition for a printed wiring board is a resin composition comprising a cyanate compound having two or more cyanato groups in its molecule, an epoxy resin and a flame retardant as essential components, wherein the epoxy resin comprises at least one epoxy resin represented by the formula (wherein R1 represents a hydrogen atom or a 1-4C lower alkyl group, R2 represents a 1-4C lower alkyl group and (n) represents an integer of 1 to 7). The printed wiring board is obtained by a method comprising preparing a varnish using this resin composition, impregnating a substrate with the varnish, followed by drying, to thereby produce a prepreg, stacking one or more of the prepregs, laminating a metal foil on one side or both sides of the stacked prepregs and subjecting the laminated prepregs to heat and pressure molding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for a printed wiring board having a high Tg (glass transition temperature), excellent dielectric properties and excellent heat and moisture resistance, and a printed wiring board using the same.

[0002]

2. Description of the Related Art In recent years, a resin material having a low relative dielectric constant and a low dielectric loss tangent has been demanded as a material for a printed wiring board used for high-frequency equipment in a communication field or the like, a large computer, or the like. On the other hand, thermoplastic resin materials such as fluororesin and polyphenylene ether resin having a low relative permittivity and a low dielectric tangent have been used, but these are high in cost,
However, there are still problems such as the need for high pressure, dimensional stability, and poor adhesion to metal plating. On the other hand, among thermosetting resin materials, a cyanate ester resin known as a resin having a low relative dielectric constant and a low dielectric loss tangent, and B
Resin materials such as T (bismaleimide triazine) resin have been proposed. However, these resin materials alone have the drawback that they have a high water absorption rate and are inferior in adhesion to metals, flame resistance, and heat resistance during moisture absorption.

For the purpose of improving the above-mentioned problems in BT (bismaleimide triazine) resin and cyanate ester resin, these resin materials are disclosed in
Glycidyl ether of phenol novolak shown in JP-A-4419, glycidyl ether of phenol-added dicyclopentadiene polymer shown in JP-A-2-214471, JP-A-3-840
Epoxy resins such as glycidyl etherified bisphenol A disclosed in JP-A No. 40/40, JP-A-2-2867.
No. 23, a glycidyl etherified product of brominated phenol novolak, and a method of using an epoxy resin such as a glycidyl etherified product of brominated bisphenol A disclosed in JP-A-5-339342.

[0004]

However, Japanese Patent Laid-Open No. 3-8 / 1990
In the method disclosed in Japanese Patent No. 4040, in which an epoxy resin is used in combination with a cyanate ester resin, although the adhesion to a metal is improved, there are drawbacks in that Tg is significantly reduced and dielectric properties are deteriorated. . Further, there is no significant effect in reducing the water absorption or improving the heat resistance during moisture absorption. In the method using an epoxy resin as disclosed in JP-A-63-54419, the decrease in Tg can be suppressed to some extent, and the heat resistance at the time of moisture absorption and the adhesion to metal can be improved, but the water absorption However, there is a drawback that the dielectric properties are degraded and the dielectric properties are deteriorated. In particular, there is a problem that the relative dielectric constant and the dielectric loss tangent in the GHz band are significantly increased, and it cannot be used for high frequency applications. In the method using an epoxy resin as disclosed in JP-A-2-214471, water absorption and heat resistance at the time of moisture absorption are improved.
There is a problem that g is reduced, and adhesion to metal and dielectric characteristics in a GHz band are deteriorated. Also, a glycidyl etherified product of a brominated phenol novolak disclosed in JP-A-2-286723 is disclosed.
In the method of using an epoxy resin such as a glycidyl etherified product of brominated bisphenol A disclosed in JP-A-39342, improvement in heat resistance at the time of moisture absorption and flame resistance can be added, but reduction in Tg, water absorption, and dielectric properties. Has the problem of worsening.

The present invention has been made in view of such circumstances, and has a low water absorption, a high Tg, and excellent dielectric properties without impairing properties such as heat resistance, adhesiveness, and flame resistance when absorbing moisture. An object of the present invention is to provide a resin composition for a printed wiring board and a printed wiring board using the same.

[0006]

The present invention provides (A) a cyanate compound containing two or more cyanate groups in a molecule,
In a resin composition containing (B) an epoxy resin and (C) a flame retardant as essential components, the (B) epoxy resin contains at least one kind of epoxy resin represented by the formula (1). Things.

[0007]

Embedded image (Wherein, R ₁ represents a hydrogen atom or a lower alkyl group having 1 to 4 carbon atoms, R ₂ represents a lower alkyl group having 1 to 4 carbon atoms, and n is an integer of 1 to 7) Indicates)

The present invention also relates to (A) a glycidyl group of an epoxy resin (B) of 0.1 to 1 mol per 1.0 mol of a cyanate group of a cyanate compound having two or more cyanato groups in a molecule. 0.0 mol, and the total of (A) and (B) was 1
It is a preferable resin composition for a printed wiring board containing 5-200 parts by weight of the flame retardant (C) based on 00 parts by weight. And
(A) The resin composition for a printed wiring board is preferably a cyanate compound containing two or more cyanate groups in the molecule, which contains at least one kind of the cyanate compound represented by the formula (2).

[0009]

Embedded image

The present invention also relates to (A) a cyanate compound having two or more cyanato groups in the molecule,
Bis (4-cyanatephenyl) propane, bis (3
5-dimethyl-4-cyanatephenyl) methane, 2,
2-bis (4-cyanatephenyl) -1,1,1,
3,3,3-hexafluoropropane and α, α'-
It is preferable that at least one selected from bis (4-cyanatephenyl) -m-diisopropylbenzene is contained, and (C) the flame retardant has (A) a cyanate group in the molecule.
A flame retardant having no reactivity with a cyanate compound containing at least one cyanate compound is used, and 1,2-dibromo-4- (1,2-dibromoethyl) cyclohexane is used as a flame retardant having no reactivity with the cyanate compound. At least one kind of an aliphatic cyclic flame retardant selected from, tetrabromocyclooctane or hexabromocyclododecane, and a flame retardant having no reactivity with a cyanate compound are represented by the formula (3):
It is preferred to use at least one kind of the heterocyclic flame retardant represented by the formula or a mixture of two or more kinds of the heterocyclic flame retardant represented by the formula (3) and the non-reactive flame retardant with the cyanate compound. It is a resin composition for printed wiring boards.

[0011]

Embedded image

The present invention also provides a varnish comprising the above-described resin composition for a printed wiring board, at least one prepreg obtained by impregnating and drying a substrate, and laminating a metal foil on one or both surfaces thereof. It is a printed wiring board obtained by heating and pressing. By using such a composition, it is possible to provide a printed wiring board having a high Tg and having excellent dielectric properties and moisture and heat resistance.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The (A) cyanate compound containing two or more cyanato groups in a molecule used in the resin composition for a printed wiring board of the present invention is not particularly limited, but is represented by the formula (2) Are preferable, and specific examples thereof include 2,2-bis (4-cyanatephenyl) propane, bis (4-cyanatephenyl) ethane, bis (3,5-dimethyl-4-cyanatephenyl) methane, 2,2-bis (4-cyanatephenyl) -1,
1,1,3,3,3-hexafluoropropane, α,
α'-bis (4-cyanoatephenyl) -m-diisopropylbenzene, cyanate esterified phenol-added dicyclopentadiene polymer, and prepolymers thereof. Of these, 2,2-bis (4-cyanatephenyl) propane, bis (3,5-dimethyl-4-cyanatephenyl) methane, 2,2-bis (4
-Cyanate phenyl) -1,1,1,3,3,3-hexafluoropropane and α, α'-bis (4-cyanate phenyl) -m-diisopropylbenzene give particularly good dielectric properties of the cured product. Therefore, it is preferable.

The monomer (A) of a cyanate compound having two or more cyanato groups in the molecule has high crystallinity, and when these monomers are varnished with a solvent, the varnish may vary depending on the solid concentration. May be recrystallized. Therefore, it is preferable to use the above-mentioned cyanate compound monomer after prepolymerization. Although the conversion of the cyanato group of the prepolymer is not particularly limited, it is usually 20 to
It is desirable to use a prepolymer converted within the range of 60% by weight. In addition, (A) the cyanate compound containing two or more cyanato groups in the molecule may be used singly or as a mixture of two or more.

As the epoxy resin (B) used in the resin composition for a printed wiring board of the present invention, an epoxy resin represented by the formula (1) is used. As specific examples, 1 or 2
An epoxy resin obtained by using a condensate of a monohydric phenol compound having two lower alkyl groups and hydroxybenzaldehyde as a raw material and glycidyl etherifying with epichlorohydrin or the like is used. However, the method of condensation and glycidyl etherification is not particularly limited. Further, the epoxy resin (B) represented by the formula (1) may be used alone or as a mixture of two or more.

The blending amount of the epoxy resin (B) in the present invention is not particularly limited, but the glycidyl group of the epoxy resin (B) may be 0 to 1.0 mol of the cyanate group of the cyanate compound (A). It is preferable to mix in the range of 0.1 to 1.0 mol. More preferably 0.1 to 0.6
Is a mole. If less than 0.1 mol, adhesion to metal,
Heat resistance at the time of moisture absorption tends to be deteriorated, and if it exceeds 1.0 mol, dielectric properties in a high frequency band of 1 GHz or more tend to deteriorate, which is not preferable.

The flame retardant (C) used in the resin composition for a printed wiring board of the present invention is (A) a compound having two cyanato groups in the molecule.
A flame retardant having no reactivity with a cyanate compound containing at least one cyanate group, that is, a flame retardant having no functional group having a reactivity with a cyanato group is preferable. As a specific example, 1,2-dibromo-4- (1 , 2-dibromoethyl) cyclohexane, tetrabromooctane, hexabromocyclododecane and the like, and a heterocyclic flame retardant represented by the formula (3). As the heterocyclic flame retardant represented by the formula (3), 2,4,6-tris (tribromophenoxy) -1,3,5-triazine is preferable. (C)
The flame retardant comprises (A) a cyanate compound containing two or more cyanato groups in the molecule and (B) a total of 10 epoxy resins.
It is preferable to mix in a range of 5 to 200 parts by weight with respect to 0 parts by weight. More preferably, it is 5 to 100 parts by weight. If it is less than 5 parts by weight, the flame retardant effect is poor, and if it exceeds 200 parts by weight, the heat resistance is undesirably reduced.

In the resin composition for a printed wiring board of the present invention, a curing accelerator is used to accelerate the curing reaction. Specific examples of the curing accelerator used in the resin composition for a printed wiring board of the present invention include cobalt, manganese, tin, nickel,
Compounds having a catalytic function of accelerating the curing reaction of a cyanato group, such as organic metal salts such as zinc, copper, and iron, and organic metal complexes can be used. The curing accelerators may be used alone or in a combination of two or more.

In the resin composition for a printed wiring board of the present invention, a compound having a catalytic function of accelerating the reaction of a glycidyl group may be used in combination. Specifically, an alkali metal compound, an alkaline earth metal compound, an imidazole compound, an organic phosphorus compound, a secondary amine, a tertiary amine,
And quaternary ammonium salts. These compounds may be used alone or as a mixture of two or more.

In the resin composition for printed wiring boards of the present invention, compounds having active hydrogen such as alcohols, amines and phenols can be used in combination.

The resin composition for a printed wiring board of the present invention may optionally contain a filler and other additives. As the filler compounded as necessary,
Usually, inorganic fillers are suitably used, and specific examples thereof include fused silica, glass, alumina, titania, zircon, calcium carbonate, calcium silicate, magnesium silicate, aluminum silicate, silicon nitride, boron nitride, beryllia, zirconia, and titanic acid. Barium, potassium titanate, calcium titanate, or the like can be used.

The resin composition for a printed wiring board of the present invention can be subjected to heat curing to provide a printed wiring board having excellent dielectric properties and heat resistance. That is, the resin composition for a printed wiring board of the present invention is dissolved in a solvent to form a varnish once, impregnated into a substrate such as a glass cloth, and dried to prepare a prepreg. Next, the prepreg is laminated with an arbitrary number of metal foils on one side or up and down and heated and pressed to form a printed wiring board or a metal-clad laminate. Here, drying means removing the solvent when a solvent is used, or eliminating fluidity at room temperature when a solvent is not used.

When the resin composition for a printed wiring board of the present invention is varnished, the solvent is not particularly limited. Specific examples thereof include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, and the like. Aromatic hydrocarbons such as xylene, methoxyethyl acetate, ethoxyethyl acetate, butoxyethyl acetate, ester systems such as ethyl acetate, N-methylpyrrolidone, formamide, N-methylformamide;
Amides such as N, N-dimethylformamide, N, N-dimethylacetamide, methanol, ethanol, ethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol, triethylene glycol Alcohols such as monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monopropyl ether, and dipropylene glycol monopropyl ether are used. These solvents may be used singly or as a mixture of two or more.

In general, the dielectric properties of a cured resin are affected by the molecular structure, that is, the amount and strength of polar groups in the molecule, the mobility of the molecular skeleton, and the like. Originally, a cured product of a cyanate ester has a low dielectric constant and a low dielectric loss tangent because it has a triazine skeleton having a low polarity, rigid and symmetric structure. But,
Epoxy based on conventional bisphenol A, brominated bisphenol A and phenol-added dicyclopentadiene polymer to cyanate ester to improve adhesion to metals, heat resistance when absorbing moisture, and to add flame resistance In a resin composition using a resin in combination, the relative dielectric constant and the dielectric loss tangent are increased because Tg is remarkably lowered and the skeleton of the reaction product of the cyanate ester and the epoxy resin is higher in polarity than the triazine skeleton. On the other hand, in a resin composition using an epoxy resin based on a polyfunctional polyphenol compound such as phenol novolak or brominated phenol novolak, a decrease in Tg can be slightly prevented, but a higher water absorption rate and a cured product are obtained. , The relative permittivity and the dielectric loss tangent are significantly increased. In contrast, the epoxy resin used in the printed wiring board resin composition of the present invention and the printed wiring board using the same is a polyfunctional epoxy resin, and when cured, the length of molecules between crosslinks is short, In addition, the rotation of the glycidyl group is suppressed by the steric hindrance of the alkyl substituent, so that Tg does not decrease. At the same time, since the alkyl substituent is bulky and low in polarity, low water absorption, low dielectric constant and low dielectric loss tangent can be realized. Therefore, the obtained cured product has a high Tg, has excellent adhesion and heat and moisture resistance, and has a low dielectric constant and a low dielectric loss tangent.

[0025]

EXAMPLES The present invention will now be described specifically with reference to specific examples, but the present invention is not limited to these examples.

Example 1 (A) As a cyanate compound containing two or more cyanato groups in a molecule, a prepolymer of 2,2-bis (4-cyanatophenyl) propane (Arocy B-30,
(B) a tert-butyl group-substituted phenol salicylaldehyde novolak epoxy resin (YL) as an epoxy resin represented by the formula (1).
-6217, trade name of Yuka Shell Epoxy Co., Ltd.),
(C) As a flame retardant, 1,2-dibromo-4- (1,2
-Dibromoethyl) cyclohexane (SAYTEX B
CL-462, trade name of Albemarle) and p-nonylphenol were dissolved in toluene in the amounts shown in Table 1,
As a curing accelerator, 0.1 part by weight of cobalt naphthenate is added to 100 parts by weight of a cyanate compound, and 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4M
Z-CN) was blended in an amount of 0.05 part by weight to prepare a resin composition varnish for printed wiring boards having a nonvolatile content of 65% by weight.

(Example 2) In Example 1, tert
A butyl-substituted phenol salicylaldehyde novolak type epoxy resin was added to a methyl group and tert-butyl group-substituted phenol salicylaldehyde novolak type epoxy resin (TMH-574, trade name, manufactured by Sumitomo Chemical Co., Ltd.) using 1,2-dibromo-4. -(1,2-dibromoethyl) cyclohexane was converted to tetrabromocyclooctane (SAYTEX BC-48, manufactured by Albemarle),
2E4MZ-CN is converted to triphenylphosphine (TPP)
A resin composition varnish for printed wiring boards was prepared in the same manner as in Example 1, except that the resin composition was dissolved in toluene in the amounts shown in Table 1 in place of the above.

(Example 3) In Example 1, 2,2-
The prepolymer of bis (4-cyanatephenyl) propane is converted to bis (3,5-dimethyl-4-cyanatephenyl)
Prepolymer of methane (Arocy M-30: trade name, manufactured by Asahi Ciba Co., Ltd.), 1,2-dibromo-4- (1,2-
Resin composition for printed wiring boards in the same manner as in Example 1 except that dibromoethyl) cyclohexane was dissolved in toluene at the compounding amount shown in Table 1 in place of hexabromocyclododecane (CD-75P, trade name of Great Lakes Co.) An article varnish was prepared.

(Example 4) In Example 2, 2,2-
The prepolymer of bis (4-cyanatephenyl) propane is converted to bis (3,5-dimethyl-4-cyanatephenyl)
Tetrabromocyclooctane as brominated triphenylcyanurate (Piroguard SR-2)
45, a trade name of Daiichi Kogyo Seiyaku Co., Ltd.) and a resin composition varnish for printed wiring boards was prepared in the same manner as in Example 1 except that the components were dissolved in toluene in the amounts shown in Table 1.

Comparative Example 1 In Example 1, tert
-A butyl-substituted phenol salicylaldehyde novolak type epoxy resin was replaced with a bisphenol A type epoxy resin (DER331L, trade name of Dow Chemical Co., Ltd.)
In addition, 1,2-dibromo-4- (1,2-dibromoethyl) cyclohexane was replaced with brominated bisphenol A type epoxy resin (ESB400T, trade name, manufactured by Sumitomo Chemical Co., Ltd.), and toluene was added at the compounding amount shown in Table 1. The resin composition varnish for printed wiring boards was prepared in the same manner as in Example 1 except that the varnish was dissolved.

Comparative Example 2 In Comparative Example 1, a bisphenol A type epoxy resin was replaced with a cresol novolak type epoxy resin (ESCN-195-3, trade name of Sumitomo Chemical Co., Ltd.) and a brominated bisphenol A type epoxy resin. A resin composition varnish for a printed wiring board was prepared in the same manner as in Comparative Example 1, except that the brominated bisphenol A (TBA) was dissolved in toluene at the compounding amount shown in Table 1.

Comparative Example 3 In Comparative Example 2, 2,2-
The prepolymer of bis (4-cyanatephenyl) propane is converted to bis (3,5-dimethyl-4-cyanatephenyl)
Comparative Example except that cresol novolak type epoxy resin was dissolved in toluene at the compounding amount shown in Table 1 instead of phenol salicylaldehyde novolak type epoxy resin (EPPN-502, trade name of Nippon Kayaku Co., Ltd.) in methane prepolymer. In the same manner as in 2, a resin composition varnish for printed wiring boards was prepared.

Comparative Example 4 Comparative Example 3 was the same as Comparative Example 3 except that the phenol salicylaldehyde novolak type epoxy resin was replaced with the brominated bisphenol A type epoxy resin in toluene at the compounding amount shown in Table 1 except for TBA. In the same manner as in No. 3, a resin composition varnish for printed wiring boards was prepared.

(Comparative Example 5) In Comparative Example 2, the cresol novolak type epoxy resin was replaced with a dicyclopentadiene type epoxy resin (EXA-7200, trade name of Dainippon Ink and Chemicals, Inc.). In the same manner as in Comparative Example 2 except that the resin composition was dissolved in toluene, a resin composition varnish for printed wiring boards was prepared.

[0035]

[Table 1]

Arocy B-30: 2,2-bis (4
-Cyanate phenyl) propane prepolymer (trade name, manufactured by Asahi Ciba Co., Ltd.) Arocy M-30: bis (3,5-dimethyl-4-)
Prepolymer of cyanate phenyl) methane (trade name, manufactured by Asahi Ciba Co., Ltd.) YL-6217: tert-butyl group-substituted phenol salicylaldehyde novolak type epoxy resin (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.) THM-574: methyl group and tert -Butyl-substituted phenol salicylaldehyde novolak type epoxy resin (trade name, manufactured by Sumitomo Chemical Co., Ltd.) DER331L: Bisphenol A type epoxy resin (trade name, manufactured by Dow Chemical Co., Ltd.) ESCN-195-3: Cresol novolak type epoxy resin (Sumitomo) EPPN-502: phenol salicylaldehyde novolak type epoxy resin (trade name, manufactured by Nippon Kayaku Co., Ltd.) EXA-7200: dicyclopentadiene type epoxy resin (Dainippon Ink & Chemicals, Inc.) Co., Ltd. trade name) SAYTEX BCL-462: 1,2- dibromo -4
-(1,2-Dibromoethyl) cyclohexane (trade name, manufactured by Albemarle) SAYTEX BC-48: Tetrabromocyclooctane (trade name, manufactured by Albemarle) CD-75P: Hexabromocyclododecane (trade name, manufactured by Great Lakes Co., Ltd.) Pyrogard SR- 245: Brominated triphenyl cyanurate (trade name, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) TBA: brominated bisphenol A ESB400T: brominated bisphenol A type epoxy resin (trade name, manufactured by Sumitomo Chemical Co., Ltd.) 2E4MZ-CN: 1- Cyanoethyl-2-ethyl-4
-Methylimidazole TPP: triphenylphosphine

The resin varnish for a printed wiring board obtained in each of the examples and comparative examples was applied to a glass cloth (E) having a thickness of 0.2 mm.
Glass was impregnated with a basis weight of 210 g / cm ² ) and heated at 140 ° C. for 10 minutes to obtain a prepreg. Next, four sheets of the obtained prepreg were laminated, copper foil having a thickness of 18 μm was laminated on both sides of the prepreg, and press-molded at 170 ° C. for 60 minutes and 2.5 MPa. A plate was made.

With respect to the obtained copper-clad laminate, dielectric properties,
Solder heat resistance, Tg, flame resistance, and copper foil peel strength were measured. Table 2 shows the results.

The test was performed as follows. 1MHz relative dielectric constant (εr) and dielectric tangent (tan)
δ): Measured according to JIS-C-6481. 1 GHz relative permittivity (εr) and dielectric tangent (tan)
δ): Measured by a triplate structure straight line resonator method. Tg: The copper foil was removed by etching and measured by TMA (thermomechanical analysis).・ Solder heat resistance: PCT is removed by etching, PCT
(Pressure cooker tester, 121 ° C, 0.22
After holding in the molten solder at 260 ° C, 20
After immersion for 2 seconds, the appearance was examined. The number of abnormalities in the table means that no measling or blistering occurs, and is the number (numerator) with respect to the number of tests (denominator). -Flame resistance: Measured according to the UL-94 vertical test method. -Copper foil peeling strength: Measured according to JIS-C-6481.

[0040]

[Table 2]

As is clear from Table 2, all of the copper-clad laminates using the resin compositions for printed wiring boards of Examples 1 to 4 have high Tg, solder heat resistance when absorbing moisture, and copper foil peeling. Good strength and low relative permittivity and dielectric loss tangent.

On the other hand, a tert-butyl group-substituted phenol salicylaldehyde novolak type epoxy resin represented by the formula (1) in Example 1 was replaced with a bisphenol A type epoxy resin and a brominated bisphenol A type epoxy resin. The copper-clad laminate of No. 1 has a lower Tg than each of the examples, is inferior in solder heat resistance at the time of moisture absorption, and has a high water absorption, relative permittivity, and dielectric loss tangent. Similarly, the copper-clad laminates of Comparative Examples 2 and 3, in which the epoxy resin was changed to a cresol novolak type epoxy resin or a phenol salicylaldehyde novolak type epoxy resin, had a high water absorption, a relative dielectric constant and a dielectric loss tangent in each example. Very high compared. Further, the copper-clad laminate of Comparative Example 4 in which the epoxy resin was changed to a brominated bisphenol A type epoxy resin had a low Tg and was inferior in solder heat resistance when absorbing moisture. The copper-clad laminate of Comparative Example 5, in which the epoxy resin was changed to a dicyclopentadiene-type epoxy resin, had low water absorption, relative dielectric constant, and dielectric loss tangent, but low Tg and copper foil peel strength.

[0043]

As described above, the resin composition for a printed wiring board of the present invention and the printed wiring board using the same have excellent adhesiveness and Tg.
Low in water absorption, excellent in heat resistance during moisture absorption, and low in relative permittivity and dielectric loss tangent. Therefore, it is suitable as a printed wiring board corresponding to a computer requiring high-speed processing, a device handling high-frequency signals, and the like.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Nozomi Takano 1500 Ogawa Oaza, Shimodate City, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd.

Claims (8)

[Claims] 1. A resin composition comprising (A) a cyanate compound having two or more cyanato groups in a molecule, (B) an epoxy resin and (C) a flame retardant as essential components, wherein (B) the epoxy resin is And a resin composition for a printed wiring board containing at least one kind of epoxy resin represented by the formula (1). Embedded image (Wherein, R ₁ represents a hydrogen atom or a lower alkyl group having 1 to 4 carbon atoms, R ₂ represents a lower alkyl group having 1 to 4 carbon atoms, and n is an integer of 1 to 7) Indicates) 2. The glycidyl group of the epoxy resin (B) is used in an amount of 0.1 to 1: 1 based on 1.0 mol of a cyanate group of a cyanate compound containing two or more cyanato groups in a molecule.
The resin composition for a printed wiring board according to claim 1, wherein 0 mol is blended and the flame retardant (C) is contained in an amount of 5 to 200 parts by weight based on 100 parts by weight of the total of (A) and (B). 3. The method according to claim 1, wherein (A) the cyanate compound containing two or more cyanato groups in the molecule contains at least one kind of the cyanate compound represented by the formula (2). A resin composition for printed wiring boards. Embedded image 4. A method according to claim 1, wherein (A) a cyanate compound having two or more cyanato groups in the molecule is 2,2-bis (4-cyanophenyl) propane, bis (3,5-dimethyl-).
4-cyanatephenyl) methane, 2,2-bis (4-
Claims 1 to 3 which contain at least one kind selected from cyanate phenyl) -1,1,1,3,3,3-hexafluoropropane and α, α'-bis (4-cyanate phenyl) -m-diisopropylbenzene. Claim 3
The resin composition for a printed wiring board according to any one of the above. 5. The flame retardant according to claim 1, wherein (C) the flame retardant is not reactive with (A) a cyanate compound having two or more cyanato groups in a molecule. 4. The resin composition for a printed wiring board according to any one of 4. 6. A flame retardant which is not reactive with a cyanate compound containing two or more cyanato groups in the molecule,
The printed wiring board according to claim 5, comprising at least one or more aliphatic cyclic flame retardants selected from 2-dibromo-4- (1,2-dibromoethyl) cyclohexane, tetrabromocyclooctane, and hexabromocyclododecane. Resin composition. 7. The flame retardant having no reactivity with the cyanate compound is at least one kind of the heterocyclic flame retardant represented by the formula (3) or the heterocyclic flame retardant represented by the formula (3). The resin composition for a printed wiring board according to any one of claims 1 to 6, wherein the resin composition is a mixture of at least one kind and a flame retardant having no reactivity with a cyanate compound. Embedded image 8. A varnish comprising the resin composition for a printed wiring board according to claim 1 and at least one or more prepregs obtained by impregnating and drying a substrate, and laminating one or both surfaces thereof. A printed wiring board obtained by laminating a metal foil on a substrate and molding by heating and pressing.