JPH1140460A - Laminate ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the thermal shock resistance by mounting metal electrodes on a ceramic laminate so as to be conductive to outer thin film electrodes made by the thin film forming. SOLUTION: A laminate ceramic capacitor is manufactured by printing an electrode pattern on a green sheet, using a Pb ceramic material, laminating and compression-welding the green sheets, cutting at specified positions into individual elements, degreasing and baking to form thin film-made outer electrodes at specified positions to form capacitor elements 3 having outer electrodes 2 having a multilayer structure composed of a Ti layer 2a, Ni-30%Cu layer 2b and Ag layer 2c laminated upwards, laying and adhering the capacitor elements 3 through an epoxy resin adhesive 6 and dipping L-shaped metal electrodes 4 coated with a solder (Sn/Pb=9/1) in a hot solder (Sn/Pb=8/92) to bond.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small-sized multilayer ceramic electronic component having improved thermal shock resistance.

[0002]

2. Description of the Related Art When an electronic component having a large heat value such as a semiconductor device is used, it may be mounted on a metal substrate such as an aluminum substrate having excellent heat dissipation. Therefore, the multilayer ceramic electronic component is often mounted on a metal substrate such as an aluminum substrate together with the semiconductor device and used.

However, there is a difference in the coefficient of thermal expansion between the metal substrate and the ceramic constituting the multilayer ceramic electronic component.
When a temperature cycle of heat-up / cooling (thermal shock cycle) occurs, there is a problem that the multilayer ceramic electronic component does not function due to cracking or chipping, and desired characteristics cannot be obtained.

In order to solve such a problem, a method has been proposed in which a metal lead terminal is attached to the multilayer ceramic electronic component so as to prevent stress from being applied, or a metal cap terminal is attached to disperse the stress. ing.

In general, when a multilayer ceramic capacitor is used for an application in which a metal substrate is used, a multilayer ceramic capacitor using a Pb-based ceramic as a dielectric, which is small, has a large capacity, and can realize high reliability. Although often suitable, the bending strength of Pb-based ceramics is as low as about 80% as compared with barium titanate-based ceramics and the like. Further, also in the case of a multilayer ceramic capacitor using a Pb-based ceramic as a dielectric, the external electrodes are usually formed by applying and baking a conductive paste to a ceramic laminate (capacitor element). During firing, large distortion occurs at the interface between the ceramic layer and the thick film electrode, and this distortion tends to progress to the destruction mode due to thermal shock when soldering the metal lead terminal or metal cap terminal to the ceramic laminate. In addition, there is a problem that a defect occurs in a thermal shock cycle.

Further, since the external electrodes (thick film electrodes) formed by a method of applying and baking a conductive paste are relatively thick and vary in thickness, a metal lead terminal or a metal cap terminal is attached. In addition, there is a problem that not only is processing difficult, but also the dimensional tolerance of the product tends to increase.

The present invention solves the above-mentioned problems, and provides a highly reliable multilayer ceramic electronic component which has a small distortion generated at the time of forming an external electrode, has excellent thermal shock cycle resistance, and has good dimensional accuracy and high reliability. The purpose is to do.

[0008]

In order to achieve the above object, a multilayer ceramic electronic component according to the present invention (claim 1) comprises:
A multilayer ceramic electronic component having a structure in which an internal electrode is provided in a ceramic laminate and an external electrode is provided on the surface of the ceramic laminate, wherein the external electrode is formed by a thin film forming method. Consisting of
A metal terminal is attached to the ceramic laminate so as to conduct with the external electrode. Since the external electrode is formed of a thin film electrode having a small film thickness, the thickness of the ceramic laminate after the external electrode is formed is not affected by variations in film thickness unlike the case where the thick film electrode is used as the external electrode. It is substantially the same as before the external electrodes are formed, and high dimensional accuracy can be secured. Therefore, it is possible to increase the size of the ceramic laminate by the thickness of the thick-film electrode as compared with the case where the thick-film electrode is used as an external electrode. Becomes possible. In addition, since the dimensional accuracy is high, by forming the metal terminal along the dimensional accuracy, the metal terminal can be brought into close contact with the external electrode and joined, and the connection reliability can be improved. Also, unlike the case where a thick film electrode is used as an external electrode, a step of baking the electrode paste is not required, and no large stress is generated at the interface between the external electrode and the ceramic layer. It is possible to prevent the ceramic laminate from being cracked or chipped when a cycle is added, thereby improving reliability. In the present invention, "a thin film electrode formed by a thin film forming method"
It means an electrode (thin film electrode) formed by various known methods such as a sputtering method, a vacuum evaporation method, an ion plating method, a CVD method, and a chemical plating method, and applies and bake a conductive paste. This is a concept distinguished from a thick-film electrode formed by such a method.

Further, the multilayer ceramic electronic component of the present invention (claim 2) is characterized in that a plurality of the ceramic laminates are stacked, and the metal terminals are joined to external electrodes of each ceramic laminate to be integrated. I have. When multiple ceramic laminates are stacked and metal terminals are joined to the external electrodes of each ceramic laminate to be integrated, the same planar area as when only one ceramic laminate is used, for example, in the case of a capacitor Can obtain a large capacitance, and the present invention can be made more effective. In the multilayer ceramic electronic component of the present invention, since the dimensional accuracy is high, the metal terminals can be tightly joined to the external electrodes and joined, and a plurality of ceramic laminates can be easily and reliably integrated in a stacked state. .

[0010] The multilayer ceramic electronic component of the present invention (claim 3) is characterized in that the metal terminal is joined to the external electrode by soldering. When the metal terminal is joined to the external electrode by soldering, the metal terminal can be securely joined to the external electrode. Therefore, sufficient connection reliability can be ensured, and the present invention can be effectively realized. Also,
When joining metal terminals to external electrodes by soldering,
Since there is no large stress at the interface between the external electrode and the ceramic layer, it is possible to suppress the occurrence of cracks and the like due to thermal shock.

[0011] In the multilayer ceramic electronic component of the present invention (claim 4), the metal terminal is disposed so as to cover at least a part of the external electrode, or is connected to the external electrode. It is an elongated metal lead terminal. In the multilayer ceramic electronic component of the present invention, the dimensional accuracy of the ceramic multilayer body is high, and the metal cap terminal and the elongated metal lead terminal can be easily and reliably brought into close contact with the external electrode and joined.
These terminals can be used without deteriorating the connection reliability, and the thermal shock resistance can be further improved.

Further, the multilayer ceramic electronic component of the present invention (claim 5) is characterized in that the ceramic constituting the ceramic laminate is a multilayer ceramic capacitor in which the ceramic is a Pb-based ceramic. By using a Pb-based ceramic having a high dielectric constant as a dielectric, for example, in the case of a capacitor, a small-sized and large-capacity multilayer ceramic electronic component can be obtained, and the present invention can be made more effective. The Pb-based ceramic that can be used in the present invention is Pb (Mg _1/3 Nb _2/3 ).
O ₃ —Pb (Zn _1/2 W _1/2 ) O ₃ —PbTiO ₃ is exemplified.

Further, by applying the present invention to a multilayer ceramic capacitor as described in claim 6, it is possible to efficiently reduce the size and the capacity of the multilayer ceramic capacitor.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and features thereof will be described in more detail. [Embodiment 1] FIG. 1 is a perspective view showing a multilayer ceramic electronic component (a multilayer ceramic capacitor in this embodiment) according to an embodiment of the present invention, and FIG. 2 (a) constitutes the multilayer ceramic capacitor of this embodiment. FIG. 2B is a perspective view showing a ceramic laminate, and FIG. 2B is a cross-sectional view showing a configuration of an external electrode.

In the multilayer ceramic capacitor of this embodiment, as shown in FIG. 2A, a plurality of internal electrodes 1 are disposed so as to face each other with a ceramic layer 5 interposed therebetween. The capacitor elements (ceramic laminate) 3 on which the external electrodes 2 are arranged so as to be electrically connected to each other are stacked in two stages, and a pair of metal terminals 4 (FIG. 1) are joined to the external electrodes 2 of each capacitor element 3. It is formed by integrating.

Next, a method for manufacturing the multilayer ceramic capacitor will be described. First, an electrode pattern is printed on a green sheet using a Pb-based ceramic material, and after laminating and pressing the green sheet, individual elements are cut out at predetermined positions. Then, degreasing and firing are performed to form an external electrode 2 formed of a thin film electrode at a predetermined position, thereby forming a capacitor element 3 as shown in FIG.
Is prepared. As shown in FIG. 2B, the external electrode 2 formed on the capacitor element 3 is composed of a Ti layer (thickness 0.1 μm) 2a and a Ni 30 layer disposed in order from the lower side to the upper side.
% Cu layer (thickness 0.5 μm) 2b, Ag layer (thickness 0.7
μm) 2c.

The Ti layer 2a constituting the external electrode 2
Each layer of the Ni 30% Cu layer 2b and the Ag layer 2c was formed by a sputtering method. The film forming conditions are as follows.

Then, the capacitor elements 3 manufactured as described above were stacked and bonded in two stages via an epoxy adhesive 6. Then, a soldered L-shaped metal terminal (thickness: 0.1 mm) of Sn / Pb = 9/1 was
By immersing and joining in a high-temperature solder of / Pb = 8/92, a multilayer ceramic capacitor (assembly) as shown in FIG. 1 was obtained.

For comparison, a conductive paste was applied,
Capacitor elements in which external electrodes are formed by applying Ni plating and Sn plating on the thick film electrodes formed by baking are stacked and bonded in two steps via an epoxy-based adhesive in the same manner as described above. With Sn / P
b = 9/1 soldered L-shaped metal terminal
A multilayer ceramic capacitor (comparative example) was produced by immersing in a high-temperature solder of / Pb = 8/92 and joining.

The dimensional accuracy and thermal shock cycle of the multilayer ceramic capacitor according to the embodiment of the present invention having the above-described thin-film electrode external electrodes and the comparative multilayer ceramic capacitor having the thick-film electrode external electrodes are described below. The sex was examined.

(1) Dimensional accuracy Multilayer ceramic capacitor 2 according to the embodiment of the present invention
The dimensions in the length direction (the direction of L in FIG. 1) were examined for 0 and 20 multilayer ceramic capacitors of the comparative example. Table 1 shows the results.

[0022]

[Table 1]

As shown in Table 1, when considering a multilayer ceramic capacitor capable of obtaining the same capacitance, the multilayer ceramic capacitor according to the embodiment of the present invention has a length dimension reduced by about 200 μm. . In addition,
When the length dimension is the same, the obtainable capacitance can be increased by about 6%.

Further, when the external electrode is a thin film electrode as in the multilayer ceramic capacitor of the present invention, the dimensional accuracy is high and the ridge is formed at the ridge as in the case of the thick film electrode.
Since (roundness) is not formed, the metal terminal can be brought into close contact with the external electrode and joined, and the connection reliability can be improved.

(2) Thermal shock cycle resistance -55 ° C (30 minutes) to 25 ° C (3 minutes) to 125 ° C (30 minutes)
The thermal shock cycle after repeating 100 cycles of the thermal shock cycle of (min) is examined. If the rate of change of capacity is 10% or more, the sample is regarded as defective (that is, the rate of change of volume is less than 10% is good). The sex was examined. Table 2 shows the results.

[0026]

[Table 2]

As shown in Table 2, in the multilayer ceramic capacitor of the comparative example, the external electrode is a thick-film electrode, and a large strain is inherent in the interface between the ceramic layer and the thick-film electrode during baking. The resistance to the thermal shock cycle was small, the initial failure was 1/20, and the failure after repeating 100 thermal shock cycles was 6/20.

On the other hand, in the case of the multilayer ceramic capacitor in which the external electrode according to the embodiment of the present invention is a thin film electrode, there is no baking step, and as in the case of the comparative example,
Since there is no such thing as a large strain inherent in the interface between the ceramic layer and the thick film electrode during baking, initial failure and
No failure was observed after 100 cycles of the thermal shock cycle.

[Embodiment 2] FIG. 3 is a perspective view showing a multilayer ceramic electronic component (a multilayer ceramic capacitor in this embodiment) according to another embodiment of the present invention. As shown in FIG.
A capacitor element (ceramic laminate) 3 in which a plurality of internal electrodes 1 are provided so as to face each other via a ceramic layer 5 and external electrodes 2 are provided at both ends so as to conduct with the internal electrodes 1. A pair of metal lead terminals 14 (FIG. 3)
Are formed by joining together.

In this multilayer ceramic capacitor, the structure, manufacturing method, and type of ceramic material of the ceramic laminate 3 are the same as those in the first embodiment.
Regarding the external electrode 2, the type of the film constituting the external electrode 2, the film forming conditions, and the like are different from those of the first embodiment. That is, in the multilayer ceramic capacitor of this embodiment, the external electrodes 2 are not particularly shown, but are composed of a Cr layer (thickness 0.5 μm), Ni
30% Cu layer (thickness 0.5 μm), Cu layer (thickness 0.7
μm).

Further, a Cr layer constituting the external electrode 2, Ni
Each of the 30% Cu layer and the Cu layer was formed by a sputtering method. The film forming conditions are as follows.

Then, the capacitor elements 3 manufactured as described above were stacked and bonded in two layers via an epoxy adhesive 6. Then, a metal lead terminal (diameter 0.5 mm) 14 of Sn / Pb = 9/1 soldered is pressed against the end face of the capacitor element 3 on which the external electrode 2 is formed with cream solder interposed therebetween, and the reflow furnace is pressed. Then, by soldering and joining, a multilayer ceramic capacitor (assembly) as shown in FIG. 3 was obtained.

For comparison, a conductive paste was applied,
A capacitor element in which external electrodes are formed by applying Ni plating and Sn plating on a thick film electrode formed by baking, and a metal lead terminal is bonded in the same manner as described above, thereby obtaining a multilayer ceramic capacitor (comparative). Example) was produced.

The dimensional accuracy and thermal shock cycle of the multilayer ceramic capacitor according to the embodiment of the present invention having the above-mentioned thin-film electrodes and the comparative example having the thick-film electrodes are described. The sex was examined.

(1) Dimensional Accuracy Multilayer ceramic capacitor 2 according to the embodiment of the present invention
The dimensions in the length direction (the direction of L in FIG. 1) were examined for 0 and 20 multilayer ceramic capacitors of the comparative example. Table 3 shows the results.

[0036]

[Table 3]

As shown in Table 3, when considering a multilayer ceramic capacitor capable of obtaining the same capacitance, the multilayer ceramic capacitor according to the embodiment of the present invention has a length dimension reduced by about 250 μm. . In addition,
When the length dimension is the same, the obtainable capacitance can be increased by about 7%.

Further, when the external electrode is a thin film electrode as in the multilayer ceramic capacitor of the present invention, the dimensional accuracy is high, and the ridge is formed at the ridge portion as in the case of the thick film electrode.
Since (roundness) is not formed, the metal lead terminal can be brought into close contact with the external electrode and joined, and the connection reliability can be improved.

(2) Thermal shock cycle resistance -55 ° C (30 minutes) to 25 ° C (3 minutes) to 125 ° C (30 minutes)
The thermal shock cycle after repeating 100 cycles of the thermal shock cycle of (min) is examined. If the rate of change of capacity is 10% or more, the sample is regarded as defective (that is, the rate of change of volume is less than 10% is good). The sex was examined. Table 4 shows the results.

[0040]

[Table 4]

As shown in Table 4, in the multilayer ceramic capacitor of the comparative example, the external electrode was a thick film electrode, and a large strain was inherent in the interface between the ceramic layer and the thick film electrode during baking. The resistance to the thermal shock cycle was low, and failure occurred after repeating 100 thermal shock cycles at a rate of 3/20.

On the other hand, in the case of the multilayer ceramic capacitor in which the external electrode according to the embodiment of the present invention is a thin film electrode, there is no baking step, and as in the case of the above comparative example,
Since there is no such thing as a large strain inherent in the interface between the ceramic layer and the thick film electrode during baking, initial failure and
No failure was observed after 100 cycles of the thermal shock cycle.

Third Embodiment FIG. 4 is a perspective view showing a multilayer ceramic electronic component (a multilayer ceramic capacitor in this embodiment) according to another embodiment of the present invention. As shown in FIG.
A capacitor element (ceramic laminate) 3 in which a plurality of internal electrodes 1 are provided so as to face each other via a ceramic layer 5 and external electrodes 2 are provided at both ends so as to conduct with the internal electrodes 1. It is formed by attaching two metal cap terminals 24 (FIG. 4) on both ends so as to be electrically connected to the external electrodes 2 of each ceramic laminate 3 while being superposed in two stages.

In this multilayer ceramic capacitor, the structure, manufacturing method, and type of ceramic material of the ceramic laminate 3 are the same as those in the first and second embodiments, but the external electrode 2 is formed. The type, thickness, film forming conditions, and the like of the film are different from those of the first and second embodiments. That is, in the multilayer ceramic capacitor of this embodiment, the external electrodes 2 are not shown in the figure, but are arranged in order from the lower layer side to the upper layer side.
It has a multilayer structure consisting of three layers: a Cr layer (0.1 μm in thickness), a 30% Cu layer (0.5 μm in thickness), and an Ag layer (0.7 μm in thickness).

Further, Ni 10% C constituting the external electrode 2
Each layer of the r layer, the Ni 30% Cu layer, and the Ag layer was formed by a sputtering method. The film forming conditions are as follows.

Then, the capacitor elements 3 produced as described above were stacked and bonded in two steps via an epoxy adhesive 6. Then, Sn / Pb = 9/1 soldered metal cap terminal (0.05 mm thick) 24
Was bonded by soldering using a reflow furnace while pressing both ends of the capacitor element 3 on which the external electrodes 2 were formed, thereby obtaining a multilayer ceramic capacitor (assembly) as shown in FIG.

For comparison, a conductive paste was applied,
A capacitor element in which external electrodes are formed by applying Ni plating and Sn plating on a thick film electrode formed by baking is manufactured, and a metal cap terminal is joined in the same manner as described above to obtain a multilayer ceramic capacitor (comparative). Example) was produced.

The dimensional accuracy and the thermal shock cycle of the multilayer ceramic capacitor according to the embodiment of the present invention having the above-mentioned thin-film electrode and the comparative example having the thick-film electrode are described. The sex was examined.

(1) Dimensional Accuracy Multilayer ceramic capacitor 2 according to the embodiment of the present invention
The dimensions in the length direction (the direction of L in FIG. 1) were examined for 0 and 20 multilayer ceramic capacitors of the comparative example. Table 5 shows the results.

[0050]

[Table 5]

As shown in Table 5, when considering a multilayer ceramic capacitor capable of obtaining the same capacitance, the multilayer ceramic capacitor according to the embodiment of the present invention has a length dimension reduced by about 100 μm. . In addition,
If the length dimension is the same, the obtainable capacitance can be increased by about 2.5%.

Further, when the external electrode is a thin film electrode as in the multilayer ceramic capacitor of the present invention, the dimensional accuracy is high and the ridge is formed at the ridge as in the case of the thick film electrode.
Since (roundness) is not formed, the metal cap terminal can be brought into close contact with the external electrode and joined, and the connection reliability can be improved.

(2) Thermal shock cycle resistance: -55 ° C (30 minutes) to 25 ° C (3 minutes) to 125 ° C (30 minutes)
The thermal shock cycle after repeating 100 cycles of the thermal shock cycle of (min) is examined. If the rate of change of capacity is 10% or more, the sample is regarded as defective (that is, the rate of change of volume is less than 10% is good). The sex was examined. Table 6 shows the results.

[0054]

[Table 6]

As shown in Table 6, in the multilayer ceramic capacitor of the comparative example, the external electrode was a thick film electrode, and a large strain was inherent in the interface between the ceramic layer and the thick film electrode during baking. The resistance to impact cycles was low, and failures occurred after repeating 100 thermal shock cycles at a rate of 2/20.

On the other hand, in the case of the multilayer ceramic capacitor according to the embodiment of the present invention in which the external electrode is a thin film electrode formed by a sputtering method or the like, there is no baking step, and as in the comparative example, Since no large strain was present at the interface between the ceramic layer and the thick-film electrode during baking, neither initial failure nor failure after 100 cycles of thermal shock cycle was observed.

In the above embodiment, the metal terminals are soldered to the external electrodes of the ceramic laminate,
Although a case has been described where both are electrically and mechanically connected, a conductive resin (adhesive) may be used instead of using solder. In this case, it is possible to eliminate a solder immersion step or the like required when soldering the metal terminal and the external electrode, and it is possible to suppress the occurrence of thermal stress inside.

In the above embodiment, the case where the external electrode has a multilayer structure composed of three layers has been described as an example. However, there is no particular restriction on the number of layers or the specific shape of the external electrode. It is possible to have a multilayer structure of less than three layers or four or more layers, and in some cases, a single layer structure. There are no particular restrictions on the constituent materials of the external electrodes, and various electrode materials can be selected in consideration of the application and the like.

Further, in the above embodiment, the case where each layer constituting the external electrode is formed by the sputtering method has been described. However, the method of forming each layer is not limited to this, but may be a vapor deposition method, an ion plating method, or the like. , CVD method,
Various plating methods, such as a chemical plating method, can be used.

In the above embodiment, the case where two ceramic laminates (capacitor elements) are stacked has been described. However, the number of stacked ceramic laminates is not limited.
Two or more can be stacked, and in some cases, only one can be stacked.

In other respects, the present invention is not limited to the above-described embodiment. The constituent materials and specific shapes of the metal terminals, the shapes of the ceramic laminates, and the types of ceramics (piezoelectric, Magnetic material, LC complex,
With respect to the insulator, etc., various applications and modifications can be made within the scope of the invention.

[0062]

As described above, in the multilayer ceramic electronic component of the present invention, since the external electrode is formed of a thin film electrode having a small thickness, the film thickness varies as in the case where the thick film electrode is used as the external electrode. And the dimensions after the formation of the external electrodes are substantially the same as those of the ceramic laminate before the formation of the external electrodes, and high dimensional accuracy can be secured. Therefore, as compared with the case where the thick film electrode is used as the external electrode, it is possible to increase the dimension of the ceramic laminate by the thickness of the thick film electrode. For example, in the case of a capacitor, the obtainable capacitance is increased. It becomes possible to do.
In addition, since the dimensional accuracy is high, by forming the metal terminal along the dimensional accuracy, the metal terminal can be brought into close contact with the external electrode and joined, and the connection reliability can be improved. Further, unlike the case where a thick film electrode is used as an external electrode, a baking process of the electrode paste is not required, and no large stress is generated at an interface between the external electrode and the ceramic layer. It is possible to prevent the ceramic laminate from being cracked or chipped when a cycle is added, thereby improving reliability.

In the case where a plurality of ceramic laminates are stacked and metal terminals are bonded to external electrodes of each ceramic laminate to be integrated, for example, in the case of a capacitor, only one ceramic laminate is used. With the same plane area as above, it is possible to obtain a large capacitance for a plurality of ceramic laminates, and the present invention can be made more effective. Further, since the dimensional accuracy is high, the metal terminals can be brought into close contact with and bonded to the external electrodes, and the plurality of ceramic laminates can be easily and reliably integrated in a stacked state.

In the case where the metal terminal is joined to the external electrode by soldering, the metal terminal can be securely joined to the external electrode, so that sufficient connection reliability can be ensured and the present invention can be made effective. it can. In addition, even when the metal terminal is joined to the external electrode by soldering, since no large stress is present at the interface between the external electrode and the ceramic layer, it is possible to prevent cracks or the like due to thermal shock.

In the multilayer ceramic electronic component of the present invention, the metal terminal may be a metal cap terminal or
Elongated and flexible metal lead terminals can be used, and by using these terminals, it is possible to efficiently prevent thermal shock from being applied to the ceramic laminate and improve reliability. In addition, the dimensional accuracy of the ceramic laminate is high, and the metal cap terminal and the elongated metal lead terminal can be easily and surely brought into close contact with the external electrode and joined, so that the connection reliability is not impaired.

When a Pb-based ceramic having a high dielectric constant is used, for example, in the case of a capacitor, it is possible to realize a small size and large capacity, and the present invention can be made effective. According to the present invention, since the thin-film electrode is used as the external electrode as described above, unlike a conventional thick-film electrode as the external electrode, it is possible to prevent internal strain from occurring and to prevent heat shock. Since the cycleability can be improved, it is possible to use a Pb-based ceramic, which is said to have a low bending strength, without any particular problem. Further, by applying the present invention to a multilayer ceramic capacitor, it is possible to efficiently reduce the size and capacity of the multilayer ceramic capacitor.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a multilayer ceramic electronic component according to an embodiment of the present invention.

FIG. 2A is a perspective view showing a ceramic laminate constituting a multilayer ceramic electronic component according to an embodiment of the present invention in a partially cut-out state, and FIG. 2B is a cross-sectional view showing a configuration of an external electrode. It is.

FIG. 3 is a perspective view showing a multilayer ceramic electronic component according to another embodiment of the present invention.

FIG. 4 is a perspective view showing a multilayer ceramic electronic component according to still another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Internal electrode 2 External electrode 2a Ti layer 2b Ni30% Cu layer 2c Ag layer 3 Capacitor element (ceramic laminated body) 4 Metal terminal 5 Ceramic layer 6 Epoxy adhesive 14 Metal lead terminal 24 Metal cap terminal

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hideki Nakayama 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto, Japan Murata Manufacturing Co., Ltd.

Claims (6)

[Claims] 1. A multilayer ceramic electronic component having a structure in which an internal electrode is provided in a ceramic laminate and an external electrode is provided on the surface of the ceramic laminate, wherein the external electrode is formed by a thin film forming method. A multilayer ceramic electronic component comprising a formed thin film electrode and a metal terminal attached to the ceramic laminate so as to be electrically connected to the external electrode. 2. The method according to claim 1, wherein a plurality of the ceramic laminates are stacked,
2. The multilayer ceramic electronic component according to claim 1, wherein said metal terminals are joined to and integrated with external electrodes of each ceramic laminate. 3. The multilayer ceramic electronic component according to claim 1, wherein said metal terminal is joined to said external electrode by soldering. 4. A metal cap terminal disposed so as to cover at least a part of the external electrode, or an elongated metal lead terminal connected to the external electrode. 4. The multilayer ceramic electronic component according to any one of items 1 to 3. 5. The multilayer ceramic electronic component according to claim 1, wherein the ceramic constituting said ceramic laminate is a Pb-based ceramic. 6. The multilayer ceramic electronic component according to claim 1, wherein said multilayer ceramic electronic component is a multilayer ceramic capacitor.