JPH11297581A - Method and device for manufacturing multilayer electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a multilayer electronic component by which there is no problem of constriction of a base sheet, due to heating for drying a conductive paste in a step for forming the conductive paste into the base sheet and there is no problem of displacement at the time of lamination in a step for layering multiple base sheets, in which inner electrodes are formed. SOLUTION: When a conductive paste 2 is applied on a base sheet 1 by printing, the conductive paste 2 is not directly applied by printing on the base sheet 1 but instead on the surface of a metal plate 21 different from the base sheet. After drying the conductive paste 2, it is transferred to the base sheet 1, and at the same time, the metal plate 21, a male mold is housed in a cavity 32 of a layering tool 30 which is a female mold, and the step is repeated for several times to laminate multiple base sheets in which dried conductive layers are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming an internal electrode on a base sheet by a transfer method, and laminating the internal electrodes in a predetermined positional relationship with high accuracy to form a laminate, and cutting and firing the laminate. Later, the present invention relates to a method of manufacturing a multilayer electronic component formed with external electrodes.

[0002]

2. Description of the Related Art In a manufacturing process of a laminated electronic component, a conductive paste is printed on a thin base sheet to form internal electrodes, and the base sheet on which the internal electrodes are formed is cut into a predetermined size. 2. Description of the Related Art A large number of sheets are laminated with the positions of electrodes aligned. However, since the base sheet is easy to cut and has no elasticity, wrinkles are generated in the base sheet, and there are various problems such as poor alignment accuracy of the internal electrodes during lamination. Various methods have been proposed. For example, a base sheet is temporarily attached to a carrier film, a positioning hole is opened in the base sheet, a positioning pin is provided in a transport head, and the subsequent transport, printing, lamination, and other steps are performed in the positioning hole. A method has been proposed in which a positioning pin is provided in an apparatus used in each of the above-mentioned steps, using a positioning pin, and a positioning pin is provided for receiving a positioning hole, and lamination and lamination are performed at an accurate position (for example, Japanese Patent Application Laid-Open No. HEI 5-82859). In addition, various methods have been proposed for accurately adjusting the positions of the internal electrodes in the lamination.

[0003] As a conventional method of manufacturing a multilayer electronic component, for example, in the case of a ceramic capacitor, a base sheet (green sheet) is placed on a support, and a predetermined plate is used to form a conductive sheet on the base sheet. The conductive paste is printed with a first pattern and dried to form an internal electrode (the printing and drying of a conductive paste to form an internal electrode is the same hereinafter), and further, a base sheet is laminated thereon, and again The conductive paste is printed by a second pattern shifted from the pattern, the next print pattern is printed by the same plate as the first pattern, then printed by the second pattern, and the printing is performed. The operation was repeated to form a laminate by laminating a large number of base sheets, and then the laminate was punched into a predetermined area so that the internal electrodes were exposed at the ends. And baking, was prepared a ceramic capacitor by providing an external electrode on the cross section. Alternatively, printing a conductive paste on a support, applying and drying a ceramic slurry thereon by a doctor blade method or the like to form a base sheet, and peeling the formed base sheet from the support. A method of transferring a conductive layer of the conductive paste to the base sheet. Then, the base sheet is peeled off from the support and cut into a predetermined size at the same time, stored in a laminated frame, and then cut by a predetermined size to a predetermined size. There is a method in which the laminate is housed as an eye layer to form a predetermined number of laminates.

[0004]

In the laminating method according to this method, a trimming mark for registering the trimming at the time of printing is provided, and the trimming mark is detected by a registering device, and the conductive mark on the base sheet is detected. Punching was performed by synchronizing the position of the layer pattern with the position of the punching die,
Although a high degree of accuracy was required in registering the register, the problem of misalignment of the conductive layer pattern still occurred. However, in the above-described method, in the step of laminating a large number of base sheets, printing, that is, a displacement of the formation position of the internal electrode may occur, and the function of the final product may be deteriorated. Further, in the method using the carrier film, the cost is increased because the material is consumed excessively. Therefore, an object of the present invention is to provide a method of forming a conductive sheet on a base sheet without causing a problem due to shrinkage of the base sheet due to heating for drying the paste, and forming a plurality of base sheets on which internal electrodes are formed. It is an object of the present invention to provide a manufacturing method and a manufacturing apparatus which are free from a shift due to the lamination in the step of laminating.

[0005]

Means for Solving the Problems An internal electrode is formed by printing and drying a conductive paste on a base sheet that becomes a ceramic by firing, a large number of base sheets on which the internal electrode is formed are laminated, and after pressing, After cutting and firing this,
In the manufacturing method of the multilayer electronic component forming the external electrodes, a conductive paste is printed by a first plate pattern on a metal plate surface different from the base sheet, a solvent and the like are removed by heating to form a dry conductive layer, The metal disc is transferred to the base of the transfer jig, fixed in place, and a lamination jig having a female cavity capable of punching out the metal disc as a male mold and a dry conductive layer are formed. Between the metal plate
Supplying a base sheet, transferring the dry conductive layer to the base sheet by contacting and pressing the metal board against the base sheet, and simultaneously storing the metal board while extracting the base sheet into the lamination jig cavity. , This as the first layer,
Next, the first plate pattern, the pattern shape and arrangement were the same, and in a state printed on a metal plate, the first plate pattern and the first plate pattern were imposed in a state shifted to an electrode forming side in the case of a final product. According to the second plate pattern, a conductive paste is printed on a metal plate, and a solvent or the like is removed by heating to form a dry conductive layer. As described above, the dry conductive layer formed by the second plate pattern is used as a base. At the same time as the transfer to the sheet, the jig for lamination is housed while being extracted and stored in the cavity.
Layer, and printing, drying, transfer, and punching are performed in the same manner as described above using the first plate pattern.
Layers, and then again printed in the second plate pattern in the same manner, laminated in the cavity as the fourth layer, and similarly printed in the first plate pattern and the second plate pattern. A method of manufacturing a laminated electronic component and a base sheet supply means for alternately laminating a base sheet in a cavity of a lamination jig to form a laminate, a metal plate different from the base sheet, and a metal plate on the metal plate Printing means for printing a conductive paste on the metal plate, fixing the metal plate at a predetermined position, transferring a conductive layer provided on the metal plate to a base sheet, and using a stacking jig and the metal plate to form a base sheet. Transfer means for punching a predetermined size, and a stacking means for stacking the punched base sheet by performing the punching together with the transfer means, the printing means, the printing means, A printing device comprising a paste supply unit and a plate for printing on the metal plate in a predetermined pattern, wherein the drying unit and the transfer unit are transfer devices each including a metal plate and a transfer jig base. Yes, the metal disk has an outer edge that can be inserted into the cavity of the lamination jig,
The transfer jig base has a function of fixing the metal disk at a predetermined position, and an apparatus that can be moved up and down so that the metal disk can be inserted into the cavity of the stacking jig. The stacking jig and the transfer device are provided with a structure capable of punching, and the cavity receiving portion of the stacking jig is provided with a stackable electronic component which can be moved up and down by the number of sheets to be punched and stacked. A manufacturing apparatus, further comprising, for the lamination jig, incorporating at least two units of the printing apparatus, and incorporating a heating / cooling apparatus in the metal disk or the transfer jig base. Including.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The multilayer electronic component according to the present invention is particularly a multilayer ceramic electronic component, and specifically includes a multilayer ceramic capacitor, a multilayer ceramic substrate,
It is a laminated varistor, a laminated piezoelectric element and the like, and a method of manufacturing the same and a manufacturing apparatus thereof will be described in detail with reference to the drawings and the like. FIG. 1 is a conceptual diagram illustrating a method for transferring a conductive layer to a base sheet and a method for stacking the base sheet on which the conductive layer has been transferred in the method for manufacturing a laminated electronic component of the present invention. FIG.
FIG. 3 is a diagram for explaining formation of a conductive layer (internal electrode) in the production of the multilayer electronic component of the present invention, which is a pattern A at the time of printing, and FIG. 3 is also a pattern B at the time of printing. FIG.
Is an explanatory diagram for comparing positions of the pattern A and the pattern B, and shows a state where each row is on the same plane (F).
And the position (b) for stacking and cutting. FIG. 5 is a conceptual cross-sectional view showing the positional relationship of the conductive layers of a laminated electronic component formed by laminating base sheets each having a conductive layer formed thereon. FIG.
1 shows a laminated electronic component provided with a partially notched portion according to an embodiment of the present invention. FIG. 7 is a conceptual perspective view showing (a) an example of a transfer jig, a stacking jig, and a metal plate as an apparatus for manufacturing a multilayer electronic component of the present invention. FIG. 8 is a flowchart showing an example of a combination of apparatuses in the case of manufacturing a laminate of a multilayer electronic component.

[0007] As shown in FIG. 1, the outline of the method for manufacturing a laminated electronic component according to the present invention is as follows. When a conductive paste 2 is printed on a base sheet 1, it is not printed directly on the base sheet 1. 1 is printed on the surface of a metal plate 21 different from 1 and the conductive paste 2 is dried and then transferred to the base sheet 1, and at the same time, the metal plate 21 is made a male type and a laminating jig corresponding to a female type. By repeating the process of storing the base sheet 30 in the cavity 32 a plurality of times, a large number of base sheets provided with the dry conductive layer are stacked.

The base sheet used in the multilayer electronic component according to the present invention is composed of a ceramic slurry obtained by mixing an organic solvent and a binder with SrTiO ₃ , which is a main component of a dielectric, and a powder comprising a semiconducting substance and an oxidation promoter. Create A sheet obtained by forming a film of the slurry using a doctor blade method or a calender method and drying and removing the organic solvent. The base sheet may be formed by performing a stretching process simultaneously with the formation of the sheet or after the formation of the sheet. The base sheet used in the present invention is not limited to the above-described components, and may be any one that can be turned into ceramics by firing, and has a strength that can be stably supplied to the lower part of the lamination jig by the base sheet supply device. At this time, any material that does not generate wrinkles may be used.

The printing in the method for manufacturing a laminated electronic component according to the present invention will be described. The internal electrodes in the multilayer electronic component are formed by printing a conductive paste as ink in general printing, forming a pattern, and firing in a later step. The conductive paste is a paste containing fine metal powder such as palladium, and is printed on another printing object different from the base sheet, in the present invention, on a metal plate in a printing apparatus. As the conductive fine particles dispersed in the conductive paste used to form the internal electrode in the present invention, noble metal particles, and their alloy particles, oxides such as CuO, NiO, which can easily become a metal under a reducing atmosphere, ITO, SnO ₂
And the like.

The printing medium of the present invention is a metal plate 21 fixed at a predetermined position on the base 22 of the transfer jig, as will be described later. The fixing method is not particularly limited. As shown in FIG. 4, the metal plate 21 is fixed by providing a concave portion 23 on the upper surface of the base 22 and fitting the metal plate 21 into the concave portion 23. In order to take out the metal plate 21 from the concave portion 23, the bottom plate is raised to the base upper surface by using a mechanism capable of raising the bottom plate of the concave portion 23. May be transferred onto the transfer table. In the present invention, the metal plate 2
One outer circumference F has a particularly important meaning. First, in the manufacture of a multilayer electronic component, first, a printed sheet of a conductive paste is formed into a laminate with the size of a base sheet on which multiple patterns are provided, and the size at the time of lamination is formed by the outer periphery F of the metal plate. Is done. Therefore, if the position of the pattern to be printed on the metal plate is fixed at the time of printing of the printing plate 11 and the metal plate 21, it is possible to form a pattern with high accuracy and to stack with high accuracy. .

The printing format used in the present invention is not limited to the type of printing, and the conductive paste 2
The predetermined amount may be a system that can be transferred onto a printing medium, in the present invention, the metal plate. Examples of the printing method include letterpress printing, planographic printing, gravure printing, flexographic printing, screen printing, and printing by an inkjet method. Screen printing can be suitably used.

The printing medium in the present invention is a metal disk as described above. The ink (conductive paste) is transferred onto the surface of the metal disk by printing using a printing plate selected from the above-described printing format, and dried on the metal disk. The layer obtained by drying the conductive paste as described above is hereinafter referred to as a conductive layer.

A drying device for drying the printed conductive paste can be radiated with hot air or far infrared rays from the outside. Further, a heater may be built in the metal plate, and drying may be performed by heat from the inside of the metal plate. In this case, in order to prevent overheating of the metal plate, the metal plate has a cooling function for cooling water. It is desirable to provide piping and the like.

The transfer jig on which the metal disk is mounted can be moved from the mounting position of the printing apparatus to a position of a laminating jig described later. When the transfer jig moves to the position of the laminating jig,
Either a built-in elevating device that allows the metal plate to be moved in the vertical direction, or when the transfer jig is moved to the position of the stacking jig, the metal plate can be moved in the vertical direction. Connected to the lifting device.

On the other hand, the laminating jig of the present invention is desirably installed at a fixed position, and the transfer jig having the metal plate mounted thereon can be moved below the laminating jig. At this time, a base sheet is supplied between the lower part of the stacking jig and the upper metal plate of the transfer jig. The supplied base sheet may be in the form of a cut sheet, but it is preferable that the base sheet be fed out from the wound base sheet and supplied between the two jigs. A known method can be used to supply the base sheet.

After the metal plate on which the conductive layer is formed is moved to the lower part of the laminating jig and fixed, the elevating device mounted on the transfer jig or the elevating device connected at the lower part of the laminating jig is used. The moving device raises the metal plate and the connected portion in the direction of the stacking jig, the conductive layer on the metal plate comes into contact with the base sheet, and is transferred to the base sheet 1 by the raising and lowering device. . The cavity 32 of the laminating jig 30 has an inner edge having the same shape as the outer edge F of the metal plate 21, and the metal plate 21 can be inserted thereinto, whereby the base sheet 1 is punched into the inner edge shape of the cavity 32. Structure. Further, as the base sheets 1 on which the conductive layers 2 are formed are punched one after another and stacked, a lifting / lowering device 34 that allows the sheet receiving portion plate 33 in the cavity 32 to slide upward is mounted. That is, the stacking jig 30 includes the frame 31 forming the cavity 32 and the sheet receiving portion plate 33 that can move up and down in accordance with the stacking of the sheets.

Next, a method for manufacturing a multilayer electronic component using the above-described apparatus for manufacturing a multilayer electronic component of the present invention will be described in detail. As a multilayer electronic component S, the laminated shape of a dielectric and an internal electrode in a typical multilayer ceramic capacitor is such that an internal electrode 4 is formed between each layer of the dielectric 5, as shown in FIG. 4 generally corresponds to FIG.
(A) When a conductive pattern is printed as ink using a plate having a square pattern as shown in FIG. As described above, the upper and lower internal electrodes are shifted in position, and one of the cut cross sections is exposed every other internal electrode, and the other cross section is a cross section in which the internal electrodes are exposed at a position inverted from the above.
That is, positive and negative external electrodes are formed as shown in FIG. 3, and a detailed method for forming the internal electrodes and external electrodes in the present invention will be described later.

In the printing according to the present invention, preferably, at least two plate patterns are prepared. At this time, the shape and size of each square are the same, and the printing medium, that is, the outer edge F of the metal disk 21 is
As shown in (b), the patterns are imposed by setting a shift at a constant interval. By providing the displacement, the positive and negative electrodes as described above can be formed on the final component. That is,
By cutting at the position shown in FIG. 3, an exposed layer of the conductive layer is formed on the cut surface for each layer.
The position of the conductive layer exposed in the cross section is reversed at both ends, that is, the conductive layer is not exposed on the opposite side of the layer where the conductive layer is exposed at one end. Instead of using two plate patterns, printing may be performed by setting the positions of the plate and the printing medium while shifting them by a predetermined amount.
By performing the shifting once, a base sheet having a conductive layer pattern that is alternately shifted as in the case of using the two plate patterns is stacked.

In manufacturing, first, using the pattern A of the printing apparatus 10, the conductive paste 2 is transferred onto a metal plate 21 as shown in FIG. After being moved to the lower part of the stacking jig 30 and fixed to a predetermined position of the transfer jig 20, the metal plate 21 is raised by an elevating device, and the stacking jig 30 is transferred to the transfer jig 30. The conductive layer 2 is transferred to the base sheet 1 supplied between the jig 2O. At this time, the sheet receiving plate 33 in the cavity 32 of the stacking jig 30 is
And the transfer jig 20 receives the pressure rise above the transfer jig 20 to ensure the transfer. Further, as the metal plate 21 is raised, the base sheet 1 is punched into an inner edge shape of the cavity 32 and is stored in the cavity 32. Next, another unit of the printing apparatus 10 of the present invention includes a pattern 11B.
The conductive paste is transferred to the upper surface of the metal plate of another transfer jig by the pattern B, and the conductive paste is dried to form a conductive layer. After moving the jig, the metal plate 21 is lifted by a transfer jig elevating device, and the conductive layer 2 is applied to the base sheet 1 supplied between the stacking jig 30 and the transfer jig 20. Transcribe. Simultaneously with the transfer, the base sheet 1 is punched into the shape of the inner edge of the cavity 32 of the laminating jig 30 and
2 and stacked on the first base sheet. Next, the conductive paste 2 printed according to the pattern A is transferred to the base sheet 1 by the same procedure as described above.
The conductive paste 2 punched, laminated and then printed according to the pattern B is applied to the base sheet 1 in the same procedure as described above.
Then, the fourth layer is laminated by transferring, punching, and laminating. Hereinafter, similarly, the conductive layer 2 of the pattern A and the pattern B is transferred to the base sheet and laminated in the cavity 32.

Although a predetermined number of laminated bodies can be formed by such lamination, the sheet receiving plate 33 in the cavity 32 of the laminating jig 30 slides upward as the number of laminated layers increases. I will do it. As described above, since the conductive layer pattern is formed on the surface of the metal plate 21 in the laminate obtained by the production method of the present invention, the laminate is transferred to the base sheet 1 without shrinkage, wrinkles, and the like of the printing medium. It is punched at the same time. As a result, there is no shrinkage due to drying of the base sheet 1 and there is no positional displacement of the pattern and the base sheets 1 are laminated in an accurate positional relationship. The deviation in the lamination of the square pattern, which is required to have an accuracy of about ± 50 μm, can be manufactured within the accuracy by the lamination method according to the present invention. As is clear from the above description, according to the present invention, the positioning mark for lamination, which has been conventionally provided, is not required.

The laminate obtained by the manufacturing method according to the present invention as described above is taken out of the cavity 32 of the laminating jig 30 and laminated by heating and pressing to fix each layer. Next, the laminated body is cut to the size of the final laminated electronic component, thereby exposing the positive and negative electrodes on both cross sections. In this cutting, a cutting mark is provided on a printing plate for printing a conductive paste, and cutting is performed using the mark. The cutting mark is provided at a fixed position with respect to the outer periphery F of the metal plate for both the pattern A and the pattern B. The cutting marks provided in each of FIGS. 2A and 2B always coincide with a fixed position in the laminated body obtained by the laminating method of the present invention regardless of the number of laminated layers. Then, the laminate is cut, and the positive and negative electrodes of the multilayer electronic component are formed as follows. To explain the positional relationship between the pattern A and the pattern B of the base sheet was punched laminated, expressed in the same plane is as F in FIG. 2 (c), in the case of cutting at the position of 3x ₁ ~3x ₆ G schematically shows the cross section. For example, the cut mark 3x ₁
And 3 × ₂ , the exposed surface of the conductive layer 2 at the end face becomes one by one with the dielectric 5 interposed therebetween. By forming positive and negative external electrodes 6 at both ends of the cut, the laminated electronic component S It can be. A known method can be used for forming the external electrodes in the production of the multilayer electronic component according to the present invention.

Next, an apparatus for manufacturing a multilayer electronic component according to the present invention will be described. In the production of the laminated electronic component of the present invention, the apparatus up to the production of the laminate is composed of a printing device, a transfer jig, a base sheet supply device, and a lamination jig. It is composed of a crimping machine for crimping and laminating the body, a cutting device, a sintering device or an external electrode mounting device. In the present invention, an apparatus up to the production of the laminate will be described.

The printing apparatus comprises a supply unit 12 for supplying a conductive paste (ink) and a printing plate 11. As described above, the printing is performed on the surface of the metal plate different from the base sheet 1, but a positioning portion for fixing the metal plate 21 as a printing target at a predetermined position is provided. The positioning portion can be formed by a well-known technique such as providing a projection for fixing on a metal plate receiving base.

As shown in FIG. 4, a transfer jig 20 used for manufacturing a laminated electronic component according to the present invention has
In a state where the metal plate 21 is fixed to the predetermined position 23 of the second, the jig for lamination and the die set function are provided.
However, not shown in the figure,
The two jigs, the jig, the post, the guide bush, and the like can be assembled between the stacking jig and the base of the transfer jig by a known technique. The metal plate 21 is fixed to the base 22 of the transfer jig by, for example, as shown in FIG.
3 and the metal plate 21 is fitted into the recess 23. In order to attach / detach the metal plate 21 to / from the recess 23, the bottom of the recess 23 provided on the base 22 is moved up and down to form the recess 22,
Alternatively, when the bottom is raised, the concave portion disappears and the surface becomes flat. That is, the metal plate 21 can be moved by the pusher or the like in the planar state. Further, as shown in FIG. 4, the metal plate 21 has a structure capable of reciprocating on a transfer table 24 between the printing apparatus 10 and the transfer jig 20.

In the printing apparatus, the conductive paste 2
Is printed on the upper surface of the metal plate, and in a transfer or transfer step in which the transfer jig is transferred from the printing unit to the position of the stacking jig or in a state where the transfer jig is fixed at the position of the stacking jig,
The conductive paste layer 2 is dried to form a dry conductive layer. To this end, a drying device is provided in the transfer or transport step, or a heating device is assembled on the metal plate 21. Further, a cooling device may be provided so that the metal plate 21 is not overheated, or a coolant guide tube such as cooling water may be built in the metal plate 21.

Next, the laminating jig 30 used for manufacturing the laminated electronic component according to the present invention will be described in detail. As described above, the stacking jig 30 includes the transfer jig 22.
The base 22 is connected to the base 22 by a post or the like so as to be movable in the pulling direction so as to have a die setting function with the metal plate 21 mounted on the base. The lamination jig 30
A cavity for laminating and storing the punched base sheet, a frame 31 forming the cavity 32, and a sheet receiving portion plate 33 which ascends the base sheets laminated in the cavity 32 according to the number of laminations. Become.
The stacking jig 30 is desirably connected to the transfer jig 20 in a die set state, and is installed in a state fixed to the floor.

In the present invention, as shown in FIG. 4, the base sheet 1 is desirably unwound from the supply device 40 without using a carrier film or a support, etc. Supply. By raising the transfer jig 20 onto the base sheet surface, the dry conductive layer 2 formed on the metal plate 21 is transferred onto the base sheet 1 surface, and further, the transfer jig 20 is raised and stacked. Die-set punching is performed by the jig 30, and the remaining base sheet that has been punched is wound up in a roll shape by the remaining base sheet winding device 41.

In the present invention, the laminating jig 30 and the transferring jig 20 are connected to the transferring jig 20 in order to punch the die set as described above. The transfer table 24 of the metal plate 21 is placed between the printing apparatus 10 and the transfer jig 20. The arrangement of the manufacturing apparatus up to manufacturing the multilayer body of the multilayer electronic component S is as shown in FIG. 6 with respect to the connecting apparatus between the stacking jig 30 and the transfer jig 20 as a die set apparatus.
As shown in (a), a printing device (A) for printing pattern A and a printing device (B) for printing pattern B are installed on both sides, and a metal plate 21 on which both patterns are printed is transferred to a transfer jig 20. Are alternately conveyed to the base 22, and then, the transfer and the punching are performed and the laminate is formed. As described above, in order to stack the base sheets provided with the pattern A and the pattern B, a method in which two printing apparatuses are alternately used for at least one stacking jig as an interlocked set is used. It is desirable to do. In order to expose the positive and negative electrode ends at both ends in the formation of the end electrode of the laminated electronic component which is the final product, the internal electrodes are formed by two plate patterns in printing, and the lamination is performed at a predetermined position. By cutting the body, the positive and negative internal electrodes are exposed at both ends of the cut laminate. Further, in order to further improve the production efficiency, as shown in FIG. 6B, many metal disks 21 are mounted on a lube-shaped transfer table, and a large number of printing apparatuses are combined as a combination of the pattern A and the pattern B. It is also possible to prepare and improve the printing ability. In FIG. 6B, two printing devices are provided, but more combination printing devices may be added.

The laminated body laminated in the cavity of the laminating jig is taken out, and a base sheet on which a conductive layer is not printed is laminated on the upper and lower surfaces of the laminated body, and the laminated pressure bonding machine is used at 150 to 170 ° C. and 10 to 50 kg. / cm ² , for 3 to 5 minutes,
By heating and pressing, the binder component in the base sheet is baked and removed. The thickness of the resulting dielectric layer is about 1/2 to 1/5 of the thickness of the base sheet before firing.

The cutting is performed when printing the conductive paste.
As shown in FIG. 2, the finishing cut mark 3x is provided at a predetermined position.
By forming 3y and cutting with reference to this mark, it is possible to obtain a multilayer ceramic laminate before forming external electrodes with internal electrodes exposed at both ends.

The binder between the base sheet and the conductive layer disappears, and the space between the base sheets is compressed by pressurization, so that voids between the sheets that cause delamination are eliminated.

An external electrode is formed at the end of the chip-shaped laminate cut into a predetermined size obtained as described above. For example, a method of forming the external electrode is to form a base metal external electrode and perform reduction firing. After that, a method such as forming a silver external battery may be used.

[0033]

EXAMPLES Under the following conditions, a multilayer electronic component of the present invention, specifically, a ceramic capacitor was prepared, and its effect was confirmed. <Preparation conditions> Base sheet: A ceramic slurry containing 15% by weight of butyral resin was formed into a sheet (the main component of the dielectric was Sr
TiO ₃ , powders composed of semiconducting substances and oxidation promoters, and organic solvents). Base sheet thickness: 40 μm Conductive fine particles dispersed in conductive paste: Ag-Pd, etc. Layer thickness of dry conductive layer: 3 μm Number of plate pattern surfaces: 25 × 40 Number of layers: 100 sheets Crimping conditions for lamination: 40 kg / m ² final bonding conditions: 2,000 Kg / m ² baking conditions: 1100 ° C. 2 hours external electrode formation conditions: the silver paste and baked at 700 ° C. <evaluation method> laminate after firing created under the above conditions, the final ceramic capacitor The displacement in the direction of forming the internal electrodes and the displacement in the width direction were measured (measurement: 100 sample points were measured in each case). <Displacement due to lamination> The displacement due to the lamination of the internal electrode ends in the laminated body after firing prepared under the above conditions has a deviation of 20 to 25 μm in the electrode forming direction and a deviation of 23 to 32 μm in the width direction.
However, there was no defect due to misalignment due to lamination.

[0034]

According to the method for manufacturing a laminated electronic component of the present invention, in the step of forming a conductive paste on a base sheet, the problem due to shrinkage of the base sheet due to heating for drying the paste is eliminated. Even in the step of laminating a plurality of base sheets on which the electrodes are formed, a lamination method free from occurrence of displacement due to lamination could be obtained.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram illustrating a method of transferring a conductive layer to a base sheet and a method of laminating a base sheet to which the conductive layer has been transferred in the method of manufacturing a laminated electronic component of the present invention.

FIG. 2 is a view for explaining formation of a conductive layer (internal electrode) in the production of a multilayer electronic component according to the present invention;

FIG. 3 is also a pattern B at the time of printing

FIG. 4 is an explanatory diagram for comparing positions of a pattern A and a pattern B, and shows a state (F) in which each row is on the same surface, and a position (b) where lamination and cutting are performed.

FIG. 5 is a conceptual sectional view showing a positional relationship of conductive layers of a laminated electronic component formed by laminating base sheets each having a conductive layer formed thereon.

FIG. 6 shows a laminated electronic component provided with a partially cutout portion according to an embodiment of the present invention.

FIG. 7 shows an apparatus for manufacturing a multilayer electronic component according to the present invention.
(A) Conceptual perspective view showing examples of a transfer jig, a lamination jig, and a metal disk

FIG. 8 is a flowchart showing an example of a combination of apparatuses when manufacturing a laminate of a multilayer electronic component.

[Explanation of symbols]

 S laminated electronic component F outer periphery of metal plate p conductive layer pattern 1 base sheet 2 conductive paste or conductive layer 3x, 3y cutting mark 4 internal electrode 5 dielectric 6 external electrode 10 printing device 11 plate 12 ink supply unit 20 transfer Jig 21 Metal plate 22 Base 23 Positioning recess 24 Transfer table 25 Heater 26 Cooling pipe 27 Elevating device 30 Laminating jig 31 Frame 32 Cavity 33 Sheet receiving part plate 34 Elevating device 40 Base sheet feeder 41 Base remaining base Sheet winding device

Claims (4)

[Claims] 1. An internal electrode is formed by printing and drying a conductive paste on a base sheet that becomes a ceramic by firing, a plurality of base sheets on which the internal electrode is formed are laminated, pressed, and cut. After firing, in a method of manufacturing a laminated electronic component for forming an external electrode, a conductive paste is printed on a metal plate surface different from the base sheet by a first plate pattern, and a solvent or the like is removed by heating to form a dry conductive layer. And transferring the metal disc to the base of the transfer jig, fixing the metal disc in a predetermined position, and drying the metal disc with a laminating jig having a female cavity capable of being punched out as a male mold. A base sheet is supplied between the metal plate having the conductive layer formed thereon and the metal plate is brought into contact with the base sheet.
At the same time as transferring the dry conductive layer to the base sheet by applying pressure, the metal plate is housed while extracting the base sheet into the cavity of the laminating jig, and this is used as the first layer. With the pattern, the pattern shape and arrangement are the same, in the state printed on the metal plate, by the second plate pattern imposed in a state shifted to the electrode forming side when the first plate pattern and the final product, The conductive paste is printed on a metal plate, a solvent and the like are removed by heating to form a dry conductive layer, and the dry conductive layer formed by the second plate pattern is transferred to the base sheet and laminated at the same time as described above. The jig is housed while being pulled out in the cavity, and is stacked on the first layer in the cavity to form a second layer.
By drying, transferring and punching, a third layer is laminated in the cavity, and then printed again in the second plate pattern in the same manner, and laminated as a fourth layer in the cavity. A method for manufacturing a laminated electronic component, comprising: forming a laminate by alternately laminating base sheets printed with a pattern and a second plate pattern in a cavity of a laminating jig. 2. A means for supplying a base sheet, a metal disc different from the base sheet, a printing means for printing a conductive paste on the metal disc, and fixing the metal disc in a predetermined position. While transferring the conductive layer provided on the base sheet, a transfer means for punching the base sheet to a predetermined size by the laminating jig and the metal plate, and the punching is performed together with the transfer means, the punched base sheet A manufacturing apparatus comprising a laminating unit for laminating, wherein the printing unit is a printing device including a conductive paste supply unit and a plate for printing on the metal plate in a predetermined pattern, the drying unit and The transfer unit is a transfer device including a metal plate and a transfer jig base, and the metal plate has an outer edge that can be inserted into a cavity of the stacking jig.
The transfer jig base has a function of fixing the metal disc at a predetermined position, and an apparatus that can move up and down so that the metal disc can be inserted into the cavity of the stacking jig. The stacking jig and the transfer device have a structure capable of punching, and the cavity receiving portion of the stacking jig is capable of moving up and down depending on the number of sheets to be punched and stacked. Manufacturing equipment for laminated electronic components. 3. An apparatus for manufacturing a multilayer electronic component according to claim 2, wherein at least two units of said printing apparatus are incorporated in said stacking jig. 4. The method according to claim 1, wherein the metal plate or the base of the transfer jig is heated and heated.
4. The apparatus for manufacturing a multilayer electronic component according to claim 2, wherein a cooling device is incorporated.