JPH11238767A - Aligner for wafer and contactor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable quick and accurate alignment of all contactors of a contact body for inspection and wafer electrodes corresponding to them. SOLUTION: This aligner has a first camera 28 for picking up the image of a contactor 50 on the aligner main body, a moving body provided with a wafer mounting body 40, a driving mechanism 23 for moving the moving body in the X, Y, Z and θ directions, a controller for controlling the movement distance of the moving body in each direction, a second camera 31 to pickup up the image of the wafer W on the moving body, and a memory for storing imaging position data received from both the cameras 28 and 31. Based on the positions obtained from both cameras, bumps and electrode pads are made to coincide with each other by the controller.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for aligning a wafer and a contact, and more particularly, to a plurality of electrode pads of a plurality of chips formed on the entire surface of a semiconductor wafer and an inspection device corresponding to each of these electrode pads. The present invention relates to a wafer and contact positioning device that positions each of the contacts and each of the electrode pads when a plurality of contacts formed on the contact body are brought into contact collectively.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, a large number of IC chips are formed on a surface of a semiconductor wafer (hereinafter, referred to as "wafer"), and then various electrical tests are performed on each IC chip in a wafer state. There is a process. Non-defective products in the wafer are selected by this inspection process, and only non-defective products are sent to an assembling process or the like, which is a subsequent process, thereby improving the yield as a semiconductor device product. In this inspection step, the electrode pads of the individual IC chips and the probe needles of the probe card are sequentially contacted to inspect each IC chip, and the electrode pads of all the IC chips on the wafer and the inspection corresponding to these electrode pads are performed. A plurality of contacts (hereinafter, referred to as "bumps") of a contact body for use (hereinafter, referred to as "contactor") are collectively brought into contact with each other to collectively inspect all IC chips.

When performing a batch inspection of a wafer, a contactor and a wafer are arranged so as to face each other, and a plurality of bumps serving as a reference for the contactor and corresponding electrode pads serving as a reference for the wafer are visually checked. Positioning is performed sequentially (hereinafter, referred to as “alignment”), and the two are brought into contact at once when they are aligned. Then, after the contactor and the wafer are brought into contact all at once, the inspection is performed using a predetermined inspection device to select non-defective chips in the wafer.

[0004]

However, in the prior art, since the bumps of the contactor and the electrode pads of the wafer are visually aligned, the operator is required to align the reference bumps with the corresponding electrode pads. There is a problem that a long time is spent for the work, the work efficiency is poor, a great load is imposed on the operator, and there is an individual difference in alignment accuracy, and it is difficult to obtain a stable contact state.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has been made in view of the above-mentioned problems. The present invention has been made in view of the above-mentioned circumstances. It is an object to provide a child positioning device.

[0006]

According to a first aspect of the present invention, there is provided an apparatus for aligning a wafer and a contact, comprising: a plurality of electrodes corresponding to all chips formed on the entire surface of a semiconductor wafer; And a device for aligning each of said contacts and each of said electrodes corresponding thereto when a plurality of contacts formed on said contact body for inspection are brought into contact collectively. A first imaging unit for imaging the contact body for inspection arranged in the above, a moving body on which the imaging unit is fixed and a wafer mounting body on which the semiconductor wafer is mounted, and X, Driving means for moving in the Y, Z and θ directions, control means for controlling the amount of movement of the moving body in each direction by the driving means, and a semiconductor wafer on the moving body moving under the control of the control means A second imaging unit for imaging the , And a storage means for storing the imaging position by the second imaging means, the position as well as imaging the contacts stored in the storage means by the first photographing means,
And imaging the electrode corresponding to the contact by the second imaging unit and storing the position of the electrode in the storage unit;
The position of the contact and the electrode are adjusted by the control means based on the positions of the two.

According to a second aspect of the present invention, there is provided an apparatus for aligning a wafer and a contact according to the first aspect of the present invention, wherein the inspection contact body is detachable from the apparatus main body. The wafer mounting body is housed in a container, and the wafer mounting body is detachably mounted on the moving body, and the wafer mounting body has suction means for the inspection contact body. is there.

According to a third aspect of the present invention, there is provided an apparatus for aligning a wafer and a contact according to the second aspect of the present invention, wherein the transfer container, the inspection contact body, and the wafer mounting body are provided. A transport device for transporting each is provided adjacent to the device main body, the transport device includes a first lifting mechanism for lifting and lowering a plurality of transport containers, a second lifting mechanism for lifting and lowering a plurality of contactors for inspection, A third lifting mechanism for lifting and lowering the wafer mounting body, a contact body loading mechanism for loading the inspection contact body into the transfer container, and transferring the wafer mounting body from the third lifting mechanism to the moving body. And a mounting body transfer mechanism.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. A device for aligning a wafer and a contact according to the present embodiment (hereinafter, simply referred to as an “alignment device”), for example, as shown in FIG.
(Hereinafter simply referred to as “apparatus main body”) 10 for performing alignment of the wafer, and a wafer mounting body 40 adjacent to the apparatus main body 10 and attached to the apparatus main body 10.
And a transfer device 60 for transferring the contactor 50.

As shown in FIGS. 1 and 2, the apparatus main body 10 transports the cassette mounting portion 11 for mounting the wafers W stored in the cassette C and the wafers W in the cassette mounting portion 11. Loader unit 13 including tweezers 12
And an alignment unit 14 for aligning the wafer W transferred via the tweezers 12 of the loader unit 13.
And a controller 15 for controlling the alignment unit 14, the loader unit 13 and the transport device 60 according to a predetermined program, and a display device 16 which also functions as an operation panel for operating the controller 15.

The loader section 13 is provided with a sub-chuck 17 for pre-aligning the wafer W with reference to the orientation flat (hereinafter referred to as "pre-alignment"). Accordingly, the tweezers 12 transports the wafer W from the cassette C in the loader unit 13 and
After pre-aligning the wafer W, the wafer W is transferred to the alignment unit 14. The alignment unit 14 includes a moving body 18 movable in the X, Y, Z, and θ directions, and a wafer mounting body 4 on the moving body 18.
And an alignment mechanism 19 for aligning the wafer W placed on the wafer W via the wafer W. Then, the wafer mounting body 40 is fixed on the moving body 18 by means such as vacuum suction in a state where the wafer W transferred from the tweezers 12 is stored as described later.

As shown in FIGS. 2 and 3, the moving body 18 is a main chuck 20 on which a wafer mounting body 40 is installed.
And an X table 21 that supports the main chuck 20 and moves in the X direction, and a Y table 22 that supports the X table 21 and moves in the Y direction. It is. Drive mechanism 23
As shown in FIG. 4, an X-direction drive mechanism 25 for driving the X table 21, a Y-direction drive mechanism 26 for driving the Y table 22, and a lifting / lowering rotation mechanism ( (Not shown)).
The main chuck 20 has three pins 20A (see FIG. 5B) which can be moved up and down. The pins 20A are conveyed by the tweezers 12 in a state where the pins 20A protrude upward from the upper surface of the main chuck 20. The transferred wafer W is delivered.

The X-direction drive mechanism 25 includes a guide rail 25A that is engaged with the X table 21 and extends in the X direction.
A ball screw 25B that moves the X table 21 according to the guide rail 25A, and an X that drives the ball screw 25B
A motor (not shown) is provided, and the amount of movement of the X table 21 is detected by an encoder (not shown). The Y-direction drive mechanism 26 includes a guide rail 26A, a ball screw 26B, and a Y motor 26C configured similarly to the X-direction drive mechanism 25, and detects the amount of movement of the Y table 22 by the encoder 26D. Also,
The main chuck 20 has a built-in Z-direction drive mechanism (not shown) for moving it in the Z-direction and a rotation mechanism (not shown) for rotating it in the θ-direction.

Further, as shown in FIG.
A fixed plate 27 extends in the horizontal direction on the 0 peripheral surface, and a first imaging unit (hereinafter, referred to as a “first camera”) including a CCD camera capable of switching between high magnification and low magnification on the fixed plate 27. ) 28, the contactor 50 is photographed by the first camera 28 at a low magnification over a wide area of the contactor 50, or the contactor 50 is photographed at a high magnification by the first camera 28, and the respective images are displayed on the display device 16. Is displayed on the display screen 16A. Further, a target 30 that is orthogonal to the optical axis of the first camera 28 and that focuses on the fixed plate 27 is provided on the fixed plate 27. The target 30 moves forward and backward with respect to the focal position of the first camera 28. is there. The target 30 is composed of, for example, a glass plate and a metal thin film having a diameter of 140 μ deposited on the surface thereof. The metal thin film is used as a reference pattern for image recognition by the first camera 28, and the target 30 at the position is set as the focal plane. It is.

Further, as shown in FIG.
4, an alignment bridge 19A constituting the alignment mechanism 19 is provided.
9A moves between the moving body 18 and the contactor 50 according to, for example, a guide rail 19B extending in the X direction. The alignment bridge 19A includes a second camera such as a CCD camera capable of switching between high magnification and low magnification.
An imaging unit (hereinafter, referred to as a “second camera”) 31 is provided. The second camera 31 images the wafer W on the wafer mounting body 40 at a low magnification or a high magnification, and displays each image. 16 are displayed on the display screen 16A. The focal plane of the second camera 31 is the first camera 28.
In the same manner as described above, the target 30 can be obtained by image recognition of the metal thin film. The alignment mechanism 19 is an alignment mechanism including the first camera 28, the target 30, and the like in addition to the alignment bridge 19A and the second camera 31.

On the other hand, the transfer device 60 is, for example, shown in FIGS.
As shown in FIG. 3, a device for transporting a transport container (hereinafter, referred to as a “transfer cassette”) 70, a contactor 50, and a wafer mounting body 40, respectively, is a first device for raising and lowering a plurality of transport cassettes 70. It includes an elevating mechanism 61, a second elevating mechanism (not shown) for elevating the plurality of contactors 50, and a third elevating mechanism (not shown) for elevating the plurality of wafer mounting bodies 40. Further, the transfer device 60 includes a contact body loading mechanism for loading and storing the contactor 50 into the transfer cassette 70 and a mounting mechanism for transferring the wafer mounting body 40 from the third lifting / lowering mechanism onto the main chuck 20. A body transfer mechanism is provided. In the present embodiment, the contact body loading mechanism and the mounted body transfer mechanism use one transport mechanism 62 in combination. An opening is formed in the lower surface of the transfer cassette 70, and the wafer mounting body 40 comes into contact with the contactor 50 in the transfer cassette 70 through this opening.

The first lifting mechanism 61 is, for example, a conventionally known lifting mechanism as shown in FIG. 2, and includes a support 61A for supporting the transport cassette 70, a ball screw 61B for raising and lowering the support 61A, and a ball screw 61B. And a motor 61D for driving the rotation through a gear train 61C,
The transport cassette 70 on the support table 61A is moved up and down via a ball screw 61B rotated by a motor 61D. Although the second and third lifting mechanisms are not shown,
These drive mechanisms are configured similarly to the first drive mechanism 61. Further, as shown in FIG. 3, for example, the transfer mechanism 62 mainly includes an articulated arm 62B pivotally supported by a support post 62A, and a contactor on the second lifting mechanism using the articulated arm 62. 50 one by one
The wafer is loaded into the transfer cassette 70 on the elevating mechanism 61 and the wafer mounting body 40 is transferred from the third elevating mechanism onto the main chuck 20 in the apparatus body 10. The support post 62A expands and contracts in the Z direction, and the articulated arm 62B
Is moved in the Z direction. In FIG. 1, the wafer mounting body 40, the transfer cassette 70 and the contactor 5
Although all 0s are represented as being stacked, a plurality of them are actually stored in each dedicated container with a predetermined gap in the vertical direction.

The transport device 60 is provided with a cassette loading / unloading mechanism (not shown) for loading the transport cassette 70 into the center of the head plate of the apparatus main body 10 and unloading the cassette therefrom. The transfer cassette 70 in which the contactor 50 is stored by the transfer mechanism is loaded into the opening in the center of the head plate of the apparatus main body 10, where the contactor 50 in the transfer cassette 70 and the wafer W are integrated. The lifting mechanism 61 is returned to its original position in the dedicated container. The cassette loading / unloading mechanism is configured to reciprocate the transport cassette 70 via a guide rail, for example.

Incidentally, the wafer mounting body 40 is shown in FIG.
As shown in (a), the main body 41 is formed in a disk shape, and the contactor 50 is sucked and integrated with the aligned wafer W stored therein. As shown in FIGS. 3A and 3B, a gas gas flow path 41A is formed in the main body 41, and a gas flow passage 41A is provided at an inlet (opened on the peripheral surface of the main body) of the flow path 41A. The supply pipe 42 is connected. A gas discharge pipe 43 is connected to the outlet (opened adjacent to the inlet on the peripheral surface of the main body), and a predetermined gas (a chemically inert gas, for example, Nitrogen gas). Further, two concentric ring grooves 41B and 41C smaller than the outer diameter of the wafer W are formed on the upper surface of the main body 41, respectively, and these ring grooves 41B and 41C communicate with an opening communicating with the gas flow path 41A (see FIG. (Not shown) are formed at a plurality of locations. By supplying an inert gas from the gas supply pipe 42 and discharging the gas from the gas discharge pipe 43, these ring grooves 41B, 41C
The ring grooves 41B and 41C are depressurized through the openings of the wafer W, and the wafer W is vacuum-sucked on the upper surface of the main body 41. As shown in FIG. 3C, an O-ring 44 made of a flexible elastic member such as silicon rubber is attached to the outer peripheral edge of the upper surface of the main body 41 over the entire circumference, and the wafer W is attached to the main body 41. When the wafer mounting body 40 is
The contactor 50 is brought into contact with the contactor 50 via the ring 44 while maintaining airtightness. Therefore, the contactor 50
When the wafer mounting body 40 is in close contact with the
By creating a decompressed state by an inert gas between the two via the gas discharge pipe 43, the two 50 and 40 are integrated. Further, instead of the O-ring 44, the sealing projection 41 is formed over the entire outer periphery of the upper surface of the main body 41.
F is formed integrally with the main body 41, and the sealing projections 41 are formed.
The function corresponding to the O-ring 44 can be provided by F.

Also, the ring grooves 41B, 4
Between 1C, a through hole through which three pins 20A mounted on the main chuck 20 pass is formed. The lower through hole 41D of the gas flow passage 41A is formed to have a slightly larger diameter than the outer diameter of the pin 20A, and the upper through hole 41E of the gas flow passage 41A is formed to be considerably larger than the outer diameter of the pin 20A. I have. A silicone rubber film 45 is screwed into the large through-hole 41E via a packing 46, and an O-ring 47 is mounted on the outer periphery of the upper surface of the packing 46. The silicone rubber film 45 and the O-ring 47 provide a gas flow path. The inside of 41A is kept airtight. The silicon rubber film 45 has a cylindrical shape formed in the center thereof, and a cap 48 in which the pin 20A is fitted is housed in the cylindrical portion. The cap 48 covers the upper portion of the pin 20A when the pin 20A protrudes, so that the silicon rubber film 45 is not damaged. Therefore, when the wafer W is transferred between the tweezers 12 and the wafer mounting table 40, when the three pins 20A of the main chuck 20 are raised and penetrate the through holes 41D of the wafer mounting body 40, the pins 20A are closed by caps. 48, and in this state, protrudes from the upper surface of the main body 41 through the through hole 41E as shown by a virtual line in FIG. 5B.

The contactor 50 has a substrate formed of a material (eg, quartz glass) having a thermal expansion coefficient substantially equal to that of the wafer W, a plurality of layers of wiring formed on the substrate, and connected to each wiring. It consists of bumps 51.
The bumps 51 are formed of, for example, gold or a gold-plated material having excellent conductivity, and the wiring is formed of, for example, aluminum or another material having excellent conductivity.

The controller 15 includes a central processing unit 32, an image processing unit 33, a memory 34, and a motor control unit 35, as shown in FIG. 6, for example. The driving of the second and third driving mechanisms is controlled. The central processing unit 32 controls the motor of the drive mechanism 22 by transmitting a control signal to the motor control unit 35 in accordance with, for example, a program registered in the memory 34, or receives a pulse signal from the encoder to generate X,
The amount of movement in the Y, Z, and θ directions is calculated,
Is calculated, and data such as a calculation result is registered in the memory 34. The image processing unit 33 receives the imaging signals of the first and second imaging units 28 and 31 and performs image processing, displays the processed image on the display screen 16A as a captured image, or registers the processed image in the image memory as image data. Or compare the image data already registered in the image memory with the captured image, or use the first and second
It is determined whether or not the images picked up by the image pickup means 28 and 31 are in focus.

Next, a method of collectively aligning the contactor 50 and the wafer W using the present alignment apparatus will be described with reference to FIGS. In the alignment method using this alignment apparatus, under the control of the controller, for example, as shown in FIGS. 7A and 7B, predetermined IC chips T _{1 to} T ₅ of the wafer W in the alignment unit 14 are determined. Are sequentially aligned with the corresponding bumps 51 of the contactor 50, and then the contactor 50 and the wafer W are brought into contact at once. Hereinafter, the alignment method will be specifically described.

First, the wafer mounting body 40 and the contactor 50 are set at predetermined positions of the alignment section 14 of the alignment apparatus main body 10 using the transfer device 60 driven according to a predetermined program under the control of the controller 15.
For example, the first lifting mechanism 51 and the second lifting mechanism are driven,
When the contactor 50 and the transfer cassette 70 in which the contactor 50 is to be stored are adjusted to the height of the articulated arm 62B of the transfer mechanism 62, the transfer mechanism 62 is driven and the contactor 50 is taken out of the dedicated container by the articulated arm 62B.
It is stored in the transfer cassette 70. Then, the cassette loading / unloading mechanism is driven to transfer the transport cassette 70 to the transport device 60.
Is brought into the opening of the head plate of the alignment unit 14 and stopped there.
Installed in While the transport cassette 70 is being loaded into the apparatus main body 10, the third lifting mechanism and the transport mechanism 62 are driven,
The wafer mounting body 40 is adjusted to the height of the articulated arm 62B, and the wafer mounting body 40 in the dedicated container is transferred from the transfer device 60 to the moving body 18 in the alignment unit 14. Three pins 20 </ b> A protrude from the main chuck 20 of the moving body 18, and the wafer mounting body 40 is fixed on the main chuck 20 by vacuum suction using the pins 20 </ b> A as guide members.

On the other hand, in the loader section 13 of the apparatus main body 10 driven according to a predetermined program under the control of the controller 15 in parallel with the above operation, the transfer of the wafer W from the cassette mounting section 11 to the alignment section 14 is performed. Will be That is, the tweezers 12 are driven in the loader section 13, and the
As shown in (1), the tweezers 12 are inserted into the cassette C of the cassette mounting portion 11, the wafer W is held by the tweezers 12 by vacuum suction, and the wafer W is removed from the cassette C.
Out. After that, the wafer W is transferred onto the sub chuck 17 and pre-alignment of the wafer W is performed by the sub chuck 17. After pre-alignment, tweezers 12
Receives the wafer W from the sub chuck 17 and transports the wafer W to the alignment unit 14, and the wafer mounting body 40 on the main chuck 20 already waiting in the alignment unit 14
Give it up.

Before the wafer W is delivered, the alignment unit 14 drives the drive mechanism 2 as shown in FIG.
3 causes the first camera 2 to move.
8 moves to below the contactor 50, and further, the bump 5
The first camera 28 rises through the main chuck 20 to a position where 1 coincides with the focal plane of the first camera 28, and recognizes an arbitrary bump 51 at a low magnification. Then, for example, the first camera 28 is moved downward of the contactor 50, advance in the memory 3 the corner portion of the electrode pad P ₁ of the IC chip T ₁ that is registered in the contactor 50 (Fig. 7 (a), (b) The first camera 28 confirms and shoots the bumps 51 corresponding to (see), and moves the main chuck 20 to align the picked-up image with the + mark written in the center of the display screen 16A. The central processing unit 32 calculates the bumps 51 based on the pulse signal of the encoder corresponding to the movement amount of the main chuck 20 at that time, obtains the position coordinates (X ₁ , Y ₁ , Z ₁ ), and determines the position coordinates as the center. The memory 34 via the processing unit 32
Register with. Then, the position coordinates (X ₂ of the first camera 28 is sequentially moved to below the four bumps 51 corresponding to the IC chip T ₂ through T ₅ of the other four locations in the counterclockwise direction, each of the bumps 51, Y ₂ , Z ₂ ), (X ₃ , Y ₃ , Z ₃ ),
(X ₄ , Y ₄ , Z ₄ ) and (X ₅ , Y ₅ , Z ₅ ) are sequentially obtained in the same manner as described above, and these position coordinates are registered in the memory 34 via the central processing unit 32.

Next, the optical axes of the first and second cameras 28 and 31 are made to coincide as shown in FIG. 8B, and their reference positions are obtained. That is, after placing the wafer W on the wafer mounting body 40 on the main chuck 20 in the alignment unit 14 by the tweezers 12 from the loader unit 13, the alignment bridge 19A moves in the area between the main chuck 20 and the contactor 50. To stop at a certain position (probe center) below the contactor 50. And target 3
0 advances above the first camera 28, and the first camera 28 is focused on the center of the target 30 to recognize the metal thin film, and the second camera 31 is focused on the center of the target 30 to recognize the metal thin film. Upon recognition, the optical axes of the first and second cameras 28 and 31 match. At this time, reference position coordinates (X ₀ , Y ₀ , Z ₀ ) of the intersection of the focal plane and the optical axis are calculated from the position of the main chuck 20, and the calculated value is registered in the memory 34. By detecting the amount of movement of the first camera 28 via the encoder at this time, the positional relationship between the position coordinates of the bumps 51 and the reference coordinates can be obtained on the coordinates.

Thereafter, the center and the diameter of the wafer W are obtained by using the second camera 31. That is, the target 30 is the first
After retreating from the focal plane of the camera 28, the main chuck 20 is moved by the drive mechanism 23, and during this movement, for example, three end points of the wafer W are detected by the second camera 31, and based on the detection result, The central processing unit 32 calculates the center and the diameter of the wafer W based on the moving distance of the moving body 18, and registers the calculated values in the memory 34. Continue the second
The camera 31 looks at the scribe line of the wafer W at a low magnification, and rotates the X and Y axes of the wafer W in the θ direction to match the X and Y axes of the X and Y tables 20 and 25. As a result, the IC chips T on the wafer W are aligned with the index feed direction.

Further, when the main chuck 20 is moved by the drive mechanism 23, the second camera 31 recognizes the image of the wafer W on the main chuck 20 at a low magnification, and the image processing unit 33 registers the captured image in advance. It is compared with a chip image having a characteristic for use, and a matching chip image is searched for. When a matching chip image is found, the second camera 31 is switched to a high magnification and the enlarged chip image is compared with a previously registered characteristic chip image (see FIGS. 7A and 7B). A chip image to be searched is found, and the image is registered in the image processing unit 33 as an image of the bumps 51 for alignment. When a matching chip image is found, the wafer W is moved in the middle, upward, downward, left, and right directions by an integral multiple of the chip size known in advance from the image, and the wafer W is moved by the second camera 31 during this movement.
The image processing unit 33 compares the chip image having a characteristic registered in advance with the image processing unit 33, sequentially captures the matching chip images and registers them in the image processing unit 33, and obtains each IC from the coordinate value of the main chuck 20 at that time. The moving distance and θ of the chips T _{1 to} T ₅ in the X and Y directions of the wafer W are calculated by the central processing unit 32 and registered in the memory 34.

After the position coordinates of the five bumps 51 of the contactor 50 and the position coordinates of the five electrode pads P are obtained as described above, the position coordinate values (X, Y) of the five bumps 51 in the X and Y directions are obtained. , Y) and the position coordinates (X, Y) in the X and Y directions of the five electrode pads P are moved in the horizontal direction. That is, the position coordinates (X, Y) of the five bumps 51 and the position coordinates (X, Y) of the five IC chips T
Y), the central processing unit 32 calculates a horizontal distance between the two, and transmits a control signal based on the calculated value from the central processing unit 32 to the motor control unit 35.
The moving body 18 is moved in the horizontal direction by controlling the driving of the driving mechanism 23 through the IC, and the five IC chips T and the contactor 50 are moved.
The drive mechanism 23 is stopped at a position where the respective position coordinates of the vertical direction coincide with each other.

Further, the central processing unit 32 calculates a value of 5 from the coordinate value of the contactor 50 in the Z direction and the coordinate value of the IC chip T in the Z direction.
The height at which the bumps 51 contact the five electrode pads P is calculated, and a control signal based on the calculated value is sent to the central processing unit 3.
2 to the motor control unit 35, and drives and controls the drive mechanism 23 via the motor control unit 35 to
Is moved upward, and each electrode pad P of the five IC chips T is brought into contact with the corresponding bump 51. When the electrode pad P and the bump 51 are securely in electrical contact,
All the bumps 51 of the contactor 50 come in contact with the corresponding electrode pads P of the wafer W at the same time, and the wafer W is sealed between the wafer mounting body 40 and the contactor 50 by the O-ring 44.

When the wafer W and the contactor 50 come into contact at once, nitrogen gas is supplied from the gas supply pipe 42 of the wafer mounting body 40, and the wafer mounting body 40 and the contactor 50 are contacted.
The gas discharge pipe 4 while the sealed space between
When the nitrogen gas is evacuated from 3, the space between the wafer mounting body 40 and the contactor 50 is reduced in pressure of the nitrogen gas.
In this state, when the valves (not shown) of the pipes 42 and 43 are closed, the contactor 50 is adsorbed to the wafer mounting body 40 while the electrode pads P and the bumps 51 are in contact with each other, and the two 50 and 40 are integrated. . Thereafter, the cassette loading / unloading mechanism is driven, and the integrated wafer mounting body 40 and contactor 50 are transported from the apparatus main body 10 to the original position of the transporting device 60 together with the transporting case 70, and the wafer W and the contactor 50 are brought into contact at once. To end. Next, the remaining wafer mounting body 40, contactor 50, and wafer W are sequentially transported into the alignment unit 14 as described above, and the same alignment and batch contact operation are repeated. When the integration operation of all the wafer mounting bodies 40 and the contactors 50 is completed, these are transported to a predetermined inspection device, and a predetermined inspection is performed by the inspection device.

As described above, according to the present embodiment,
A first camera 28 for picking up an image of each bump 51 of a contactor 50 detachably arranged on a head plate of the alignment apparatus main body 10 and a wafer mounting body 40 to which the first camera 28 is fixed and on which a wafer W is mounted are installed. Moving body 1
8, a driving mechanism 23 for moving the moving body 18 in the X, Y, Z, and θ directions;
Controller 1 for controlling the amount of movement in the Y, Z and θ directions
5 and a moving body 18 that moves under the control of the controller 15
Second camera 3 for imaging each electrode pad P of upper wafer W
1 and a memory 34 for storing image pickup positions by the first and second cameras 28 and 31. The first camera 28 sequentially picks up images of five bumps 51 dispersed at predetermined positions on the wafer W, and The position coordinates of the bumps 51 are stored in the memory 34, and the electrode pads P corresponding to the bumps 51 are imaged by the second camera 31, and the position coordinates of these electrodes P are stored in the memory 34, respectively. The central processing unit 32 sequentially calculates and aligns the movement amount of the moving body 18 up to the position where they coincide with each other based on the data stored in the memory 34 of the position coordinates of the two 51 and P corresponding to each other. Can be quickly and accurately aligned with the corresponding bumps 51 and the electrode pads P of the wafer W corresponding thereto. It can be reliably contacted collectively these both 51, P.

The contactor 50 is housed in a transfer cassette 70 that can be attached to and detached from the apparatus main body 10, and the wafer mounting body 40 is attached to the main chuck 2 of the moving body 18.
0 and is detachably mounted on the wafer mounting body 4
0 is a suction means for the contactor 50 (the gas flow path 41
A, a gas supply pipe 42, a gas discharge pipe 43, a seal ring 44, etc.), so that the wafer W and the contactor 50 are brought into contact at once and integrated, and then the transfer cassette 70 is moved to a predetermined inspection step. It can be transported while stored inside.

Further, a transfer device 60 for transferring the transfer cassette 70, the contactor 50, and the wafer mounting member 40, respectively, is provided adjacent to the alignment device main body 10,
The transfer device 60 includes a first lift mechanism 61 that lifts and lowers the plurality of transfer cassettes 70, a second lift mechanism that lifts and lowers the plurality of contactors 50, and a third lift mechanism that lifts and lowers the plurality of wafer mounting bodies 40. And a transfer mechanism 62 for transferring the contactor 50 into the transfer cassette 70 and transferring the wafer mounting body 40 from the third elevating mechanism to the main chuck 20 of the moving body 18. Can be automatically and sequentially aligned.

The above-described embodiment is merely an example of the present invention, and the mechanism for transporting the wafer W, the wafer mounting body 40, and the like can be appropriately designed as needed. The structure can be appropriately designed as needed.

[0037]

According to the first aspect of the present invention, all the contacts of the contact body for inspection and the corresponding electrodes of the wafer can be quickly and accurately aligned with the wafer. A child alignment device can be provided.

According to the second aspect of the present invention, in the first aspect of the present invention, the semiconductor wafer after the alignment and the inspection contact body are integrated into a predetermined inspection step. It is possible to provide a device for aligning a wafer and a contact that can be transferred.

According to a third aspect of the present invention, in the second aspect of the invention, a plurality of semiconductor wafers and a wafer mounting body can be sequentially and automatically aligned. And a contact positioning device can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an entire alignment apparatus according to an embodiment of the present invention.

FIG. 2 is a front view showing the inside of the alignment apparatus shown in FIG.

FIG. 3 is a plan view showing the inside of the alignment apparatus shown in FIG. 1;

FIG. 4 is a perspective view mainly showing a moving body and a driving mechanism of the alignment apparatus shown in FIG. 1;

5A and 5B are enlarged views of the wafer mounting body shown in FIGS. 1 to 4, wherein FIG. 5A is a perspective view thereof, FIG. 5B is a cross-sectional view showing a part of FIG. (c) is a diagram showing a cross section of the seal structure shown in (a), and (d) is a diagram showing a cross section of a seal structure of another embodiment.

FIG. 6 is a block diagram showing a control system of the alignment apparatus shown in FIG.

FIGS. 7A and 7B are views showing a wafer, in which FIG. 7A is a layout view of chips mainly showing alignment chips, and FIG. 7B is an enlarged plan view of one of the chips shown in FIG.

FIGS. 8A, 8B, and 8C are explanatory views for explaining a positioning operation of a bump between a wafer and a contactor.

[Explanation of symbols]

Reference Signs List 10 alignment apparatus main body 15 controller (control means) 18 moving body 23 drive mechanism (drive means) in X, Y, Z and θ directions 28 first camera (first imaging means) 31 second camera (second imaging means) 32 Memory 40 Wafer mounting member 41A Gas flow path 42 Gas supply pipe (adsorption means) 43 Gas discharge pipe (adsorption means) 44 Seal ring (adsorption means) 50 Contactor (contact for inspection) 60 Transfer device 61 First lifting mechanism 62 Transport mechanism (contact body loading mechanism) 70 Transport cassette (transport container, mounting body transfer mechanism) W Wafer

Claims (3)

[Claims] When a plurality of electrodes corresponding to all chips formed on the entire surface of a semiconductor wafer and a plurality of contacts formed on a contact body for inspection corresponding to these electrodes are collectively brought into contact with each other. A device for aligning each of the contacts and each of the electrodes corresponding thereto, wherein a first imaging means for imaging the contact body for inspection arranged at an upper part of the device body;
A moving body on which the imaging means is fixed and on which a wafer mounting body for mounting the semiconductor wafer is mounted; a driving means for moving the moving body in X, Y, Z and θ directions; Control means for controlling the amount of movement of the moving body in each direction; second imaging means for imaging a semiconductor wafer on the moving body moving under the control of the control means;
Storage means for storing an imaging position of the second imaging means, wherein the first imaging means images the contact and stores the position in the storage means, and stores the electrode corresponding to the contact in a second position. (2) The position of the wafer and the contact, wherein the image is taken by the imaging means and the position is stored in the storage means, and the contact and the electrode are aligned by the control means based on the positions of the two. Matching device. 2. The inspection contact body is housed in a transfer container detachable from the apparatus main body, and the wafer mounting body is detachably mounted on the moving body.
2. The apparatus according to claim 1, wherein the wafer mounting body has a suction unit for the inspection contact body. 3. A transfer device for transferring the transfer container, the inspection contact body, and the wafer mounting member, respectively, is provided adjacent to the apparatus main body, and the transfer device raises and lowers the plurality of transfer containers. A first elevating mechanism, a second elevating mechanism for elevating and lowering the plurality of inspection contact bodies, a third elevating mechanism for elevating and lowering the plurality of wafer mounting bodies, and a contact body for carrying the inspection contact body into the transport container. 3. The wafer according to claim 2, further comprising: a loading mechanism; and a mounting body transfer mechanism configured to transfer the wafer mounting body from the third elevating mechanism onto the moving body. Contact positioning device.